Printed Circuit Design & Fab - May 2008 - (Page 12) HAPPENINGS EVENTS MAY 7-9 13th Symposium on Polymers for Microelectronics Winterthur Museum & Gardens Winterthur, Delaware Contact: symposiumonpolymers.com Nepcon Vietnam Hanoi International Center for Exhibition Contact: nepconvietnam.com FACES Gideon Kemen has been named vice president of Field Operations for Europe, the Middle East and Africa (EMEA) for Cadence Design Systems. His responsibilities will include sales and technical field operations in the region and he will be stationed at the company’s European office in Bracknell, England. Francis Yuen has been named as board director for the Merix Corporation. Yuen has been an executive with the company since September 2003. Adi Kahn will assume the position of president of Orbotech Inc., the North American subsidiary of Orbotech Ltd. Kahn joined Orbotech Inc. in 2004 as vice president of finance and operations. He was most recently executive vice president of the subsidiary. His appointment follows the new assign of Barry Cohen (previous president and CEO) as general manager, Orbograph Ltd., a company subsidiary. David R. Dahlquist has been appointed as director of marketing for Park Electrochemical Corp. Dahlquist previously held the position of product director at Park Electrochemical and has worked with Photocircuits Corp. as director of technology and director of quality and engineering in Asia. Harvey Dorren has been appointed western regional sales manager for Global Innovation. Dorren has more than 28 years of industry experience, with executive experience in high technology companies that include Cadence Design Systems, Palpilot, Circuit Images, Lenthor Engineering, Paralex, and Speedy Circuits. Reza Meshgin has been named CEO of Multi-Fineline Electronix. Meshgin holds a bachelor’s of science degree in electrical engineering from Wichita State University in Kansas and a master’s in business administration from University of California in Irvine. Michael Schlehr has been appointed corporate VP and CFO of IEC Electronics. Schlehr brings more than 20 years of experience to IEC, and has worked as VP of finance and administration for Robbins & Myers, and director of operations accounting for Birdseye Foods Inc. 8-10 11-16 PCB EAST Holiday Inn Select & Convention Center Tinley Park, IL Contact: banglin@upmediagroup.com, pcbeast.com 14 Endicott Technology Interchange Sponsored By IPC Endicott Interconnect Technologies Headquarters Endicott, New York Contact: MirandaTully@ipc.org 29-30 EIPC Summer Conference Hosted by EIPC Dresden, Germany Contact: eipc.org JUNE 3-6 Nepcon Malaysia 2008 Penang International Sports Arena Penang, Malaysia Contact: nepcon.com.my SMT/Hybrid/Packaging 2008 Mesago Messe Frankfurt Nuremberg, Germany Contact: smt-exhibition.com 3-5 8-13 45th Design Automation Conference Anaheim Convention Center Anaheim, CA Contact: dac.com 11-13 JPCA Show Hosted by JPCA Tokyo, Japan Contact: jpcashow.com/show2008/English/index.html JULY 15-17 Componex Nepcon Chennai 2008 Chennai Trade Center Chennai, India Contact: componex-nepcon.com 15-17 Semicon West Moscone Center San Francisco, CA Contact: semiconwest.org/index.htm IT’S A DEAL Applied Micro Circuits, Vietnam National University, and Mentor Graphics have signed an agreement to collaborate on EDA educational courses for two new electronic design laboratories. Under the direction of the Mentor’s Higher Education Program (HEP), Mentor will donate over $20 million worth of EDA software to expand academic programs and enable students of VNUHCM to graduate with knowledge of the latest ASIC design and verification and PCB design and analysis. Valor Computerized Systems has established a technological partnership with Nagoya Electric of Japan, a developer of Automatic Inspection (AOI) equipment. The alliance will allow 12 users of Nagoya’s inspection machines to reportedly shorten setup time by accessing specific data containing a representation of component geometry based on Valor’s Part Library (VPL). Agilent Technologies has announced that Finisar has selected its Advanced Design System (ADS) software for the development of optics products designed for the telecom market. The ADS software platform includes the Signal Integrity Design Suite and the Ptolemy system simulator. Finisar develops, manufactures fiber optic components and subsystems using their patented lasers to enable telecommunications equipment manufacturers to provide a claimed longer reach optical transmission, at lower cost with better performance and less complexity. Chemcut Corp. has announced that ITL Circuits will install a Chemcut 8000 Strip-Etch-Strip system in its production facility in Markham, Ontario. ITL Circuits is a PCB manufacturer that produces single-sided boards to multilayer PCBs for commercial, military, telecommunications, medical, industrial, and aerospace applications. Chemcut Corporation, developed spray etching, a technique that made the chemical etching process practical for volume, as well as prototype production. MAY 2008 PRINTED CIRCUIT DESIGN & FAB http://www.symposiumonpolymers.com http://www.nepconvietnam.com http://www.pcbeast.com http://www.eipc.org http://www.nepcon.com.my http://www.smt-exhibition.com http://www.dac.com http://www.jpcashow.com/show2008/English/index.html http://www.componex-nepcon.com http://www.semiconwest.org/index.htm
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - May 2008 Printed Circuit Design & Fab - May 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC For the Real World PCB East Conference Brochure Positive Plating Don't Let your Signals Stub Their Toes Improve PCB Layout With Skill Utility Programs The Next Generation Design Tool Challenge Thermally Conductive Microwave Materials PCB Dielectric Degradation in Lead-Free Assembly Applications A Tale of Two Trade Shows Eliminating Board Defects Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - May 2008 Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page Cover1) Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page Cover2) Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page 1) Printed Circuit Design & Fab - May 2008 - Contents (Page 2) Printed Circuit Design & Fab - May 2008 - Contents (Page 3) Printed Circuit Design & Fab - May 2008 - Our Line (Page 4) Printed Circuit Design & Fab - May 2008 - Our Line (Page 5) Printed Circuit Design & Fab - May 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - May 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - May 2008 - Around the World (Page 8) Printed Circuit Design & Fab - May 2008 - Around the World (Page 9) Printed Circuit Design & Fab - May 2008 - Around the World (Page 10) Printed Circuit Design & Fab - May 2008 - Around the World (Page 11) Printed Circuit Design & Fab - May 2008 - Happenings (Page 12) Printed Circuit Design & Fab - May 2008 - Happenings (Page 13) Printed Circuit Design & Fab - May 2008 - ROI (Page 14) Printed Circuit Design & Fab - May 2008 - ROI (Page 15) Printed Circuit Design & Fab - May 2008 - EMC For the Real World (Page 16) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-1) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-2) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-3) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-4) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-5) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-6) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-7) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-8) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-9) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-10) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-11) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-12) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-13) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-14) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-15) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-16) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page 17) Printed Circuit Design & Fab - May 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - May 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 20) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 21) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 22) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 23) Printed Circuit Design & Fab - May 2008 - Improve PCB Layout With Skill Utility Programs (Page 24) Printed Circuit Design & Fab - May 2008 - Improve PCB Layout With Skill Utility Programs (Page 25) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 26) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 27) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 28) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 29) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 30) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 31) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 32) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 33) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 34) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 35) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 36) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 37) Printed Circuit Design & Fab - May 2008 - A Tale of Two Trade Shows (Page 38) Printed Circuit Design & Fab - May 2008 - A Tale of Two Trade Shows (Page 39) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 40) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 41) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 42) Printed Circuit Design & Fab - May 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - May 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page Cover4)
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