Printed Circuit Design & Fab - April 2008 - (Page 14) HAPPENINGS EVENTS APRIL 1-3 IPC Printed Circuit Expo, APEX and the Designers Summit Mandalay Bay Resort & Convention Center Las Vegas, NV Contact: goipcshows.org SMTA Atlanta Expo Gwinnett Civic Center Duluth, GA Contact: Leslee Johns, leslee@smta.org FACES Flex-Ability Ltd. has announced the appointment of Pat Mannion as sales manager. Pat has extensive knowledge and experience in the PCB market and took up this new post in January 2008. He strenghens the existing sales team and will predominantly cover the North of England, Wales and Scotland. Mannion will also help to further develop the company’s export market, which currently accounts for 22 percent of sales. IPC has inducted Bob Neves, chairman and CTO of Microtek Laboratories, into the IPC Hall of Fame. Neves has been active with IPC since 1986, and has helped spur the IPC’s move into China. He also chaired the IPC’s California Circuits Association Council. The award is the association’s highest level of recognition, honoring members who make extraordinary contributions to IPC and the electronic interconnect industry. Multi-Fineline Electronix appointed Thomas Liguori as CFO and executive VP in February 2008. “Tom has a unique combination of experience in companies of various sizes and across a range of industries, which we believe make him a good fit for MFLEX, said Reza Meshgin, president and COO. ” Liguori has served as CFO at Hypercom and the Iomega Corp., as well as VP of finance at Teledyne and a cost analysis manager at Honeywell. IEC Electronics has announced the appointment of Michael Schlehr as corporate VP and CFO. Mr. Schlehr brings more than 20 years of experience to IEC. Mr. Schlehr has worked as VP of finance and administration for Robbins & Myers, and prior to that as director of operations accounting for Birdseye Foods Inc. Dick Tao, EDA sales executive, has been appointed by Emulation and Verification Engineering (EVE) to manage the company’s new direct sales office in Hinschu, Taiwan. Tao has more than 20 years experience marketing CAD and EDA tools. Most recently, Tao served as CoWare’s country manager for the Greater China Region, and has been country manager of Cadence Design Systems Taiwan and Mentor Graphics China. Tao is a graduate of Tamkang University in Taiwan. 17 23-25 KPCA Show Hosted by KPCA Seoul, Korea Contact: kpca-show.co.kr/index.php?lang=EN 29-30 3D/SiP/Advanced Packaging Symposium Sponsored by SMTA Washington Duke Inn & Golf Club Durham, NC Contact: melissa@smta.org 29-30 Summer Conference and Table Top Exhibition on PCB Technologies European Institute of Printed Circuits (EIPC) Dresden, Germany Contact: eipc.org 30-1 Nepcon East Boston Convention & Exhibition Center Boston, MA Contact: devicelink.com/expo/nepcon08 MAY 11-16 PCB EAST Holiday Inn Select & Convention Center Tinley Park, IL Contact: banglin@upmediagroup.com pcbeast.com 14 Endicott Technology Interchange Sponsored By IPC Endicott Interconnect Technologies Headquarters Endicott, New York Contact: MirandaTully@ipc.org 29-30 EIPC Summer Conference Hosted by EIPC Dresden, Germany Contact: eipc.org JUNE 11-13 JPCA Show Hosted by JPCA Tokyo, Japan Contact: jpcashow.com/show2008/English/index.html IT’S A DEAL A subsidiary of Isola, Polyclad Laminates Inc., recently completed license agreements with Suzhou Fukuda Metal Co. Ltd. (PRC) and Lee Chang Yung Technology Corp. (ROC) for Isola’s patented Drum Side Treated Foil (DSTF) technology. DSTF is an enabling technology for dense circuit formation and high-speed signal transmission. Additionally, DSTF lowers total cost of ownership of a processed interlayer when compared to standard shiny foils. Omni Graphics Ltd., of Vancouver, British Columbia, has agreed to install the first Ormecon Organic Metal Nanofinish line in Canada. Omni Graphics is an established Canadian printed circuit board manufacturer, focusing on quick 14 turn and prototyping printed circuits since 1985. Ormecon and Omni will be working together to promote Nanofinish which offers significant advantages over currently available PCB finishes. Suntron Corp. has announced an agreement to manufacture PCBs with Celco California Inc. for the Consumer Electronic market segment. Suntron will manufacture the products in its 79,000 square foot Tijuana, Mexico facility located near the California border. Valor Computerized Systems has appointed Silgal of Braga, Portugal as its representative in the electronics assembly market in the Iberian Penin- sula. Silgal is a well-known provider of equipment and solutions for assembly, inspection and rework, with more than 20 years of experience in the assembly market. Its customers are major electronics manufacturers such as Delphi Grundig, Blaukpunt, Bosch SS, Fagor, Celestica, Lear, Elcan, Denso, Bosch and others. ATG Luther & Maelzer GmbH has received the IF Product Design Award for outstanding industrial design for the company’s PCB Universal Grid tester LM800, and Flying Probe tester S1. Both systems can be seen at the upcoming CPCA show in Shanghai and KPCA show in Seoul. APRIL 2008 PRINTED CIRCUIT DESIGN & FAB http://goipcshows.org http://kpca-show.co.kr/index.php?lang=EN http://eipc.org http://devicelink.com/expo/nepcon08 http://pcbeast.com http://eipc.org http://www.jpcashow.com/show2008/English/
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - April 2008 Printed Circuit Design & Fab - April 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Positive Plating Improving Fabrication Yields by Design Solve Design Problems with Signal Integrity Optimization Laser Direct Imaging Made Easy Troubleshooting the Innerlayer Process SIPS Give More to Moore Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - April 2008 Printed Circuit Design & Fab - April 2008 - (Page Belly1) Printed Circuit Design & Fab - April 2008 - (Page Belly2) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover1) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover2) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page 1) Printed Circuit Design & Fab - April 2008 - Contents (Page 2) Printed Circuit Design & Fab - April 2008 - Contents (Page 3) Printed Circuit Design & Fab - April 2008 - Our Line (Page 4) Printed Circuit Design & Fab - April 2008 - Our Line (Page 5) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 8) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 9) Printed Circuit Design & Fab - April 2008 - Around the World (Page 10) Printed Circuit Design & Fab - April 2008 - Around the World (Page 11) Printed Circuit Design & Fab - April 2008 - Around the World (Page 12) Printed Circuit Design & Fab - April 2008 - Around the World (Page 13) Printed Circuit Design & Fab - April 2008 - Happenings (Page 14) Printed Circuit Design & Fab - April 2008 - Happenings (Page 15) Printed Circuit Design & Fab - April 2008 - ROI (Page 16) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast1) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast2) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast3) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast4) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast5) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast6) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast7) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast8) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast9) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast10) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast11) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast12) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast13) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast14) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast15) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast16) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert1) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert2) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert3) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert4) Printed Circuit Design & Fab - April 2008 - ROI (Page 17) Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 18) Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 19) Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 21) Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 22) Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 23) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 24) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 25) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 26) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 27) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 28) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 29) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 30) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 31) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 32) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 33) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 34) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 35) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 36) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 37) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 38) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 39) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 40) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 41) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 42) Printed Circuit Design & Fab - April 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - April 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover4)
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