Printed Circuit Design & Fab - February 2008 - (Page 35)

OPTICAL INTERCONNECT and crossovers to redirect the normally parallel arrays. Coupling with I/O mirrors for out-of-plane component interfaces from above or below, as has been demonstrated with top-surface or flip-chip interfaces respectively. 5. Other optical interconnection systems. Combinations of 1 through 4 taken separately can be used for a number of polymer waveguide optical interconnection applications. These include separately packaged optically interfaced transmitters, stand-alone functional components, optical sensor read heads, and biosensors. In addition, custom or conventional ferrule-based connection options are allowing interface fiber shuffles and fiber distribution harnesses to connect to boards or components. ■ Board Level Polymer Waveguide Creation Versatile and practical interconnection solutions are achievable with optical polymer waveguide technologies that incorporate the distribution requirements summarized previously. In particular, practical cost-effective optical interconnections can and are being created using generic procedures including the applications noted below. ■ Waveguide design layouts for parallel links and/or functionality are created using waveguide design software such as R-Soft. These designs are then reduced to instructions to write high quality photolithographic masks. ■ Polymer material and related constituent synthesis, purification, mixing/dissolution, filtration, coating, solvent removal and any materials preparation required for raw materials and film preparation. This provides material with the lowest optical loss to expose/process waveguides. Using appropriate process technology, waveguides are created with protective layers in self-supporting film sheets. We believe this is the preferred practical route to produce useful interconnects, as opposed to creating the waveguides on substrates for final application. ■ Precise micromachining of the film sheets, typically by using excimer laser-based high-precision computer workstation micromachining with sub-micron resolution. The laser is used to separate the large number of imaged parts after exposure, and to precisely and reproducibly locate the waveguide array links and functional devices within each film structure. This would allow connectors and optical interfaces to be configured in large numbers. Out-of-plane reflective mirrors can also be created and metallized as needed. ■ After all of the connections and interfaces are assembled, the links or devices are fully evaluated to assure high-quality performance before installation on the final substrates or in the package. Constructing prefabricated, self-supporting guides reduces the potential for high-value yield losses. If waveguides are alternatively created directly on the high value substrate, a defective waveguide would necessitate rework and/or the possibility of scrapping an entire high-value board. ■ Final assembly of the optical and electronic components and full quality verification. This generic procedural sequence to waveguide creation provides a useful understanding of a practical and cost effective route ■ The Revolution is Here. TM Digital Solder Mask Printing System Printar’s revolutionary GreenJet is a one-step digital solder mask printing system that completely replaces conventional coating, drying, exposure and development processes. Reduce Waste with GreenJet Selectively apply solder mask with proprietary coating technology Keep pads and via holes free of solder mask Stop coating non-functional areas between PCBs and panel borders Printar is the only company exclusively dedicated to providing digital printing technologies for the PCB industry. Our Single Focus, Your Single Best Choice! Headquarters: Printar Ltd. | 5 Oppenheimer St., P.O. Box 292, Rehovot 76100, Israel. | Tel: +972-8-9313999 | Fax: +972-8-9316771 | Email: info@printar.com USA: Printar Inc. | Toll free No: + 866-788-4LGP | Tel: + 201-458-0815 | Fax: + 201-458-0810 | Email: info_usa@printar.com www.printar.com See us at Booth #1875 FEBRUARY 2008 PRINTED CIRCUIT DESIGN & FAB 35 http://www.goipcshows.org http://www.printar.com http://www.printar.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2008

Printed Circuit Design & Fab - February 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies IC/PCB Co-Design Modeling Design Tools Optical Interconnect Trade Shows Laminate Materials Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - February 2008

For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.