Printed Circuit Design & Fab - April 2008 - (Page PCBEast10) TECHNICAL CONFERENCE All technical sessions (F courses)are free to attend. Registration and a PCB East badge (conference, expo, speaker or exhibitor) are required for entry. Seating is limited and is first-come, first-served. FREE Tuesday Sessions TUE MAY 13 | 1 PM – 2 PM NEW! F3 - Transition to (RoHS) Restriction of Hazardous Substances Speaker: Jeffrey Benes, Catalyst Manufacturing Effective July 1, 2006, the European Union (EU) implemented its mandate that all manufactured products being shipping into Europe must comply with RoHS requirements, with the most major element being lead. Because of these materials restrictions, the entire supply chain has had to modify its current commodities and services, including components, inventories, material composition and automated ERP software, equipment purchases, product testing and product exemptions. The challenge for manufacturing service providers is to set-up a supply chain that can support RoHS compliant materials and convert manufacturing documents and processes to support the requirements of RoHS; to test and provide evidence of compliancy; and to maintain manufacturing records in the event product is challenged by end users. This session will cover the various materials not allowed for use in product manufacturing and examine the changes that have occurred because of the mandate. TUE MAY 13 | 8:30 AM – 10 AM NEW! Next- Generation EDA Tools Panel Session Moderator: PCD&F Editor Kathy Nargi-Toth See page 4. TUE MAY 13 | 10 AM – 10:30 AM NEW! The power distribution section of a PCB is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise, to say nothing of the severely increased possibilities for EMI. Low impedance in the power bus across the range of harmonic frequencies of a digital circuit is critical. This two-hour workshop will cover the major components of the power bus, the power distribution path, medium- and high-frequency decoupling concerns, the importance of IC pin assignments, placement of decoupling, real performance of capacitors (verses myth), how much decoupling is enough, why use one value of capacitor, anti-resonant peaks, the importance and performance of power/ ground planes and the importance of board stack. NEW! F1 - PCB Design Using the Metric System Speaker: Andy Kowalewski, SyChip With each passing moment, more components are being supplied with mechanical specifications based on metric units of measurement. The component packaging industry is becoming increasingly global and has made a strong commitment to using metric units because most of the world is working in metric. As a result, board designers are using more metric parts, and it is becoming progressively more difficult to work intuitively in both imperial and metric units. This free technical session will present some of the practical issues arising from the transition to design with metric units and will show a path that will make the transition easier and less painful to the board designer. Common measurements will be discussed, and useful conversion “rules of thumb” will be presented. W5 - PCB Cost Modeling—How Designers Affect PCB Costs Speaker: Richard Snogren, Bristlecone Technology, volume, and time affect the PCB costs. It is essential that PCB designers understand these relationships and how they affect the cost basis for PCBs they are designing. This course provides a systematic view of PCB cost drivers and how they can be optimized during the design phase. Attendees will learn techniques to access and affect PCB costs during the design process. TUE MAY 13 | 2 PM – 3 PM NEW! F4 - If You Can Make It, They Can Fake It: Counterfeit Parts and China Speaker: David Ackerman, Ackerman-USA According to the International Chamber of Commerce Counterfeiting Intelligence Bureau, counterfeit product represents as much as 7% of total world trade – that translates to more than $550 billion in lost revenues for legitimate companies annually. This free session will focus on what you need to know to minimize this problem for your business; how to detect counterfeit parts, how to conduct in-house testing and how to utilizie third-party testing houses. The session also will give you guidance on how to be a proactive buyer and to know who you’re buying from. You will learn about the efforts being made to overcome this counterfeit problem, and how you can be involved. In short, you will learn how to recognize the problem, minimize risk and become part of the solution! W6 - Implementing Advanced Technologies: How to Achieve Success Within Your Organization Speaker: Mike Fitts, Plexus You’ve been doing your homework and thoroughly investigating a technology that has never been used at your company. You have gotten to the point of believing that the technology has some real merit. Now what? How do you go about “selling” this technology within your company? Anyone who has been successful at “bringing a new technology into a company” knows the challenges associated with what typically is a long, drawn-out process of getting buy-in for a new technology. This two-hour workshop will provide attendees with the knowledge to help achieve buy-in from their internal organizations as they move to implement an advanced technology. We will focus on identifying who the various stakeholders within your organization are and how to “sell” to them. NEW! TUE MAY 13 | 10 AM – 11 AM NEW! F2 - Death of a PCB Salesman Speaker: Greg Papandrew, Bare Board Group Domestic PCB salesmen are getting hit by a lot of flak in the today’s global market, and it is not because of China. They are being hit by friendly fire! North American PCB manufacturers have overlooked the importance of maintaining a proper sales force, and in doing so, they are killing their own business.Forget fancy plating tanks, drill machines and new technologies. The PCB business needs to develop better services and marketing plans, and it needs to focus on building stronger customer relationships. Covering topics that are crucial to the circuit board industry, this free session is packed with marketing wisdom that PCB salesmen, sales managers and owners of board manufacturing companies can use to make a lasting impact on their business and on their careers. These are not quick fixes. They are real, long-term solutions to long-term problems. The session offers a methodology for building solid marketing plans—both internal and external—and strengthening customer service. Attendees can expect to find out how to get results and increase business. This seminar is a must for those who want to remain competitive in an increasingly challenging marketplace. TUE MAY 13 | 3 PM – 5 PM NEW! F5 - Thoughts on Founding and Operating a Small, High-Tech Company Speaker: Ron Schaefer, PhotoMachining This free session will discuss founding, operating and exiting a small, high-tech company. First, we will explore the reasons one might consider in founding his/her own company. Then we will discuss staffing, hiring the right people (and firing the wrong ones), purchasing equipment and facilities, marketing, sales, and related topics. The information is presented in a casual and humorous way from the point of view of a technologist involved in the business rather than from an “MBA” viewpoint. All information has been learned in the field in practical venues. W7 - Intro to Micromachining Using Lasers Speaker: Ron Schaefer, PhotoMachining This two-hour workshop will discuss several different aspects of laser micromachining technology, and will feature a comparative review of laser technologies, including CO2, excimer, Nd:YAG and fiber lasers. You will learn to: compare UV, IR and other laser sources to each other and learn where each is best applied; describe and be familiar with several kinds of micromachining lasers on the market; understand material/photon interaction and why UV lasers for instance are different than IR lasers; list and investigate several laser beam delivery techniques; and identify familiar real-world applications from the medical, microelectronics, aerospace and other fields. TUE MAY 13 | 11 AM – 12 Noon NEW! Keynote Address Collaboration Across Technology Speaker: Emad Isaac, chief technical officer, The Morey Corp. Visit www.pcbeast.com for details. WED MAY 14 | 9 AM – 11 AM NEW! W4 - Power System Design in High-Speed PCBs Speaker: Rick Hartley, L-3 Communications, Avionics Systems W8 - The Challenge of Selling Value in Today’s Complex Supply Chains Speaker: Louis De Rose, DeRose & Associates The supply chain is a process and organizational structure that integrates the material and information flow from initial source of supply through ultimate PCB EAST 2008 | TINLEY PARK, IL | WWW.PCBEAST.COM http://www.pcbeast.com http://WWW.PCBEAST.COM
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - April 2008 Printed Circuit Design & Fab - April 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Positive Plating Improving Fabrication Yields by Design Solve Design Problems with Signal Integrity Optimization Laser Direct Imaging Made Easy Troubleshooting the Innerlayer Process SIPS Give More to Moore Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - April 2008 Printed Circuit Design & Fab - April 2008 - (Page Belly1) Printed Circuit Design & Fab - April 2008 - (Page Belly2) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover1) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover2) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page 1) Printed Circuit Design & Fab - April 2008 - Contents (Page 2) Printed Circuit Design & Fab - April 2008 - Contents (Page 3) Printed Circuit Design & Fab - April 2008 - Our Line (Page 4) Printed Circuit Design & Fab - April 2008 - Our Line (Page 5) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 8) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 9) Printed Circuit Design & Fab - April 2008 - Around the World (Page 10) Printed Circuit Design & Fab - April 2008 - Around the World (Page 11) Printed Circuit Design & Fab - April 2008 - Around the World (Page 12) Printed Circuit Design & Fab - April 2008 - Around the World (Page 13) Printed Circuit Design & Fab - April 2008 - Happenings (Page 14) Printed Circuit Design & Fab - April 2008 - Happenings (Page 15) Printed Circuit Design & Fab - April 2008 - ROI (Page 16) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast1) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast2) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast3) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast4) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast5) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast6) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast7) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast8) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast9) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast10) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast11) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast12) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast13) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast14) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast15) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast16) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert1) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert2) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert3) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert4) Printed Circuit Design & Fab - April 2008 - ROI (Page 17) Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 18) Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 19) Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 21) Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 22) Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 23) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 24) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 25) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 26) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 27) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 28) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 29) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 30) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 31) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 32) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 33) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 34) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 35) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 36) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 37) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 38) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 39) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 40) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 41) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 42) Printed Circuit Design & Fab - April 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - April 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover4)
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