Printed Circuit Design & Fab - April 2008 - (Page PCBEast7) CONFERENCE-AT-A-GLANCE 10 am - 3 pm Exhibits Open 1:30 pm - 3:30 pm S13 - NEW! The Fabrication Speaker: Gary Ferrari, FTG Circuits - NEW! Using the Schematic for Process: A Hands- On Experience for Designers Friday, May 16 8 am - 10 am Technical Conference courses W9 - Cost of Embedding PassiveComponents – Find the Truth Reliably and Easily Registration 9 am - 5 pm S14 Component Placement Speaker: Andy Kowalewski, SyChip Speaker: Richard Snogren, Bristlecone 12:30 pm - 1:30 pm W10 - NEW! The Importance of Lunch break for TC attendees 1:30 pm - 5 pm Professional Development Certificate Program courses T4 - NEW! High-Speed Clock Control Speaker: Robert Hanson Accounting for Design Variants Throughout the Entire PCB Flow Speaker: John Peloso, Mentor Graphics 1:30 pm - 5 pm Technical Conference courses S7 - NEW! Differential Signaling: Tradeoffs for Optimization of Signal Quality and Routing Speaker: Robert Hanson, Americom Seminars Technical Conference courses S15 - NEW! Vias and Their Effects on High-Speed Signals Speaker: Robert Hanson, Americom T5 - NEW! PCB Design for RF Applications Speaker: Andy Kowalewski, SyChip T6 - Placement and Routing of Speakers: Rick Hartley, L-3 Communication, - NEW! DFM: A Foundation for S16 - Routing and Terminating High Complex PCBs Speed Transmission Lines Speaker: Rick Hartley, L-3 Communications, Avionics Systems T7 S17 - Fundamentals of Geometric Cost-Reduction Efforts Speaker: Gary Ferrari, FTG Circuits Speaker: Charles Pfeil, Mentor Graphics S8 - Practical Guidelines for Signal Integrity, EMI and Board Layout Speaker: Susy Webb, Fairfield Industries Dimensioning and Tolerancing (GD&T) for the PCB Designer Speaker: Gary Ferrari, FTG Circuits T8 - BGA Challenges 12 noon - 1 pm S9 - Designing with Flex in Mind Speakers: Mark A. Verbrugge and Mark Finstad, Minco Products S10- NEW! Breaking New Ground in Speakers: Per Viklund and Loy D’Souza, Mentor Graphics - NEW! An Introduction to S18 - NEW! Advanced Interconnect Speaker: Happy Holden, Mentor Graphics - NEW! Make the Most of Your (HDI) Design & Technologies Professional Development Attendee Lunch PCB RF Design S19 Design Time S11 Speaker: Susy Webb, Fairfield Industries Cadence Allegro PCB SI Flow S20 - NEW! PCB Design with Speaker: Andy Kowalewski, SyChip Speaker: Matthew Harms, EMA Design Automation Flip-Chip Components Thursday, May 15 8 am - 2:30 pm Registration 9 am - 11 am Technical Conference courses W11 - BGA Fanout Patterns Speaker: Charles Pfeil, Mentor Graphics W12 - Designing Boards for Fabrication In Asia Speaker: Happy Holden, Mentor Graphics W13 - Ten Questions, Observations and Insights to Measure Confidence in a PCB Manufacturing Facility: One Negative May Send You Walking Away Speaker: Richard Snogren, Bristlecone 9 am - 12:30 pm Technical Conference courses S12 - RF/Microwave and MixedSignal PCB Design Speaker: Rick Hartley, L-3 Communications, Avionics Systems EARLY-BIRD DISCOUNT DEADLINE | REGISTER BY APRIL 10 AND SAVE UP TO $100!
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - April 2008 Printed Circuit Design & Fab - April 2008 Contents Our Line Market Watch Around the World Happenings ROI Tip Jar Interconnect Strategies Positive Plating Improving Fabrication Yields by Design Solve Design Problems with Signal Integrity Optimization Laser Direct Imaging Made Easy Troubleshooting the Innerlayer Process SIPS Give More to Moore Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - April 2008 Printed Circuit Design & Fab - April 2008 - (Page Belly1) Printed Circuit Design & Fab - April 2008 - (Page Belly2) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover1) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page Cover2) Printed Circuit Design & Fab - April 2008 - Printed Circuit Design & Fab - April 2008 (Page 1) Printed Circuit Design & Fab - April 2008 - Contents (Page 2) Printed Circuit Design & Fab - April 2008 - Contents (Page 3) Printed Circuit Design & Fab - April 2008 - Our Line (Page 4) Printed Circuit Design & Fab - April 2008 - Our Line (Page 5) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 8) Printed Circuit Design & Fab - April 2008 - Market Watch (Page 9) Printed Circuit Design & Fab - April 2008 - Around the World (Page 10) Printed Circuit Design & Fab - April 2008 - Around the World (Page 11) Printed Circuit Design & Fab - April 2008 - Around the World (Page 12) Printed Circuit Design & Fab - April 2008 - Around the World (Page 13) Printed Circuit Design & Fab - April 2008 - Happenings (Page 14) Printed Circuit Design & Fab - April 2008 - Happenings (Page 15) Printed Circuit Design & Fab - April 2008 - ROI (Page 16) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast1) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast2) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast3) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast4) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast5) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast6) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast7) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast8) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast9) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast10) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast11) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast12) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast13) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast14) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast15) Printed Circuit Design & Fab - April 2008 - ROI (Page PCBEast16) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert1) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert2) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert3) Printed Circuit Design & Fab - April 2008 - ROI (Page Insert4) Printed Circuit Design & Fab - April 2008 - ROI (Page 17) Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 18) Printed Circuit Design & Fab - April 2008 - Tip Jar (Page 19) Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 20) Printed Circuit Design & Fab - April 2008 - Interconnect Strategies (Page 21) Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 22) Printed Circuit Design & Fab - April 2008 - Positive Plating (Page 23) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 24) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 25) Printed Circuit Design & Fab - April 2008 - Improving Fabrication Yields by Design (Page 26) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 27) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 28) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 29) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 30) Printed Circuit Design & Fab - April 2008 - Solve Design Problems with Signal Integrity Optimization (Page 31) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 32) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 33) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 34) Printed Circuit Design & Fab - April 2008 - Laser Direct Imaging Made Easy (Page 35) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 36) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 37) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 38) Printed Circuit Design & Fab - April 2008 - Troubleshooting the Innerlayer Process (Page 39) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 40) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 41) Printed Circuit Design & Fab - April 2008 - SIPS Give More to Moore (Page 42) Printed Circuit Design & Fab - April 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - April 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - April 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - April 2008 - BGA Bulletin (Page Cover4)
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