Printed Circuit Design & Fab - March 2008 - (Page 42)

CPCA Show (March 18-20, 2008) and IPC Expo (April 1-3, 2008) Product Preview THREE AXIS MEASURMENT SYSTEM FLYING PROBE FOR SYSTEM TEST PCB ETCHING Plasma Etch Inc. has designed a simple and reliable PCB and inner layer etcher specifically for the Asian market. The new Advantage 16 series is priced to compete with Asian systems, yet deliver the reliable performance of a first tier U.S. manufacturer. WHO: Plasma Etch, plasmaetch.com Aerial M4 Flying Probe series for fixtureless testing uses compact architecture, with fast and stable double-side probing. The Aerial series model M2 and M4 probes use Seica’s VIVA Integrated Platform that incorporates a full range of test techniques and automatic programming tools and are competitively priced. WHO: Seica, seica.com Operations Technology Inc. will be making the domestic introduction of its new VideoMic VSA line of video-based, 3-axis measurement systems. These granite based, high speed, linear motor driven systems are now available in four sizes and feature an air-bearing stage coupled to 1/10th micron linear scales. A Programmable Zoom Lens is complemented by an array of LED lighting modules for proper illumination of holes, pads, traces and spaces. WHO: Optek, optek.net WHERE: IPC Expo Booth #851 WHERE: IPC Expo Booth #205 WHERE: IPC Expo Booth #1365 OTHERS OF NOTE BLACK OXIDE TECHNOLOGY HMS, manufacturer of Black Oxide equipment is reintroducing this technology that will reportedly reduce yield losses in higher temperature soldering and reflow ovens, using the improved bonding and lamination capabilities of the product. WHO: HMS Höllmüller, hms-germany.de EVF MICRO VIA ELECTROPLATE DIGITAL SOLDER MASK PRINTER Printar’s newest innovation totally replaces current printing, coating, exposure and drying systems with a simple, one-step process. Printar’s system combines registration accuracy with zero tolerance and saves on ink by applying it to the board with a proprietary conformal coating technology while keeping via holes free of solder mask. WHO: Printar, printar.com WHERE: CPCA Booth #1A68 Uyemura announces its EVF micro via fill acid copper electroplate used for PCB stacking technologies. The company claims exceptionally stable organic additives that can plate vias from 50-200 microns with a low surface thickness and minimum “dimple. The high productivity plating fills ” vias at 20 ASF in less than 90 minutes. WHO: Uyemura, uyemura.com WHERE: IPC Expo Booth #1433 COPPER SURFACE PREPARATION MultiPrep copper surface preparation improves adhesion of soldermask, dry film and liquid photoresists. The cupric chloride based chemistry generates a highly textured, uniform roughness on many copper surfaces while maintaining wide process latitude and overall manufacturing efficiency. WHO: MacDermid, macdermid.com WHERE: IPC Expo Booth #1273 IMMERSION TIN FINAL FINISH Atotech introduces a three-step system that is an immersion tin final finish for PCBs. The fully compatible three-step process includes the FerroEtch adhesion promotion process, Stanamask tin soldermask and Stannatech immersion tin to ensure optimal performance for any requirement. WHO: Atotech, atotech.com PCB FABRICATION TECHNOLOGIES Rohm and Haas Electronic Materials offers a range of metallization and imaging technologies, including the latest adhesion promotion, electroless and electrolytic copper processes for HDI and SAP fabrication, as well as the latest in dry film and final finish processes. WHO: Rohm and Haas, rohmhaas.com WHERE: IPC Expo Booth #1065 WHERE: IPC Expo Booth #1147 WHERE: CPCA Booth #1D78, Hall E1; IPC Expo Booth #819 42 PRINTED CIRCUIT DESIGN & FAB MARCH 2008 http://www.plasmaetch.com http://www.seica.com http://www.optek.net http://www.printar.com http://www.hms-germany.de http://www.uyemura.com http://www.macdermid.com http://www.atotech.com http://www.rohmhaas.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - March 2008

Printed Circuit Design & Fab - March 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC for the Real World Positive Plating FPGA/PCB Co-design Increases Fabrication Yields Optoelectronics Comes of Age, Part 2 Implementation of Buried Capacitance in High-Speed Designs Ad Index Improved Innerlayer Bonding for Sequential Lamination Off the Shelf Marketplace BGA Bulletin

Printed Circuit Design & Fab - March 2008

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