Printed Circuit Design & Fab - April 2008 - (Page 11)

VISIT US AT IPC/APEX BOOTH #1224 GOING GREEN? More than performance friendly, we’re environmentally friendly too. We've decreased the need for all those discrete capacitors and the associated material and energy needed to manufacture and assemble them. BENEFITS OF BURIED CAPACITANCE™ » Reduction in Discrete Capacitors and Associated Reliability Concerns of Solder Joints » Improved Power Distribution System » Reduced PCB size and/or increased functionality » Reduced Board thickness » Improved EMC/EMI FEATURES OF FARADFLEX® » RoHS and WEEE Compliant » Compatible with Lead-Free Assembly » Robust Product that is Compatible with Standard PCB Processes » Highest Capacitance Density and Thinnest Products Available » 100% High Potential (Hi-Pot) Tested To start enjoying the benefits of Buried Capacitance technology using the FaradFlex line of products contact Oak-Mitsui Technologies: (518) 686-4961 or FaradFlex.Sales@oakmitsui.com. Visit us at www.oakmitsui.com ENHANCING SPEED AND PERFORMANCE, ONE LAYER AT A TIME. http://www.oakmitsui.com http://www.oakmitsui.com Table of Contents for the Digital Edition of Printed Circuit Design & Fab - April 2008Printed Circuit Design & Fab - April 2008ContentsOur LineMarket WatchAround the WorldHappeningsROITip JarInterconnect StrategiesPositive PlatingImproving Fabrication Yields by DesignSolve Design Problems with Signal Integrity OptimizationLaser Direct Imaging Made EasyTroubleshooting the Innerlayer ProcessSIPS Give More to MooreOff the ShelfMarketplaceAd IndexBGA BulletinPrinted Circuit Design & Fab - April 2008Printed Circuit Design & Fab - April 2008 - (Page Belly1)Printed Circuit Design & Fab - April 2008 - (Page Belly2)Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover1)Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover2)Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page 1)Printed Circuit Design & Fab - April 2008 - Contents (Page 2)Printed Circuit Design & Fab - April 2008 - Contents (Page 3)Printed Circuit Design & Fab - April 2008 - Our Line (Page 4)Printed Circuit Design & Fab - April 2008 - Our Line (Page 5)Printed Circuit Design & Fab - April 2008 - Market Watch (Page 6)Printed Circuit Design & Fab - April 2008 - Market Watch (Page 7)Printed Circuit Design & Fab - April 2008 - Market Watch (Page 8)Printed Circuit Design & Fab - April 2008 - Market Watch (Page 9)Printed Circuit Design & Fab - April 2008 - Around the World (Page 10)Printed Circuit Design & Fab - April 2008 - Around the World (Page 11)Printed Circuit Design & Fab - April 2008 - Around the World (Page 12)Printed Circuit Design & Fab - April 2008 - Around the World (Page 13)Printed Circuit Design & Fab - April 2008 - Happenings (Page 14)Printed Circuit Design & Fab - April 2008 - Happenings (Page 15)Printed Circuit Design & Fab - April 2008 - ROI (Page 16)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast1)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast2)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast3)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast4)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast5)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast6)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast7)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast8)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast9)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast10)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast11)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast12)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast13)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast14)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast15)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast16)Printed Circuit Design & Fab - April 2008 - ROI (Page Insert1)Printed Circuit Design & Fab - April 2008 - ROI (Page Insert2)Printed Circuit Design & Fab - April 2008 - ROI (Page Insert3)Printed Circuit Design & Fab - April 2008 - ROI (Page Insert4)Printed Circuit Design & Fab - April 2008 - ROI (Page 17)Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 18)Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 19)Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 20)Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 21)Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 22)Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 23)Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 24)Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 25)Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 26)Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 27)Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 28)Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 29)Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 30)Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 31)Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 32)Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 33)Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 34)Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 35)Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 36)Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 37)Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 38)Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 39)Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 40)Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 41)Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 42)Printed Circuit Design & Fab - April 2008 - Off the Shelf (Page 43)Printed Circuit Design & Fab - April 2008 - Marketplace (Page 44)Printed Circuit Design & Fab - April 2008 - Marketplace (Page 45)Printed Circuit Design & Fab - April 2008 - Marketplace (Page 46)Printed Circuit Design & Fab - April 2008 - Ad Index (Page 47)Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page 48)Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover3)Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover4)http://www.nxtbookMEDIA.com

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