Printed Circuit Design & Fab - March 2008 - (Page 2)

MARCH 2008 • VOL. 25 • NO. 3 FEATURES FPGA/PCB co-design provides advantages including improved electrical performance and increased fabrication yields. Co-design illustration courtesy of Mentor Graphics 20 FPGA/PCB CO-DESIGN FPGA/PCB CO-DESIGN INCREASES FABRICATION YIELDS When integrating FPGAs into PCB design every signal and pin has a measureable effect on production yield. by YAN KILLY 23 OPTICAL INTERCONNECT POINT OF VIEW 4 Optoelectronics Comes of Age, Part 2 Optical connectivity is sufficiently advanced, has been reduced to practice and is available for many near term applications. by DR. BRUCE L. BOOTH and JACK FISHER 30 EMBEDDED CAPACITANCE OUR LINE The long view. Kathy Nargi-Toth 14 ROI Experienced people are an essential part of a corporate recession survival plan. Implementation of Buried Capacitance in High-Speed Designs Embedded capacitance frees up the board surface for routing traces, can reduce the overall board size and can speed time to market. by JUN FAN, NORM SMITH, JIM KNIGHTEN, JOHN ANDRESAKIS, YOSHI FUKAWA and MARK HARVEY 36 INNERLAYER PROCESSING Peter Bigelow 16 EMC FOR THE REAL WORLD At higher frequencies signal loss and noise is reduced when ground-return vias are placed close to the signal vias. Dr. Bruce Archambeault 18 Improved Innerlayer Bonding for Sequential Lamination Multiple lamination cycles add cumulative thermal stress to the innerlayer bonds. by DR. JEAN RASMUSSEN, DR. ABAYOMI I. OWEI, DANIS ISIK, DR. AXEL DOMBERT, and DAVID ORMEROD POSITIVE PLATING The best defense against voids is to understand the processes that can cause the defect. Michael Carano 48 BGA BULLETIN Successful fanout solutions provide escape routing for a combination of serial and parallel nets. Charles Pfeil DEPARTMENTS 6 8 MARKET WATCH AROUND THE WORLD 12 42 HAPPENINGS OFF THE SHELF 35 44 AD INDEX MARKETPLACE ONLINE EXCLUSIVES pcdandf.com Visit our Web site for news, products, extra features and columns, and more. Circuits Assembly Online OFFSHORE EXPANSION circuitsassembly.com The Road Abroad – Strategic Alliance or Greenfield Facility? Optoelectronics Comes of Age Part 1 and Part 2 – The complete article with additional graphics and commentary. by DR. BRUCE L. BOOTH and JACK FISHER A management insider explains the main models for establishing manufacturing in low-cost regions. by PAUL PLANTE ON THE FOREFRONT Embedded Components Get Real Buried parts are finding homes in everything from handhelds to servers and ATE gear. by E. JAN VARDAMAN POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://pcdandf.com http://circuitsassembly.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - March 2008

Printed Circuit Design & Fab - March 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC for the Real World Positive Plating FPGA/PCB Co-design Increases Fabrication Yields Optoelectronics Comes of Age, Part 2 Implementation of Buried Capacitance in High-Speed Designs Ad Index Improved Innerlayer Bonding for Sequential Lamination Off the Shelf Marketplace BGA Bulletin

Printed Circuit Design & Fab - March 2008

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