Printed Circuit Design & Fab - April 2008 - (Page 9)

isola isola isola isola isola isola isola isola isola isola isola Isola product offering IS680 Dk 2.8 to 3.45 / Df < 0.0035 isola IS415 200 Tg 370HR 180 Tg IS420 170 Tg IS410 180 Tg 370 Turbo 180 Tg High Reliability FR - 4 High-Tg IS640 Dk 2.8 - 3.45/ Df < 0.0045 Polyimide No Flow IS572N (Halogen Free) 370HRN IS680 Dk 2.8 to 3.45 / Df < 0.0035 P96/P26 V-0/ V-1 Polyimide P95/P25 HB Polyimide GETEK™ PPO/Epoxy G200 BT/Epoxy GI180 BT/Epoxy Specialty Products High-Tg IS620 225 Tg, Df = 0.0055 - 0.007 FR408HR 220 Tg, Df - 0.009 FR408 180 Tg, Df - 0.011 IS415 200 Tg, Df - 0.013 High Reliability Signal Integrity High-Tg Low Dk/ Df FR406N A11 IS640 Dk 2.8 - 3.45/ Df < 0.0045 RF/ Microwave Controlled Dielectric Thickness and Dk No / Low Flow Prepregs Mid-Tg/ High-Tg For more, go to: http://www.isola-group.com/en/products/name/index.shtml Halogen Free Products Volume Products New Products http://www.isola-group.com/en/products/name/index.shtml http://www.isola-group.com/en/products/name/index.shtml Table of Contents for the Digital Edition of Printed Circuit Design & Fab - April 2008Printed Circuit Design & Fab - April 2008ContentsOur LineMarket WatchAround the WorldHappeningsROITip JarInterconnect StrategiesPositive PlatingImproving Fabrication Yields by DesignSolve Design Problems with Signal Integrity OptimizationLaser Direct Imaging Made EasyTroubleshooting the Innerlayer ProcessSIPS Give More to MooreOff the ShelfMarketplaceAd IndexBGA BulletinPrinted Circuit Design & Fab - April 2008Printed Circuit Design & Fab - April 2008 - (Page Belly1)Printed Circuit Design & Fab - April 2008 - (Page Belly2)Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover1)Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover2)Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page 1)Printed Circuit Design & Fab - April 2008 - Contents (Page 2)Printed Circuit Design & Fab - April 2008 - Contents (Page 3)Printed Circuit Design & Fab - April 2008 - Our Line (Page 4)Printed Circuit Design & Fab - April 2008 - Our Line (Page 5)Printed Circuit Design & Fab - April 2008 - Market Watch (Page 6)Printed Circuit Design & Fab - April 2008 - Market Watch (Page 7)Printed Circuit Design & Fab - April 2008 - Market Watch (Page 8)Printed Circuit Design & Fab - April 2008 - Market Watch (Page 9)Printed Circuit Design & Fab - April 2008 - Around the World (Page 10)Printed Circuit Design & Fab - April 2008 - Around the World (Page 11)Printed Circuit Design & Fab - April 2008 - Around the World (Page 12)Printed Circuit Design & Fab - April 2008 - Around the World (Page 13)Printed Circuit Design & Fab - April 2008 - Happenings (Page 14)Printed Circuit Design & Fab - April 2008 - Happenings (Page 15)Printed Circuit Design & Fab - April 2008 - ROI (Page 16)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast1)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast2)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast3)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast4)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast5)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast6)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast7)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast8)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast9)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast10)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast11)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast12)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast13)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast14)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast15)Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast16)Printed Circuit Design & Fab - April 2008 - ROI (Page Insert1)Printed Circuit Design & Fab - April 2008 - ROI (Page Insert2)Printed Circuit Design & Fab - April 2008 - ROI (Page Insert3)Printed Circuit Design & Fab - April 2008 - ROI (Page Insert4)Printed Circuit Design & Fab - April 2008 - ROI (Page 17)Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 18)Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 19)Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 20)Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 21)Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 22)Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 23)Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 24)Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 25)Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 26)Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 27)Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 28)Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 29)Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 30)Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 31)Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 32)Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 33)Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 34)Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 35)Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 36)Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 37)Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 38)Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 39)Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 40)Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 41)Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 42)Printed Circuit Design & Fab - April 2008 - Off the Shelf (Page 43)Printed Circuit Design & Fab - April 2008 - Marketplace (Page 44)Printed Circuit Design & Fab - April 2008 - Marketplace (Page 45)Printed Circuit Design & Fab - April 2008 - Marketplace (Page 46)Printed Circuit Design & Fab - April 2008 - Ad Index (Page 47)Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page 48)Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover3)Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover4)http://www.nxtbookMEDIA.com

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