Printed Circuit Design & Fab - March 2008 - (Page 12) HAPPENINGS EVENTS MARCH 4-5 PCB AUSTIN DESIGN CONFERENCE AND EXHIBITION Holiday Inn Austin Town Lake, Austin, TX Contact: askarbek@upmediagroup.com pcbshows.com FACES Diane Grinder has joined The Millennia Group as human resources manager. Grinder earned a B.A. degree in business administration from Baldwin-Wallace College, and B.S. degree from Slippery Rock University. She has also completed coursework toward a M.E. degree with a concentration in HR management. Richard D. Parker, lead technologist at Delphi Electronics & Safety Division, has co-edited a book entitled Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing. The book is based on a six-year study on issues surrounding the implementation of lead-free solder into electronic assembly boards. The Isola Group SARL announced the appointment of F. Gordon Bitter as executive VP and CFO. Prior to Isola, Bitter spent five years as senior VP and CFO for Plexus and Hadco. He received his MBA from the Wharton School and a Bachelor’s Degree in Mathematics from Bucknell University. Landrex Technologies announced the promotion of Lyle Sherwood to the position of VP and technical director. In addition to his sales and marketing responsibilities, he will now define and coordinate new technology development in North America and Europe. Landrex also announced the appointment of Michael Triber (pictured) to the position of eastern regional manager. In his new position, Michael will be responsible for providing pre- and post sales support to Landrex’s salespeople and customers. Bill Boyle has been named new business development director for Sierra Proto Express. Boyle will manage the representative network for the company and all its divisions. Boyle has worked with Astro Circuits, Advanced Quick Circuits, Data Circuits and Merix. 11-12 IPC/JEDEC International Conference on Reliability, Rework and Reapir of Lead-Free Electronics Research Triangle Park, NC LFConf@ipc.com 17-19 Electronic Circuits World Convention 11 Shanghai Everbright Convention and Exhibition International Hotel Shanghai, China Contact: register@cpca.org.cn 18-20 CPCA Show Shanghai New International Expo Center Shanghai, China Contact: ecwc11.com/en/cpcashowhis.asp 28 Components, Packaging & Manufacturing Technology (CPMT) Society Luncheon Ramada Inn Sunnyvale, CA Contact: cpmt.org/scv APRIL 1-3 IPC Printed Circuit Expo, APEX and the Designers Summit Mandalay Bay Resort & Convention Center Las Vegas, NV Contact: goipcshows.org 11-16 PCB EAST Holiday Inn Select & Convention Center Tinley Park, IL Contact: banglin@upmediagroup.com pcbeast.com MAY 29-30 Summer Conference and Table Top Exhibition on PCB Technologies European Institute of Printed Circuits (EIPC) Dresden, Germany Contact: eipc.org IT’S A DEAL PCB Solutions of Layton, UT, will bring its PCB manufacturing back to the U.S., sighting costly problems such as counterfeiting, logistics, delayed prototypes, lack of manufacturing flexibility and overseas freight expenses and lengthy shipping times. The company states that production in the U.S. eliminates many of the common problems related to overseas outsourcing, claiming fewer logistical problems. Honeywell Electronic Materials and the U.S. Display Consortium (USDC) announced an agreement to develop materials for flexible electronics. Under this agreement, Honeywell will focus on developing materials to prevent short circuits in flexible electronics for devices used by the US military, as well as materials used in flexible displays, organic light-emitting diodes (OLED) and flexible photovoltaics. Beta site testing of these new materials will take 12 place at the Flexible Display Center at Arizona State University (ASU FDC). Mania Technologie has entered into an agreement with Century Hi-Tech Ltd. (Welly) to manufacture Micronic drilling machines. Welly will acquire all Mania shares from the joint venture established in 2005. Accelerated Designs Inc. (ADI) concluded a distribution agreement with the Spectrum Electronics web-portal Ismosys. com. The terms of the agreement grant Ismosys rights to represent ADI in European territories and handle the global distribution of its products online. Valor Computerized Systems announced the formation of a strategic partnership with EMA Design Automation for the North American market. The agreement establishes EMA as a sales and sup- port provider for Valor’s DFM Enterprise 3000 product and the Valor Parts Library (VPL). The Valor DFM Enterprise 3000 product complements EMA’s PCB design flow solution and will enable customers to improve product manufacturability, reduce the number of design spins, and reduce their overall time to market. PPG Industries has acquired the assets and intellectual property of NanoProducts Corp., a producer of nanoproduct materials and a developer of nanoproduct technology. The terms were not disclosed. The company has an extensive patent estate and operates facilities to develop and manufacture unique nanoparticles. PPG’s nanotechnology includes patented innovations such as thin-film, optically clear nanocomposites for scratch protection and reflection of infrared (IR) and ultraviolet (UV) light from glass. MARCH 2008 PRINTED CIRCUIT DESIGN & FAB http://www.pcbshows.com/austin http://www.ecwc11.com/en/cpcashowhis.asp http://cpmt.org/scv http://goipcshows.org http://www.pcbeast.com http://eipc.org
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - March 2008 Printed Circuit Design & Fab - March 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC for the Real World Positive Plating FPGA/PCB Co-design Increases Fabrication Yields Optoelectronics Comes of Age, Part 2 Implementation of Buried Capacitance in High-Speed Designs Ad Index Improved Innerlayer Bonding for Sequential Lamination Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - March 2008 Printed Circuit Design & Fab - March 2008 - Printed Circuit Design & Fab - March 2008 (Page Cover1) Printed Circuit Design & Fab - March 2008 - Printed Circuit Design & Fab - March 2008 (Page Cover2) Printed Circuit Design & Fab - March 2008 - Printed Circuit Design & Fab - March 2008 (Page 1) Printed Circuit Design & Fab - March 2008 - Contents (Page 2) Printed Circuit Design & Fab - March 2008 - Contents (Page 3) Printed Circuit Design & Fab - March 2008 - Our Line (Page 4) Printed Circuit Design & Fab - March 2008 - Our Line (Page 5) Printed Circuit Design & Fab - March 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - March 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - March 2008 - Around the World (Page 8) Printed Circuit Design & Fab - March 2008 - Around the World (Page 9) Printed Circuit Design & Fab - March 2008 - Around the World (Page 10) Printed Circuit Design & Fab - March 2008 - Around the World (Page 11) Printed Circuit Design & Fab - March 2008 - Happenings (Page 12) Printed Circuit Design & Fab - March 2008 - Happenings (Page 13) Printed Circuit Design & Fab - March 2008 - ROI (Page 14) Printed Circuit Design & Fab - March 2008 - ROI (Page 15) Printed Circuit Design & Fab - March 2008 - EMC for the Real World (Page 16) Printed Circuit Design & Fab - March 2008 - EMC for the Real World (Page 17) Printed Circuit Design & Fab - March 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - March 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - March 2008 - FPGA/PCB Co-design Increases Fabrication Yields (Page 20) Printed Circuit Design & Fab - March 2008 - FPGA/PCB Co-design Increases Fabrication Yields (Page 21) Printed Circuit Design & Fab - March 2008 - FPGA/PCB Co-design Increases Fabrication Yields (Page 22) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 23) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 24) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 25) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 26) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 27) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 28) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 29) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 30) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 31) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 32) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 33) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 34) Printed Circuit Design & Fab - March 2008 - Ad Index (Page 35) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 36) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 37) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 38) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 39) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 40) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 41) Printed Circuit Design & Fab - March 2008 - Off the Shelf (Page 42) Printed Circuit Design & Fab - March 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - March 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - March 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - March 2008 - BGA Bulletin (Page Cover4)
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