Printed Circuit Design & Fab - March 2008 - (Page 43)

MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE UV LASER FOR LDI APPLICATIONS FLEXIBLE SOLDER RESIST The SD 2460/201 UV-FLEX series exhibits excellent flexibility for applications requiring multiple bends. The product has good resistance to electroless nickel/immersion gold processes and excellent adhesion to copper and polyester, polyimide and polycarbonate materials. Due to claimed quick UV curing, it features short process times ideal for roll-to-roll manufacturing. Available in a halogen-free version, conforms to JPCA-ES01-2003 and IEC 61249-2-21, and is RoHS compliant. WHO: WEB: Peters peters.de RF AND MICROWAVE LAMINATE TC600 microwave laminate has a 6.15 dielectric constant and enhanced heattransfer capability. Increased thermal conductivity reduces power amplifier junction temperatures and solder joint fatigue. The product is stable over a wide temperature range, with a low coefficient of thermal expansion, and is designed to meet a high level of component attachment and plated through-hole reliability requirements. WHO: WEB: Arlon arlon-med.com Paladin 355-8000 UV Laser delivers 8W of quasi-CW output at 355 nm, with excellent mode quality, low noise, and an 80 MHz repetition rate. Insensitive to shock and vibration, the unit features long-term stability without adjustments, and has a smart power supply that allows hands-free operation and ease of integration. The laser is ideal for laser direct imaging (LDI) of PCBs, flat panel display (FPD) substrate scribing and circuit imaging, and inspecting both patterned and un-patterned semiconductor wafers. WHO: WEB: Coherent Coherent.com OTHERS OF NOTE OPTOELECTRONIC DESIGN TOOL Opto design software that enables faster simulation of optoelectronic devices, linking Synopsys’ TCAD Sentaurus Device simulation software to Acceleware’s Cluster-In-A-Box Quad Q30 workstation. The tool enables speed-up of the finite-difference timedomain (FDTD) modeling algorithm used in the Sentaurus Device software. This performance increase reportedly allows engineers to incorporate FDTD in designing and optimizing optoelectronic devices while shortening the product development cycle. WHO: WEB: Synopsys synopsys.com HIGH DENSITY BACKPLANE CONNECTOR The Impact backplane connector is designed for telecommunications and data networking equipment. The connector provides up to 80 differential pairs per linear inch in less than 29 mm total width, speed capability at over 20 Gbps, and a two compliant pin design option. Provides low cross-talk, insertion loss and minimal performance variation across high speed channels. WHO: WEB: Molex molex.com/link/Impact.html TRANSCEIVER LIBRARY Transceiver model library for use with EDA software. The library reduces development costs and increases productivity for multiGHz PCB and backplane signal integrity design and analysis. It delivers advanced simulation technology for faster and more accurate high-speed serial link design and enables designers to accurately and quickly perform an analog simulation of the transceiver signal integrity. WHO: WEB: Agilent agilent.com THERMAL PROFILER MEGAM.O.L.E. 20 thermal profiler analyzes complex boards in one pass, and allows the user to customize data extraction and reports used for new product introduction (NPI). The single-pass capability reduces wear and tear on prototype assemblies or golden boards. The profiler uses twenty channels contained in four thermocouples, reducing connection times and related errors. Allows the user to focus on individual components and measurements grouped for analysis of differentials. WHO: WEB: ECD ecd.com/MM20 X-RAY FLUORESCENCE ANALYZER X-Strata980 X-ray fluorescence analyzer detects hazardous elements in product samples and assists in producing environmentally friendly products. The analyzer performs analysis and characterization of multi-layer coatings, SAC alloys, µPPF and solar panels. Other applications include measuring coating thickness and metal alloy chemistry identification. Features as small as 150 microns in size can be measured, and collimators in a variety of sizes are available. WHO: WEB: Oxford Instruments oxford-instruments.com MARCH 2008 PRINTED CIRCUIT DESIGN & FAB 43 http://www.peters.de http://www.coherent.com http://www.arlon-med.com http://www.molex.com/link/impact.html http://www.agilent.com http://www.synopsys.com http://www.ecd.com/MM20 http://www.oxford-instruments.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - March 2008

Printed Circuit Design & Fab - March 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC for the Real World Positive Plating FPGA/PCB Co-design Increases Fabrication Yields Optoelectronics Comes of Age, Part 2 Implementation of Buried Capacitance in High-Speed Designs Ad Index Improved Innerlayer Bonding for Sequential Lamination Off the Shelf Marketplace BGA Bulletin

Printed Circuit Design & Fab - March 2008

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