Printed Circuit Design & Fab - May 2008 - (Page 2)

MAY 2008 • VOL. 25 • NO. 5 FEATURES PCBs designed with components too close to the edge create assembly problems and can negatively impact yields. Photo courtesy of Nexlogic 20 SIGNAL INTEGRITY Don’t Let Your Signals Stub Their Toes Tame the stubs by keeping the length short, restricting signal layer transitions, and using back-drilling in multigigabit applications. by DR. ERIC BOGATIN 24 PCB BASICS POINT OF VIEW 4 OUR LINE Trusted sources. Improve PCB Layout With Skill Utility Programs PCB design bottlenecks are reduced using customized tools. by ARBEL NISSAN 26 FROM THE FIELD Kathy Nargi-Toth 14 ROI Now more than ever, the need for quality initiatives and continuous improvement move to the forefront of good business management practices. 29 The Next Generation Design Tool Challenge An interview with Henry Potts of Mentor Graphics. by KATHY NARGI-TOTH LAMINATES Thermally Conductive Microwave Materials Increasing the thermal conductivity of the base materials improves thermal management in RF designs. by RUSS HORNUNG, MIKE SMITH and CHET GUILES 32 LEAD-FREE RELIABILITY Peter Bigelow 16 EMC FOR THE REAL WORLD A closed loop creates inductance, so control your signal path by minimizing the loop area. PCB Dielectric Degradation in Lead-Free Assembly Applications Reliable lead-free assemblies require a collaborative approach that optimizes the PCB design along with specific base materials and known fabrication processes. by PAUL REID 38 CPCA/IPC EXPO REVIEW Dr. Bruce Archambeault 18 POSITIVE PLATING Electroplating difficulty is measured by board thickness, hole diameter and aspect ratio. A Tale of Two Trade Shows Can 75,000 people in one place be environmentally friendly? by KATHY NARGI-TOTH 40 QUALITY CONTROL Michael Carano 48 BGA BULLETIN Aligning blind via fanout patterns can significantly increase route density. ELIMINATING BOARD DEFECTS The assembly drawing should specify process-related issues. by ZULKI KHAN Charles Pfeil DEPARTMENTS 6 8 MARKET WATCH AROUND THE WORLD 12 43 HAPPENINGS OFF THE SHELF 44 47 MARKETPLACE AD INDEX Circuits Assembly Online GLOBAL SOURCING CONFORMAL COATINGS circuitsassembly.com Evaluating Manufacturability and Operational Costs for New Conformal Coating Processes Higher density components and smaller footprint layouts makes the conformal coating process more challenging in terms of achieving acceptable first-pass process yields and cost-effective cycle times. by JASON KEEPING Rx for Outsourcing The US has been shifting to a services-based economy for 40 years. The question then is, Can a services economy create real wealth for its citizens? And what kind of services are we talking about? by JENNIFER READ POSTMASTER: Send address changes to PRINTED CIRCUIT DESIGN & FAB, P.O. Box 35646, Tulsa, OK 74153-0646 http://www.circuitsassembly.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - May 2008

Printed Circuit Design & Fab - May 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC For the Real World PCB East Conference Brochure Positive Plating Don't Let your Signals Stub Their Toes Improve PCB Layout With Skill Utility Programs The Next Generation Design Tool Challenge Thermally Conductive Microwave Materials PCB Dielectric Degradation in Lead-Free Assembly Applications A Tale of Two Trade Shows Eliminating Board Defects Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - May 2008

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