Printed Circuit Design & Fab - May 2008 - (Page 4) OUR LINE Trusted Sources cines to auto parts, designer bags to videos, and yes, throughout the electronics supply chain, is commonplace news of late. We’ve seen the statistics and heard the horror stories: Equipment that performs below par, or fails altogether; tainted or nonfunctioning drugs. Counterfeiting can put personal health and safety at risk, not to mention the hurt it can put on KATHY company revenues, which can then trickle down to our job security. NARGI-TOTH For a sense of the scope of the problem, last November and December alone, over 350,000 counterfeit ICs were stopped at U.S./EU borders. One estimate put the loss in revenue to semiconductor manufacturers in the hundreds of millions of dollars per year. In most cases counterfeit simply fool the buyer. But in some cases, the intent is more menacing, and the counterfeiting actions are purposefully engineered to do harm. The response may have been slow at first, but it’s gathering steam. Late in 2007, the Semiconductor Industry Association (SIA) fashioned an anti-counterfeiting trade agreement designed to stem the flow of fake products into consumer electronics. Participants include the U.S, Canada, the EU, Japan, Mexico, New Zealand and Switzerland. A task force is now working on measures to stop counterfeiting including ways to encrypt chip packages to prevent remarking. The buyer most likely to be intentionally impacted by sinister counterfeit electronics is the military. In March, in a follow-up to a 2005 report to Congress by the National Research Council (NRC), the Defense Department took action to develop a long-range strategy to address the need for trusted components. A task force comprised of military agencies, the National Security Agency and the State Department recommended the DoD implement a program to ensure a trusted source for all electronic components, from the IC to the PCB. This is a change for the DoD because previously, PCBs were not considered a critical component in military hardware. There has been a program in place for ICs, called the Defense Trusted Integrated Circuit Strategy (DTICS). The DTICS looks to trusted suppliers to lessen the risk of IP loss, counterfeiting, poor quality or loss of supply. One upcoming action for the DoD is to extend the DTICS program to cover PCBs. Another includes modifications to MIL-PRF-31032 to include a definition of trust requirements. In both programs, suppliers will need to apply for trust accreditation to supply PCBs for secure defense systems. These actions will help reduce risks posed by tampering or counterfeiting of PCBs, according to the DoD. One of the key actions the DoD will take is to ensure the military has access to current printed circuit board technology. The mechanism suggested by the NRC to accomplish this task was to “establish a competing network of shops that can be trusted to manufacture PCBs for secure defense systems.” The NRC report went on to specify that these shops be globally competitive to ensure technology competency and that the DoD buy sufficient quantities of PCBs annually to create the critical mass needed to sustain the “trusted manufacturing base.” A secondary benefit of the status for the PCB is an increased awareness by military and government of its importance within an electronics system. With the NRC report and subsequent DoD implementation, the PCB has migrated from commodity to critical in terms of military purchases. In acting on the NRC report recommendations, the DoD will need to “foster new PCB design and manufacturing technology.” This means we can expect continued support for joint government/industry programs through DARPA and the Focus Center Research Programs that fund technology advancement in the area of electronics. The funding, a fraction of what is really needed to keep pace with technology demands, serves as at least minor recognition that the PCB is fundamental to the success of electronic devices we have all come to rely on. Read the DoD report in full at pcdandf.com/cms/DoD_mar08_report. Join us at PCB East on May 11-16 in Tinley Park, IL, for a weeklong conference and two-day exhibition. We have lots of new courses to boost your PCB design and fab knowledge and expertise (pcbeast.com/conf). Back by popular demand, “FREE Tuesday” will kick off with the “Next Generation EDA Tools” panel session that includes presentations by leading EDA tools suppliers. Keynoter Emad Isaac of The Morey Corp. will focus on how to share information up and down the chain, with an end-goal of improved design layout and manufacturability. And that evening, meet authors like Charles Pfeil and Clyde Coombs at a book signing as part of a hosted networking opportunity. See you there! 4 pcdandf.com EDITORIAL EDITOR: Kathy Nargi-Toth, 678-589-8866, knargitoth@upmediagroup.com ASSOCIATE EDITOR: Phil Buonpastore, 678-5898853, pbuonpastore@upmediagroup.com T HAT counterfeit products are finding a way into society, from medi- EDITORIAL OFFICE: 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080 678-589-8800; fax 678-589-8850 EDITORIAL ADVISORY BOARD: Dr. Eric Bogatin, Be The Signal; Michael Carano, OM Group; George Dudnikov, Sanmina-SCI; Jack Fisher, Interconnect Technology Analysis; Happy Holden, Mentor Graphics; Istvan Novak, Sun Microsystems CONTRIBUTING EDITOR: Dr. Hayao Nakahara COLUMNISTS: Bruce Archambeault, Peter Bigelow, Michael Carano, Dominique Numakura, Charles Pfeil, Dr. Abe Riazi, Susy Webb PRODUCTION MANAGING EDITOR: Katherine Haddox, khaddox@upmediagroup.com PRODUCTION MANAGER: Javier Longoria, jlongoria@upmediagroup.com SALES SALES ASSOCIATE: Kamden Robb, 678-589-8843, krobb@upmediagroup.com EXHIBIT SALES MANAGER: Brooke Anglin, 678-589-8833, fax 678-589-8850, banglin@upmediagroup.com KOREA SALES: Young Media Inc., +82 2 2273 4818, fax +82 2 2273 4866, ymedia@ymedia.co.kr PRINT REPRINTS: Edward Kane, FosteReprints, 866-879-9144 ext. 131, fax 219-561-2009, ekane@fostereprints.com ELECTRONIC REPRINTS: pcdf_reprints@upmediagroup.com LIST RENTAL: Jennifer Schuler, 918-496-1476, fax 918-496-9465 WEBINARS: Frances Stewart, 678-817-1286, fstewart@upmediagroup.com, pcbshows.com/webinars CIRCULATION DIRECTOR OF AUDIENCE DEVELOPMENT: Jennifer Schuler CIRCULATION AND SUBSCRIPTION INQUIRIES/ ADDRESS CHANGES: fax 918-496-9465, jschuler@upmediagroup.com UP MEDIA GROUP, INC. PRESIDENT: Pete Waddell VICE PRESIDENT, SALES AND MARKETING: Frances Stewart, fstewart@upmediagroup.com VICE PRESIDENT, EDITORIAL AND PRODUCTION: Mike Buetow, mbuetow@upmediagroup.com SPECIAL PROJECTS MANAGER: Ronda Faries, 678-589-8827, rfaries@upmediagroup.com Printed Circuit Design & Fab is distributed without charge to qualified subscribers. For others, annual Subscription Rates in U.S. funds are: $80 (U.S. and Canada), $145 (all other countries). Single copy price is $8.50. All subscription and single copy orders or inquiries should be directed to Printed Circuit Design & Fab, P.O. Box 35646, Tulsa, OK 74153-0646, jschuler@upmediagroup. com, fax 918-496-9465. Photocopies and issues on Microfilm/Microfiche (16mm, 33mm or 105mm) are available from University Microfilms International, 300 N. Zeeb Rd., Ann Arbor, MI 48106, Telephone 313-761-4600. Printed Circuit Design & Fab is published monthly by UP Media Group Inc., 2400 Lake Park Drive, Suite 440, Smyrna, GA 30080. ISSN 1543-6527. GST 124513185/ Agreement #1419617. Periodicals postage paid at Smyrna, GA, and additional mailing offices. © 2008, UP Media Group, Inc. All rights reserved. Reproduction of material appearing in Printed Circuit Design & Fab is forbidden without written permission. PRINTED CIRCUIT DESIGN & FAB MAY 2008 http://pcdandf.com http://pcbshows.com/webinars http://pcdandf.com/cms/DoD_mar08_report http://pcbeast.com/conf
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - May 2008 Printed Circuit Design & Fab - May 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC For the Real World PCB East Conference Brochure Positive Plating Don't Let your Signals Stub Their Toes Improve PCB Layout With Skill Utility Programs The Next Generation Design Tool Challenge Thermally Conductive Microwave Materials PCB Dielectric Degradation in Lead-Free Assembly Applications A Tale of Two Trade Shows Eliminating Board Defects Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - May 2008 Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page Cover1) Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page Cover2) Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page 1) Printed Circuit Design & Fab - May 2008 - Contents (Page 2) Printed Circuit Design & Fab - May 2008 - Contents (Page 3) Printed Circuit Design & Fab - May 2008 - Our Line (Page 4) Printed Circuit Design & Fab - May 2008 - Our Line (Page 5) Printed Circuit Design & Fab - May 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - May 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - May 2008 - Around the World (Page 8) Printed Circuit Design & Fab - May 2008 - Around the World (Page 9) Printed Circuit Design & Fab - May 2008 - Around the World (Page 10) Printed Circuit Design & Fab - May 2008 - Around the World (Page 11) Printed Circuit Design & Fab - May 2008 - Happenings (Page 12) Printed Circuit Design & Fab - May 2008 - Happenings (Page 13) Printed Circuit Design & Fab - May 2008 - ROI (Page 14) Printed Circuit Design & Fab - May 2008 - ROI (Page 15) Printed Circuit Design & Fab - May 2008 - EMC For the Real World (Page 16) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-1) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-2) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-3) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-4) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-5) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-6) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-7) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-8) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-9) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-10) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-11) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-12) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-13) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-14) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-15) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-16) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page 17) Printed Circuit Design & Fab - May 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - May 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 20) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 21) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 22) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 23) Printed Circuit Design & Fab - May 2008 - Improve PCB Layout With Skill Utility Programs (Page 24) Printed Circuit Design & Fab - May 2008 - Improve PCB Layout With Skill Utility Programs (Page 25) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 26) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 27) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 28) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 29) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 30) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 31) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 32) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 33) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 34) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 35) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 36) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 37) Printed Circuit Design & Fab - May 2008 - A Tale of Two Trade Shows (Page 38) Printed Circuit Design & Fab - May 2008 - A Tale of Two Trade Shows (Page 39) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 40) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 41) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 42) Printed Circuit Design & Fab - May 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - May 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page Cover4)
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