Printed Circuit Design & Fab - February 2008 - (Page 4) OUR LINE Waste Not, Want Not tronics Show last month was not about the latest plasma TV or handheld phone, but how we dispose of last year’s model. That’s right, the hottest topic was e-waste, e-cycling and the far-reaching “greening” of the electronics industry. Electronics waste recycling has risen again to the forefront of the news KATHY as additional states joined pioneering California and Maine in enacting NARGI-TOTH their own versions of the WEEE directive during the second half of 2007. And just like the RoHS situation here in the U.S., there is no unified electronics recycling law from state to state, and it’s a good bet consumers and manufacturers are going to pay a price for these regional differences. Back in June, the Electronics Industries Alliance again urged Congress to take action. It’s no surprise, however, that we entered the new year without a national program. Since 2003, Congress has been “considering” various forms of this legislation. Here, almost five years later, we at best pay lip service to electronics recycling. Absent a federal plan, at the close of 2007 only 10 states had some form of legislation in place to regulate e-waste. It has been estimated that in 2007, only 12.5% of the electronics waste generated in the U.S. was recycled. These figures vary depending on the specific products included in the category of electronics waste. Most of the states that have enacted laws include only computers, TVs and CRTs generated by household consumers – not those purchased by and used for business purposes. This figure represents about 320,000 tons, so doing the math, the U.S. annually generates more than 2.5 million tons of e-waste. The majority of states that have laws on the books follow a “producer responsibility” approach. That is, the product manufacturer is responsible for cost of recycling the waste. Some programs are already on line, but most will be phased in over the next few years. California, for one, has an “advanced recovery fee” based system, but language for a producer responsibility approach is under evaluation and, if ratified, will be added to its regulations. Current data shows that even in states with mandatory recycling laws, only 20% of U.S. consumers comply. A number of OEMs encourage recycling through take-back programs. Of these, companies like Apple, H-P, Dell and Sony are becoming models of corporate stewardship. Each company has different ideas about what should be included and how these programs should work. Apple, for example, will take back any competitive brand, provided you buy a new PC direct from Apple. Dell, which has a similar program, will also take old Dell models for free (including shipping), even if you aren’t buying a new version. Sony’s program is relatively new, but it will also cover TVs – a big plus for analog holdouts. (A great guide to the various programs is at computertakeback.com.) Several other programs are in development to establish beneficial end-of-life product recycling. Keep in mind that most programs and companies are looking to deal with large volumes of waste from municipalities or those collected by organizations, and are not set up to deal with one-off units. This may be why more consumers don’t recycle e-waste. It’s just not as straightforward as taking out the trash. On its Web site, EPA lists over 140 U.S. members of the International Association of Electronics Recyclers that specialize in e-waste. Many combine environmentally sound materials recovery procedures with some form of parts recovery and unit refurbishment. If you don’t recycle e-waste via one of the major OEMs, check out these firms, but be forewarned: First ensure they do not ship e-waste overseas, where it could be processed by shady outfits and reintroduced to the supply chain via the gray parts market. If we can make more of our waste through recycling programs here in the U.S. that work, everybody wins. Job can be created, natural resources and the environment preserved, and millions of pounds of usable materials diverted from overflowing landfills. The assets we discard today might just be those we want most tomorrow. One housekeeping note: Want to conserve a few gallons (or more) of gas? Check out Virtual PCB, the industry’s first Web-based, fully interactive, virtual event for PCB designers, fabricators and assemblers. The show dates are Feb. 12-13, and registration (virtual-pcb.com) is free. Virtual PCB offers leading exhibitors, technical content and networking both during the live event and for the three months that follow, all from the comfort and convenience of your office or home. 4 pcdandf.com EDITORIAL EDITOR: Kathy Nargi-Toth, 678-589-8866, knargitoth@upmediagroup.com ASSOCIATE EDITOR: Phil Buonpastore, 678-5898853, pbuonpastore@upmediagroup.com O NE of the major stories that emerged from the Consumer Elec- EDITORIAL OFFICE: 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080 678-589-8800; fax 678-589-8850 EDITORIAL ADVISORY BOARD: Dr. Eric Bogatin, Be The Signal; Michael Carano, Electrochemicals; George Dudnikov, Sanmina-SCI; Jack Fisher, Interconnect Technology Analysis; Happy Holden, Mentor Graphics; Istvan Novak, Sun Microsystems CONTRIBUTING EDITOR: Dr. Hayao Nakahara COLUMNISTS: Bruce Archambeault, Peter Bigelow, Dr. Eric Bogatin, Michael Carano, Dominique Numakura, Dr. Abe Riazi, Susy Webb PRODUCTION MANAGING EDITOR: Katherine Haddox, khaddox@upmediagroup.com PRODUCTION MANAGER: Javier Longoria, jlongoria@upmediagroup.com SALES SALES ASSOCIATE: Kamden Robb, 678-589-8843, krobb@upmediagroup.com EXHIBIT SALES MANAGER: Brooke Anglin, 678-589-8833, fax 678-589-8850, banglin@upmediagroup.com KOREA SALES: Young Media Inc., +82 2 2273 4818, fax +82 2 2273 4866, ymedia@ymedia.co.kr PRINT REPRINTS: Edward Kane, FosteReprints, 866-879-9144 ext. 131, fax 219-561-2009, ekane@fostereprints.com ELECTRONIC REPRINTS: pcdf_reprints@upmediagroup.com LIST RENTAL: Jennifer Schuler, 918-496-1476, fax 918-496-9465 WEBINARS: Frances Stewart, 678-817-1286, fstewart@upmediagroup.com, pcbshows.com/webinars CIRCULATION DIRECTOR OF AUDIENCE DEVELOPMENT: Jennifer Schuler CIRCULATION AND SUBSCRIPTION INQUIRIES/ ADDRESS CHANGES: fax 918-496-9465, jschuler@upmediagroup.com UP MEDIA GROUP, INC. PRESIDENT: Pete Waddell VICE PRESIDENT, SALES AND MARKETING: Frances Stewart, fstewart@upmediagroup.com VICE PRESIDENT, EDITORIAL AND PRODUCTION: Mike Buetow, mbuetow@upmediagroup.com SPECIAL PROJECTS MANAGER: Ronda Faries, 678-589-8827, rfaries@upmediagroup.com Printed Circuit Design & Fab is distributed without charge to qualified subscribers. For others, annual Subscription Rates in U.S. funds are: $80 (U.S. and Canada), $145 (all other countries). Single copy price is $8.50. All subscription and single copy orders or inquiries should be directed to Printed Circuit Design & Fab, P.O. Box 35646, Tulsa, OK 74153-0646, jschuler@upmediagroup. com, fax 918-496-9465. Photocopies and issues on Microfilm/Microfiche (16mm, 33mm or 105mm) are available from University Microfilms International, 300 N. Zeeb Rd., Ann Arbor, MI 48106, Telephone 313-761-4600. Printed Circuit Design & Fab is published monthly by UP Media Group Inc., 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080. ISSN 1543-6527. GST 124513185/ Agreement #1419617. Periodicals postage paid at Smyrna, GA, and additional mailing offices. © 2008, UP Media Group, Inc. All rights reserved. Reproduction of material appearing in Printed Circuit Design & Fab is forbidden without written permission. PRINTED CIRCUIT DESIGN & FAB FEBRUARY 2008 http://pcdandf.com http://pcbshows.com/webinars http://computertakeback.com http://virtual-pcb.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - February 2008 Printed Circuit Design & Fab - February 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies IC/PCB Co-Design Modeling Design Tools Optical Interconnect Trade Shows Laminate Materials Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - February 2008 Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page Cover1) Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page Cover2) Printed Circuit Design & Fab - February 2008 - Printed Circuit Design & Fab - February 2008 (Page 1) Printed Circuit Design & Fab - February 2008 - Contents (Page 2) Printed Circuit Design & Fab - February 2008 - Contents (Page 3) Printed Circuit Design & Fab - February 2008 - Our Line (Page 4) Printed Circuit Design & Fab - February 2008 - Our Line (Page 5) Printed Circuit Design & Fab - February 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - February 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - February 2008 - Around the World (Page 8) Printed Circuit Design & Fab - February 2008 - Around the World (Page 9) Printed Circuit Design & Fab - February 2008 - Around the World (Page 10) Printed Circuit Design & Fab - February 2008 - Around the World (Page 11) Printed Circuit Design & Fab - February 2008 - Happenings (Page 12) Printed Circuit Design & Fab - February 2008 - Happenings (Page 13) Printed Circuit Design & Fab - February 2008 - ROI (Page 14) Printed Circuit Design & Fab - February 2008 - ROI (Page 15) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16A) Printed Circuit Design & Fab - February 2008 - Tip Jar (Page 16B) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 17) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 18) Printed Circuit Design & Fab - February 2008 - Interconnect Strategies (Page 19) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 20) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 21) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 22) Printed Circuit Design & Fab - February 2008 - IC/PCB Co-Design (Page 23) Printed Circuit Design & Fab - February 2008 - Modeling (Page 24) Printed Circuit Design & Fab - February 2008 - Modeling (Page 25) Printed Circuit Design & Fab - February 2008 - Modeling (Page 26) Printed Circuit Design & Fab - February 2008 - Modeling (Page 27) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 28) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 29) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 30) Printed Circuit Design & Fab - February 2008 - Design Tools (Page 31) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 32) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 33) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 34) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 35) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 36) Printed Circuit Design & Fab - February 2008 - Optical Interconnect (Page 37) Printed Circuit Design & Fab - February 2008 - Trade Shows (Page 38) Printed Circuit Design & Fab - February 2008 - Trade Shows (Page 39) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 40) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 41) Printed Circuit Design & Fab - February 2008 - Laminate Materials (Page 42) Printed Circuit Design & Fab - February 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - February 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - February 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - February 2008 - BGA Bulletin (Page Cover4)
For optimal viewing of this digital publication, please enable JavaScript and then refresh the page. If you would like to try to load the digital publication without using Flash Player detection, please click here.