Printed Circuit Design & Fab - March 2008 - (Page 20) FPGA/PCB CO-DESIGN FPGA/PCB CO-DESIGN Increases Fabrication Yields When integrating FPGAs into PCB design every signal and pin has a measureable effect on production yield. by YAN KILLY PCB designs with field-programmable gate arrays (FPGAs) are often done more empirically than systematically – the board is designed and then “tweaked” by altering component placement, component orientation, PCB layer stack up, PBC signal layer pairs, trace routing, and even manufacturing materials. As FPGAs have become a more dominant design component, the concept that the FPGA pinout can be optimized for both internal and external FPGA signal integrity (in PCB design) provides a flexibility not available with competing technologies. Taking advantage of that flexibility throughout the design process can measurably increase PCB yields and increase profit. Incorporating FPGA/PCB co-design and paying special attention to FPGA placement and routing can reduce “tweaking” time by 20-50%, increase fabrication yields, and ultimately increase the end-product’s profitability. FPGA Device Libraries Load/Save Design FPGA Devices Dominate New Designs A decade ago, ASICs were the dominant definable component found in design starts. Today the flexibility, rapid deployment, and lower development costs of FPGAs have resulted in the dramatic increase of their use in new designs. As FPGAs have matured as circuit elements, pin count has risen significantly. The increase in pin count represents a factorial-increased complexity to the PCB design. This complexity increases with greater numbers of traces, vias and tighter tolerances, plus signal integrity and timing constraint issues. The increased pin count also creates the need for additional layers as well, each adding 10-20% to the manufacturing cost of a completed board. FPGA Flow PCB Flow HDL Design VHDL or Verilog Functional Symbol Simulation I/O Designer Schematic Entry Typical Design Flow Having evolved from different technology arenas, PCB and FPGA designs have some differences in design flows that have hindered many co-design efforts and negatively impacted the optimization of the FPGA-PCB interface. PCB designs use a schematic-based data entry method. FPGAs, however, are defined by a language-based description. This difference in methodologies coupled with human interface issues has been at the root of most problems. In a typical design, the FPGA team defines high-level block diagrams comprising the system design. At this point, MARCH 2008 Synthesis Constraints PCB Symbol & Schematic FPGA Place & Route Tools P&R Constraints P&R Pin Map PCB Layout FIGURE 1. Integrating an I/O designer tool, PCB design is pushed up the design cycle. 20 PRINTED CIRCUIT DESIGN & FAB
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - March 2008 Printed Circuit Design & Fab - March 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC for the Real World Positive Plating FPGA/PCB Co-design Increases Fabrication Yields Optoelectronics Comes of Age, Part 2 Implementation of Buried Capacitance in High-Speed Designs Ad Index Improved Innerlayer Bonding for Sequential Lamination Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - March 2008 Printed Circuit Design & Fab - March 2008 - Printed Circuit Design & Fab - March 2008 (Page Cover1) Printed Circuit Design & Fab - March 2008 - Printed Circuit Design & Fab - March 2008 (Page Cover2) Printed Circuit Design & Fab - March 2008 - Printed Circuit Design & Fab - March 2008 (Page 1) Printed Circuit Design & Fab - March 2008 - Contents (Page 2) Printed Circuit Design & Fab - March 2008 - Contents (Page 3) Printed Circuit Design & Fab - March 2008 - Our Line (Page 4) Printed Circuit Design & Fab - March 2008 - Our Line (Page 5) Printed Circuit Design & Fab - March 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - March 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - March 2008 - Around the World (Page 8) Printed Circuit Design & Fab - March 2008 - Around the World (Page 9) Printed Circuit Design & Fab - March 2008 - Around the World (Page 10) Printed Circuit Design & Fab - March 2008 - Around the World (Page 11) Printed Circuit Design & Fab - March 2008 - Happenings (Page 12) Printed Circuit Design & Fab - March 2008 - Happenings (Page 13) Printed Circuit Design & Fab - March 2008 - ROI (Page 14) Printed Circuit Design & Fab - March 2008 - ROI (Page 15) Printed Circuit Design & Fab - March 2008 - EMC for the Real World (Page 16) Printed Circuit Design & Fab - March 2008 - EMC for the Real World (Page 17) Printed Circuit Design & Fab - March 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - March 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - March 2008 - FPGA/PCB Co-design Increases Fabrication Yields (Page 20) Printed Circuit Design & Fab - March 2008 - FPGA/PCB Co-design Increases Fabrication Yields (Page 21) Printed Circuit Design & Fab - March 2008 - FPGA/PCB Co-design Increases Fabrication Yields (Page 22) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 23) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 24) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 25) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 26) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 27) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 28) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 29) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 30) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 31) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 32) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 33) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 34) Printed Circuit Design & Fab - March 2008 - Ad Index (Page 35) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 36) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 37) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 38) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 39) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 40) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 41) Printed Circuit Design & Fab - March 2008 - Off the Shelf (Page 42) Printed Circuit Design & Fab - March 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - March 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - March 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - March 2008 - BGA Bulletin (Page Cover4)
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