Printed Circuit Design & Fab - April 2008 - (Page Insert4) Powerhouse Partners Expand Customer Service Capabilities in the Southwest, Northwest Two companies well-known to many of Uyemura’s PCB customers are adding substantial servicepower and resources in two key regions. Interconnect Sourcing in Colleyville (Dallas), Te x a s i s o w n e d by Mike Bennett, a 33-year veteran of Mike Bennett printed circuit manufacturing. He brings a wealth of hands-on knowledge as a former owner of printed circuit board shops, and years of experience in both manufacturing and engineering. The firm’s primary focus will be development of applications for Uyemura’s ENIG, silver and tin processes in Texas, Oklahoma, Louisiana and Arkansas. In the Pacific Northwest, LSG Inc., a firm well-known to many customers through its President, Lee Salazar, now represents Uyemura in Washington, Oregon and British Columbia. Salazar has worked extensively with all facets of printed circuit board assembly, including such specialized areas as chemistries for PCB waste treatment, since 1974. LSG is based in Snohomish, WA. Bennett and Salazar are both attending IPC, so if you’re reading this at the show, make booth #1273 part of your itinerary. Family Matters Uyemura is proud to recognize the excellent work of Peridot Rodgers-Liston, who is helping in the rebuilding of New Orleans via The St. Bernard Project. This program has as its primary mission the removal of barriers for families who want to move back to their homes. Founded by volunteers in March, 2006, it is directly driven by the specific needs expressed by community members. Peridot Rodgers-Liston is the daughter of Dr. David Liston, our Director of Quality. In partnership with European distributor, Umicore Galvanotechnik. Uyemura exhibited at the recent Prototronica International Trade Fair in Munich. The show encompassed every facet of electronics production: logistics, material flow, microproduction, organic electronics, photovoltaics and “green” manufacturing and disposal. The 4-day event, which drew more than 40,000 visitors, provided an excellent forum for meeting with customers from throughout Europe, Israel (where Tech-Knowledge is our distributor) and India (where distribution is managed by RBP), as well as Canada and South America. The global market for electronic components is projected to grow 6% to more than $410 billion US in 2008. “I’m going to California for the gold. I’m not into nation-building.” © The New Yorker Collection from cartoonbank.com. All Rights Reserved. UYEMURA INTERNATIONAL CORPORATION Corp HQ: 3990 Concours, #425 • Ontario, CA 91764 • ph: 909.466.5635 Tech Center: 240 Town Line Road • Southington, CT 06489 • ph: 860.793.4011 www.uyemura.com Better Products and Services Are Recognized and Rewarded! And for this we are very grateful! http://cartoonbank.com http://www.uyemura.com http://www.uyemura.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - April 2008 Printed Circuit Design & Fab - April 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Positive Plating Improving Fabrication Yields by Design Solve Design Problems with Signal Integrity Optimization Laser Direct Imaging Made Easy Troubleshooting the Innerlayer Process SIPS Give More to Moore Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - April 2008 Printed Circuit Design & Fab - April 2008 - (Page Belly1) Printed Circuit Design & Fab - April 2008 - (Page Belly2) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover1) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover2) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page 1) Printed Circuit Design & Fab - April 2008 - Contents (Page 2) Printed Circuit Design & Fab - April 2008 - Contents (Page 3) Printed Circuit Design & Fab - April 2008 - Our Line (Page 4) Printed Circuit Design & Fab - April 2008 - Our Line (Page 5) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 8) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 9) Printed Circuit Design & Fab - April 2008 - Around the World (Page 10) Printed Circuit Design & Fab - April 2008 - Around the World (Page 11) Printed Circuit Design & Fab - April 2008 - Around the World (Page 12) Printed Circuit Design & Fab - April 2008 - Around the World (Page 13) Printed Circuit Design & Fab - April 2008 - Happenings (Page 14) Printed Circuit Design & Fab - April 2008 - Happenings (Page 15) Printed Circuit Design & Fab - April 2008 - ROI (Page 16) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast1) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast2) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast3) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast4) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast5) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast6) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast7) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast8) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast9) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast10) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast11) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast12) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast13) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast14) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast15) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast16) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert1) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert2) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert3) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert4) Printed Circuit Design & Fab - April 2008 - ROI (Page 17) Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 18) Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 19) Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 21) Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 22) Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 23) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 24) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 25) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 26) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 27) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 28) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 29) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 30) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 31) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 32) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 33) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 34) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 35) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 36) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 37) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 38) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 39) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 40) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 41) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 42) Printed Circuit Design & Fab - April 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - April 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover4)
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