Printed Circuit Design & Fab - April 2008 - (Page PCBEast8) PROFESSIONAL DEVELOPMENT Professional Development Certificate Program Eleven courses are available in this year’s Professional Development Certificate Program—three 2-day Design Excellence Curriculum courses (DECs) and eight 1-day Tutorials (T courses). These technical courses are taught by industry experts who will provide you with the technology, theory, application and best practice information that you need to achieve professional growth and development. You’ll receive a certificate of completion for each Professional Development course that you attend and complete. Note: Professional Development courses are NOT included on the Technical Conference Proceedings CD-ROM. TWO-DAY DEC COURSES SUN MAY 11 and MON MAY 12 | 9 AM - 5 PM DEC 1 - High-Speed Design Speaker: Lee Ritchey, Speeding Edge This two-day course will cover the design of high-speed PCBs and their associated systems. It covers all the physics involved in high-speed design, explaining the science behind each one of the principles, their role in high-speed systems and how to properly manage the design process to account for them. This course will give the engineering professional the fundamental knowledge necessary to make the most efficient design rule set, organize the design process to efficiently execute the design, select the appropriate PCB materials and choose the toolsets that will best suit the design process. This course is especially relevant to IC designers as device speeds outstrip the traditional packages and application notes. NEW! of Fine-Pitch and High I/O Devices” by Happy Holden. Topics to be discussed include: BGA/LGA layout, design rules and stackup, microvia structures, simplifying multilayers, designing blind and buried vias, using channel routing to reduce layers and more. Day 2, Part 2 will feature “Advanced Hands-On Design Challenges with HDI “ by Fitts. This hands-on session will take principles learned earlier in the course and show attendees how to apply them. Microvia channels, device breakout, boulevard creation and autorouting will be practiced. capacitance must be optimized. Proper via placement for return current pathway minimization, laying out digital/analog interfaces, pours (Cu filles) and splits must be carefully analyzed. This full-day tutorial will illustrate a layout process that achieves 0.1 Ohm up to the knee frequency and provides methods to minimize serial/parallel resonance and achieve constant ESR. FRI MAY 16 | 9 AM - 5 PM NEW! ONE-DAY TUTORIALS SUN MAY 11 | 9 AM - 5 PM T1 - Control of EMI and Crosstalk in PCBs Speaker: Rick Hartley, L-3 Communication, Avionics Systems The Problem! When a time-varying (AC) current flows, an electric field and a magnetic field are present. These fields, when not controlled, are the cause of EMI and crosstalk. In recent years, the effects of these fields has increased dramatically in digital circuits due to ICs with very fast rise and fall times. The Solution! An emanating electromagnetic field will travel outward from the source until captured by its 180-degree compliment. The most effective place to capture and take control of these fields is with proper PCB design. This fullday tutorial provides a crisp focus on the issues PCB designers and engineers need to know. It will cover: basic circuit and PCB properties; where high speed currents actually flow; why EMI and crosstalk are on the rise; types of EMI; source control of EMI; correct power distribution and decoupling; correct component positions; cables and other EMI radiators; divided planes and plane islands in the PCB; and much more. NEW! T4 - High-Speed Clock Control Speaker: Robert Hanson This full-day tutorial will discuss the issues of skin effect, proximity and dielectric loss on transmission characteristics. Frequency and lumped/distributed traces will be examined as to the need for terminators. Active/quiescent power, capacitive loads, logic types, dielectrics, ISI, SSO and ground bounce and their effect on high-speed clocking will be examined. Edge rate harmonics, pre-emphasis, harmonic amplification, PAM 4 coding and line length vs. attenuation will be covered. NEW! DEC 2 - Electrical Principles: Digital Circuits and Electrical Systems Speaker: Ralph Morrison, consultant This two-day course is a review of the basic principles of electrical behavior. It covers the electric field, the magnetic field, definitions of voltage, capacitance and inductance, shielding principles, dielectrics, permeability, transformer action, Lenz’s law and analog circuits. In addition, common impedance coupling, common-mode rejection, transformer shielding, energy storage in circuits, decoupling, basic transmission line theory, stripline, microstrip, buried microstrip, reflections, characteristic impedance, line matching, shorts and opens will also be discussed. The discussion also will include balanced lines, ground planes, breaks in ground planes, power planes, energy stored in the ground/power plane, energy time delays, energy transport, traces jumping planes, vias, board radiation, cross coupling, ohms per square, skin effect, spectrum of waveforms, and mixing analog and digital and much more. T5 - PCB Design for RF Applications Speaker: Andy Kowalewski, SyChip Attendees: Any reasonably experienced board designer who wants a basic understanding of some of the special issues involved in PCB design for RF applications. This full-day tutorial will provide a practical guide to the many issues facing the modern PCB designer. The circuit board has become a critical element in the design of RF circuits and has its own special characteristics, which dramatically affects the way a design will function. Issues of laminate selection, stackup planning and impedance control will be covered in depth to achieve an understanding of the problems and their solutions. Placement and routing strategies will be discussed in detail, with reference to practical circuits and their special needs when designing for RF applications. The course will cover the basic RF concepts of wavelength, frequency spectrum, modulation, power measurement and capacitance, inductance, resonance, impedance, and more. T2 - The Basics of PCB Layout Speaker: Susy Webb, Fairfield Industries PCB design can be a complex field. Technical articles and sessions are often very in-depth and can be difficult for the novice designer to understand. This full-day tutorial is aimed for that beginning designer whether he or she is just starting out in this business, or is an engineer wanting to learn how to design his or her own boards. We will discuss understanding data sheet information, making symbols and footprints libraries, planning component placement and routing, designing the layer structure, review examples of routing strategies, and possible methods of finishing, saving, and outputting the boards. NEW DEC 3 - Design Challenges With HDI/Microvias Including Hands-On Design Speakers: Happy Holden, Mentor Graphics, and Mike Fitts, Plexus In this two-day class, an introduction to high density interconnect (HDI) will be followed up with stackups, design rules, materials and selection of PCB structures (blind, buried and microvias) that support the design of HDI circuits. IPC standards will be a particular focus area. Day 1, Part 1 will feature “Introduction to Advanced PCBs and Microvias (HDIs)” by Holden. This portion will discuss the benefits of HDI, micro-packaging density requirements, applications of HDI (microvias), technical processes, design rules, stackups and materials. Day 1, Part 2 will feature “Hands-On Design Challenges with HDI” by Fitts. This hands-on session will take principles learned earlier and give the attendee the opportunity to apply them to real-world designs. Previous toolset experience is suggested, and the ability to work as part of a team is mandatory. Day 2, Part 1 will feature “Design Challenges, Breakout and Routing T6 - Placement and Routing of Complex PCBs Speakers: Rick Hartley, L-3 Communication, and Susy Webb, Fairfield Industries The concepts behind parts placement and trace routing always seem to pique the interest of PCB designers, whether new to the profession or experienced veterans of 30+ years. The reality is that there is seldom one perfect way to place parts on a PCB. However, out of the hundreds or thousands of possible variations, there are usually only a few that make sense. Understanding how to determine what those few are is the secret to placement. Once parts are placed, there are hundreds of possibilities for routing the many transmission lines of the circuit. This full-day tutorial will focus on both the science behind placement and routing, and the opinions of the two instructors, who between them have 59 years experience in circuit and PCB design. This course will cover placement for optimum routing, placement “Rooms” (several views), and placement’s T3 - Everything You Need to Know About Bypassing, Including BGAs Speaker: Robert Hanson, Americom Seminars In today’s high-frequency designs, clock speeds of 1 GHz and edge rates less than 1 nsec are common. These high frequencies and their harmonics must be bypassed properly between power and ground to ensure power delivery, switching fidelity and control of radiated emissions. To ensure that the power delivery system meets its objectives, the intelligent placement, value, size and type of capacitors must be achieved. Also, at higher frequencies, the die and interplane PCB EAST 2008 | TINLEY PARK, IL | WWW.PCBEAST.COM http://WWW.PCBEAST.COM
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