Printed Circuit Design & Fab - April 2008 - (Page Insert1) CLEARSignals Published by . . . $ UYEMURA INTERNATIONAL CORPORATION “All that Glitters . . .” www.uyemura.com Mil-Aero Supplier Gains Competitive Edge by Reining-in Gold Costs Hunter Technology Corp. (Santa Clara, CA) provides a complete range of EMS: Design and Layout, Fabrication, Assembly, Contract Manufacturing, and Test and Systems Integration. The company specializes in both quick-turn prototype and production quantities, and is Mil-PRF-55110 G certified to 18 layers, as well as J Standard and NASA Certified. Continued on page 2 Non-metallic Additive Stunts Tin Whiskers (Now, the force CAN be with you) Uyemura recently introduced an electrolytic tin that’s highly effective in preventing “tin whiskers” on connectors and other components. The process is ideal for the plating of lead frames. Electrolytic tin-lead plating has historically been used to prevent oxidation and improve soldering. But the increasing popularity of tin plating has worsened the phenomena known as “tin whiskers,” needlelike metal crystals that sprout on tin-finished surfaces, often resulting in current leakage and shorting. Using additives other than tin-silver for plating prevents the problem, but is very costly. “GRX-70” is highly effective in limiting tin whiskers to 3-5 microns, about half the normal length. The smaller, more uniform crystals distribute the expansion force that occurs at the interface – the force behind tin whisker growth. http://uyemura.com
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