Printed Circuit Design & Fab - April 2008 - (Page 43)

MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE THERMALLY CONDUCTIVE LAMINATE ROLL-TO-ROLL FLEX PLATING ELECTROPLATING RECTIFIER A2D G3 reverse pulse plating rectifier is the first Smart Power Supply of its kind. The brain in this unit enables it to store intelligence for a large number of plating processes. Combined with our windows-based VPC controller software, it offers the ultimate in flexibility, while assuring accuracy, consistency and immediate response time. This cutting edge technology simplifies the DC to PPR upgrade or further improves an existing PPR process, while also making it more affordable and providing enhanced profitability. WHO: American Plating Power WEB: americanplatingpower.com R2R SVP is equipped with high-speed electrolytic plating cells designed for HDI production. Utilizes selective plating and subsequent soft/differential etching process, removing only the thin seeded layer, and therefore eliminating the need for a metallic etching mask and the use of conventional bulk metal etching chemistry. Designed to handle flexible PCB materials in roll form in a vertical orientation. Features include a unique electrolytic technology that minimizes the formation of planar surface copper nodules, a major contributor in all FPC fabrication yield. WHO: M.E. Baker Co. WEB: mebaker.com 91ML thermally conductive multilayer, epoxy laminate and prepreg compatible with lead-free solder processes. Provides a low-cost, lead-free solder compatibility system with enhanced heat transfer characteristics for applications requiring thermal management throughout the entire board. Applications include high brightness LEDs, DC-DC power converters and automotive electronics. The 91ML has throughplane thermal conductivity of 1.0 W/m-K and in-plane thermal conductivity of 2 W/m-K, a high decomposition temperature of >350˚C and is available in prepreg thicknesses starting at 0.003 inch. WHO: Arlon WEB: arlon-med.com OTHERS OF NOTE PCB DESIGN SOFTWARE Cadstar PCB design software with E series electro technical design to launch Cadstar E3 logic. Users can design PCBs in Cadstar while providing full integration within the software, allowing electrical and electronic engineers to work on the same design in parallel, reducing time-to-market. The product also integrates with specific MRP ERP and PDM systems. The company , claims that design integration at this level reduces design time, allowing initial layout coordination. WHO: Zuken WEB: zuken.com/cadstar_E3.logic DESIGN SOFTWARE MANAGEMENT Nexxim v4 and Designer v4 provide integrated schematic and design management software, enabling statistical analysis and transient simulation capabilities to simulate high-speed serial channels eliminating prototype iterations that delay time-to-market. Products use new methodology for eye analysis of serial links using statistical methods that maintain accuracy while offering reductions in run time. Designer v4 allows dynamic links to the company’s electromagnetic field simulation tools HFSS, SIwave and Q3D Extractor. WHO: Ansoft WEB: ansoft.com AUTOMATED EXPOSURE SYSTEM The ProForm Titanium is the new generation of the ProForm series of fully automatic UV exposure systems that delivers higher image resolution, registration accuracy and higher productivity. It features a new, easy to use Graphical Touchscreen HumanMachine Interface System. Proform imaging offers semi-automatic and fully automatic UV imaging systems with fully collimated and non-collimated light engines for PCB, HDI, rigid-flex, flexible circuits (roll-to-roll), and etched lead frames. WHO: Automata WEB: automa-tech.com AUTOMATED IMAGE TESTING AxioVision software solutions for fully automated image analysis of PCBs. The system utilizes digital microscopy. The advanced program uses pixel accuracy to perform various measurements on single or multiple images and generates results in seconds. The automatic measurement feature provides highly repeatable results, while eliminating operator error. Measurements include: copper thickness, dielectric thickness, overall thickness and hole copper thickness. WHO: Allied WEB: alliedhightech.com LDI DRY FILM Riston LDI7000 for LDI imaging is specifically designed for fine feature imaging with tent-and-etch to deliver high yields through improved tenting, resolution, process productivity and process latitude. Riston PlateMaster 300 dry film photoresist is specifically designed for fine feature pattern plating. It has improved adhesion, conformation and chemical resistance, tenting and stripping properties. Both products incorporate custom clean developer technology that improves yields and reduces operating costs. WHO: DuPont WEB: dupont.com WORK INSTRUCTION GENERATOR This product can generate a rules-driven manufacturing work instructions set (i.e. Lot Card/Traveler/Batchcard). Users can view the instructions electronically or print them as hard copies. When fully integrated with your ERP system, the operations list is transferred to the site manufacturing system. Product attributes, specific notes, standard instructions and graphic attachments form an integral part of the instructions. Easily imported into leading shop floor control systems. WHO: DirectLogix WEB: directlogix.com APRIL 2008 PRINTED CIRCUIT DESIGN & FAB 43 http://www.americanplatingpower.com http://www.mebaker.com http://www.arlon-med.com http://www.zuken.com/cadstar_E3.logic http://www.ansoft.com http://www.automa-tech.com http://www.directlogix.com http://www.alliedhightech.com http://www.dupont.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - April 2008

Printed Circuit Design & Fab - April 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Positive Plating Improving Fabrication Yields by Design Solve Design Problems with Signal Integrity Optimization Laser Direct Imaging Made Easy Troubleshooting the Innerlayer Process SIPS Give More to Moore Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - April 2008

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