Printed Circuit Design & Fab - May 2008 - (Page 43)

MACHINES MATERIALS TOOLS SYSTEMS SOFTWARE INKJET PRINTHEAD CABINET OVEN RFID TRACKING FOR PCBS RFID’s small chip size can allow PCB manufacturers to access real time work-in-process monitoring of parts, labor and finished goods throughout a manufacturing process using Omnitrol Networks’ Work-in-Process software and TI’s Gen 2 RFID technology. The RFID technology provides claimed accurate and comprehensive view of manufacturing data on units in production, including location, status, and time metrics. WHO: Omnitrol WEB: omnitrol.com, ti.com/pcbtracking The No. 930 is an electrically heated, 500˚F inert atmosphere cabinet oven used for liquid flow solder masking in a nitrogen atmosphere. Features 4” insulated walls, aluminized steel exterior, Type 430 stainless steel interior and an automatic door switch. Includes a pressure regulator, flow meter, pressure gauge, inner oven walls sealing directly against a 1/2” thick silicone rubber door seal, air jacket on the inner oven, blower shaft seal, positive latching door hardware, adjustable offset door hinges, outlet with pressure relief, and interior seams welded gas-tight. WHO: Grieve Corp. WEB: grievecorp.com The 256 Jet-D features durable stainless steel construction that allows claimed printing of a variety of direct-write printable electronic applications, with up to five times the resolution of screen printing. Made of stainless steel with claimed corrosion resistance, the printhead is designed for printing traces, contacts, embedded passives and components on a PCB. The printhead can reportedly be heated to 70˚C and jet fluids up to 30 cps, and the nozzle plate can reportedly be easily removed, cleaned and reassembled, and users can purchase multiple interchangeable nozzle plates to print different drop volume sizes using one printhead. WHO: Trident WEB: trident-itw.com OTHERS OF NOTE QUALIFICATION OF PCB FACILITIES The report Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality, version v.08, features recommendations regarding appropriate specifications and fab notes on drawings for PCBs, general procedures to qualify PCB shops, and testing procedures to verify quality and reliability. It provides information to supplement IPC-4101 slash sheets, and contains recommended examples of fab notes for SnPb solder and Pb-free assemblies. WHO: Engelmaier WEB: engelmaier.com COPPER THICKNESS GAUGE The CMI165 copper thickness measurement gauge features temperature that accurately measures hot or cold copper on PCBs, allowing for in-process inspection regardless of the temperature of the Cu surface. The probe tip is fully replaceable without recalibration. The illuminated probe tip allows positioning on copper traces. Thin etched traces are accessible without the need for line width standards. The gauge can measure foil, laminated, electroless or electrodeposited copper thickness with direct digital readout in mils, microns or copper weight. WHO: Oxford Instruments WEB: oxford-instruments.com SNAP-ON EMI/RFI GASKETS Tech-Etch has released with the “V” Series of Variable Finger Snap-on BeCu gaskets for EMI/ RFI shielding.The product incorporated a reduced number of full snap-on fingers on a strip, to increase shielding effectiveness. Claimed EMI/RFI shielding up to 100db attenuation. Gaskets are offered in five slot patterns with a snap-on mounting with claimed high durability.The “V” Series works with claimed low closing force for gaps as small as 0.02 inch. Item numbers 187V32FXx, 250V37FXx and 282V60FXx are configurable to custom lengths. WHO: Tech Etch WEB: tech-etch.com POLYMER AND CONDUCTIVE COATING PCBs PRODUCED FROM A PDF FILE C-Boards claims to be able to produce printed circuit boards from a PDF source file. The company claims that using PDF files is simpler and faster than using traditional Gerber files, reportedly allowing the company to make a PCB in less than an hour. C-Boards concentrates on rapid turnaround single sided boards, targeted specifically at prototype PCBs. WHO: C-Boards WEB: cboards.co.za PLATFORM FOR ASIC VERIFICATION The Synplicity Confirma ASIC/ASSP Verification Platform is an integrated prototyping package combining hardware and software tools to help customers with ASIC verification challenges. The software includes the company’s Certify tool, and the Identify Pro TotalRecall software, which reportedly provides full visibility into a design under test. The product also includes the company’s High-performance ASIC Prototyping System (HAPS), for prototyping PCBs. WHO: Synplicity WEB: synplicity.com Lab Coater allows claimed fast, cost-saving trials using sample-size fluids after drawdowns, while accommodating production widths up to 15 inches. Results generated include a complete data log, which can later be used for full production. Contract lab services allow project managers to select the company’s level of involvement and development support. Clients can use the utilize staff and in-house formulation and analytical facilities as their own lab. WHO: Expo Pack WEB: exopackadvancedcoatings.com MAY 2008 PRINTED CIRCUIT DESIGN & FAB 43 http://www.omnitrol.com http://www.grievecorp.com http://www.trident-itw.com http://www.oxford-instruments.com http://www.tech-etch.com http://www.engelmaier.com http://www.exopackadvancedcoatings.com http://www.cboards.co.za http://www.synplicity.com

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - May 2008

Printed Circuit Design & Fab - May 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC For the Real World PCB East Conference Brochure Positive Plating Don't Let your Signals Stub Their Toes Improve PCB Layout With Skill Utility Programs The Next Generation Design Tool Challenge Thermally Conductive Microwave Materials PCB Dielectric Degradation in Lead-Free Assembly Applications A Tale of Two Trade Shows Eliminating Board Defects Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - May 2008

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