Printed Circuit Design & Fab - March 2008 - (Page 25) isola isola isola isola isola isola isola isola isola isola isola Isola product offering IS680 Dk 2.8 to 3.45 / Df < 0.0035 isola IS415 200 Tg 370HR 180 Tg IS420 170 Tg IS410 180 Tg 370 Turbo 180 Tg High Reliability FR - 4 High-Tg IS640 Dk 2.8 - 3.45/ Df < 0.0045 Polyimide No Flow IS572N (Halogen Free) 370HRN IS680 Dk 2.8 to 3.45 / Df < 0.0035 P96/P26 V-0/ V-1 Polyimide P95/P25 HB Polyimide GETEK™ PPO/Epoxy G200 BT/Epoxy GI180 BT/Epoxy Specialty Products High-Tg IS620 225 Tg, Df = 0.0055 - 0.007 FR408HR 220 Tg, Df - 0.009 FR408 180 Tg, Df - 0.011 IS415 200 Tg, Df - 0.013 High Reliability Signal Integrity High-Tg Low Dk/ Df FR406N A11 IS640 Dk 2.8 - 3.45/ Df < 0.0045 RF/ Microwave Controlled Dielectric Thickness and Dk No / Low Flow Prepregs Mid-Tg/ High-Tg For more, go to: http://www.isola-group.com/en/products/name/index.shtml Halogen Free Products Volume Products New Products http://www.isola-group.com/en/products/name/index.shtml http://www.isola-group.com/en/products/name/index.shtml
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - March 2008 Printed Circuit Design & Fab - March 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC for the Real World Positive Plating FPGA/PCB Co-design Increases Fabrication Yields Optoelectronics Comes of Age, Part 2 Implementation of Buried Capacitance in High-Speed Designs Ad Index Improved Innerlayer Bonding for Sequential Lamination Off the Shelf Marketplace BGA Bulletin Printed Circuit Design & Fab - March 2008 Printed Circuit Design & Fab - March 2008 - Printed Circuit Design & Fab - March 2008 (Page Cover1) Printed Circuit Design & Fab - March 2008 - Printed Circuit Design & Fab - March 2008 (Page Cover2) Printed Circuit Design & Fab - March 2008 - Printed Circuit Design & Fab - March 2008 (Page 1) Printed Circuit Design & Fab - March 2008 - Contents (Page 2) Printed Circuit Design & Fab - March 2008 - Contents (Page 3) Printed Circuit Design & Fab - March 2008 - Our Line (Page 4) Printed Circuit Design & Fab - March 2008 - Our Line (Page 5) Printed Circuit Design & Fab - March 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - March 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - March 2008 - Around the World (Page 8) Printed Circuit Design & Fab - March 2008 - Around the World (Page 9) Printed Circuit Design & Fab - March 2008 - Around the World (Page 10) Printed Circuit Design & Fab - March 2008 - Around the World (Page 11) Printed Circuit Design & Fab - March 2008 - Happenings (Page 12) Printed Circuit Design & Fab - March 2008 - Happenings (Page 13) Printed Circuit Design & Fab - March 2008 - ROI (Page 14) Printed Circuit Design & Fab - March 2008 - ROI (Page 15) Printed Circuit Design & Fab - March 2008 - EMC for the Real World (Page 16) Printed Circuit Design & Fab - March 2008 - EMC for the Real World (Page 17) Printed Circuit Design & Fab - March 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - March 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - March 2008 - FPGA/PCB Co-design Increases Fabrication Yields (Page 20) Printed Circuit Design & Fab - March 2008 - FPGA/PCB Co-design Increases Fabrication Yields (Page 21) Printed Circuit Design & Fab - March 2008 - FPGA/PCB Co-design Increases Fabrication Yields (Page 22) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 23) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 24) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 25) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 26) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 27) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 28) Printed Circuit Design & Fab - March 2008 - Optoelectronics Comes of Age, Part 2 (Page 29) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 30) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 31) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 32) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 33) Printed Circuit Design & Fab - March 2008 - Implementation of Buried Capacitance in High-Speed Designs (Page 34) Printed Circuit Design & Fab - March 2008 - Ad Index (Page 35) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 36) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 37) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 38) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 39) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 40) Printed Circuit Design & Fab - March 2008 - Improved Innerlayer Bonding for Sequential Lamination (Page 41) Printed Circuit Design & Fab - March 2008 - Off the Shelf (Page 42) Printed Circuit Design & Fab - March 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - March 2008 - Marketplace (Page 47) Printed Circuit Design & Fab - March 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - March 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - March 2008 - BGA Bulletin (Page Cover4)
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