Printed Circuit Design & Fab - February 2008 - (Page 43)

MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE TECHNIFLEX LCL 1000F Technic has released TechniFlex LCL 1000F a liquid photo-imageable solder , mask for flexible circuits. The company states that the product is RoHS compliant, halogen free, and passes UL 94V-0 and NASA outgassing specifications and OEM requirements. It is reported to be compatible with final finishes, adheres to copper or polyimide, and is capable of 2 mil resolution. WHO: Technic Inc. WEB: technic.com ROLL-TO-ROLL EXPOSURE UNIT The TE2538W is a double-sided, close proximity exposure system, using a roll-to-roll format that reportedly produces a cycle time of 7.2 sec while occupying the space of a single-sided machine. Machine has 10 µm line and space capability at full production speeds and quantities. A hard contact mode is included with a cycle time of 15 seconds. WHO: Toray Engineering WEB: toray.com BENCH TOP DEPANELIZERS The FKN Systek K3000 depanelizes up to 24-inch scored PCBs using a two-blade “pinching” method. Adjustable front and back tables can be tilted so that separated panels can slide onto a conveyor belt. Adjustable blade guards on each side of the circular blade provide operator protection from the working area. Blades are made of long lasting tool steel. WHO: FKN Systek WEB: fknsystek.com OTHERS OF NOTE DESIGN AND BUSINESS SOFTWARE Cimnet Systems released new versions of Paradigm Version 3.5, Cimnet Systems’ core ERP system; iQuote Version 3.2, a web-based program that automates the quoting process; and Engenix Version 2.2, a pre-production engineering application. According to the manufacturer, Paradigm v3.5 provides system flexibility in currency exchange rate, bill of materials, inventory and shop floor management. The PCB Design features include PCB panelizer, material search and pricing modules using iQuote v3.2 and PCB stack-up based on impedance constraints using Engenix v2.2. WHO: Cimnet Systems WEB: cim-sys.com APS MEG-A-PAK FLEXIBLE POUCHES Adhesive Packaging Specialties (APS) announces Meg-A-Pak, for packaging up to 800 grams of two-component reactive adhesives and sealants in flexible pouches. The Meg-A-Pak product provides a combination packaging/mixing burst-seal container for a variety of resin systems. WHO: Adhesive Packaging Specialties WEB: adhesivepackaging.com SPICE MODELING TOOLS XtractIM extracts package models from S parameters computed by full-wave field solvers, fully taking into account various electromagnetic interactions. Unlike other tools that have to use symmetric circuit structures to represent non-symmetric physical structures, XtractIM correctly represents the non-symmetric nature of the physical structures by generating nonsymmetric Pi and T type SPICE models according to system network (S, Z or Y) parameters. WHO: Sigrity WEB: sigrity.com DESIGN REUSE SOFTWARE TOOL Intercept has released Pantheon version 5.2, that offers design reuse capabilities with block design technology. Reuse can shortened design time and reduced edits. The design reuse model provides solutions for RF design by allowing specialized RF circuits to be maintained separately within mixed digital and RF designs. It also allows complex portions of standard PCB designs to be stored in a library and reused. Pantheon 5.2 is available to customers on Sun Solaris, Linux, and Windows platforms. WHO: Intercept WEB: intercept.com SOLID-STATE LASER The AVIA 532-38 solid-state laser delivers over 38W of output at 532 nm (at 120 kHz) with a pulse width of 45 nsec. Applications include singulation of microelectronics packages, wafer scribing, and edge isolation in solar cells. The laser is based on existing AVIA O/A platform (oscillator/amplifier cavity) and uses software that enables customized pulse control and power on demand. WHO: Coherent Laser WEB: coherent.com COMPONENT LIBRARY Component library of high-density, miniaturized, surface-mount multilayer ceramic chip capacitors. Library will interface with the AWR Microwave Office design suite. The library consists of hundreds of capacitor models, including high-frequency, high-capacitance, high-voltage, low profile, super small, array and low inductance ceramic capacitors (LICCs). WHO: Samsung Electro-Mechanics; AWR WEB: sem.samsung.com; appwave.com FEBRUARY 2008 PRINTED CIRCUIT DESIGN & FAB 43 http://www.toray.com http://www.fknsystek.com http://www.technic.com http://www.adhesivepackaging.com http://www.sigrity.com http://www.cim-sys.com http://www.intercept.com http://www.coherent.com http://www.appwave.com http://sem.samsung.com

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Printed Circuit Design & Fab - February 2008

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