Printed Circuit Design & Fab - May 2008 - (Page 46) PRINTED CIRCUIT BOARD STIFFENER Large PCB’s require a mechanical stiffener to eliminate warp and bow, also to prevent copper trace damage due to bending, vibration and rough handling. A must for guidance of a PCB into its connector, and for reliable operation afterwards. • Unique aluminum bar shape accepts a screw or rivet anywhere along its length. • Same bar will install on PCB’s with different hole locations. • Eliminates close tolerance requirement between mounting holes. • Can be installed on spacers to clear components, copper traces or wire adds. • Can also function as a Heat Sink or Power/Ground bus. • Visit our web site for dimensions and specifications. COMPUFAB INC. P.O. Box 68, Woodstown, N.J. 08098-0068 ph: (856) 769-9050 • fax: (856) 769-9058 • www.compufab.com Precious Metal Finishing for Commercial, Military, and Aerospace PCB Needs. • Low Stress Nickel Plating – Deep Tanks • Hard Gold & Wire Bondable Soft Gold • Electro-less Nickel & Immersion Gold (ENIG) • Electro-less Gold – Full Build, Wire Bondable • Immersion Silver & Immersion “White” Tin • Rework Services Available Over 20 Years of Excellence & Customer Satisfaction Quick Turn or Same Day, Oversize Panels Welcome 1115 Las Brisas Place • Placentia, CA 92870 (714) 524-8525 • Fax (714) 524-8526 www.superior-processing.com 46 PRINTED CIRCUIT DESIGN & FAB MAY 2008 http://www.onestopassembly.com http://www.compufab.com http://www.compufab.com http://www.midwestaccurate.com http://www.pcbfabexpress.com http://www.pcbfabexpress.com http://www.superior-processing.com http://www.eprotos.com
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - May 2008 Printed Circuit Design & Fab - May 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC For the Real World PCB East Conference Brochure Positive Plating Don't Let your Signals Stub Their Toes Improve PCB Layout With Skill Utility Programs The Next Generation Design Tool Challenge Thermally Conductive Microwave Materials PCB Dielectric Degradation in Lead-Free Assembly Applications A Tale of Two Trade Shows Eliminating Board Defects Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - May 2008 Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page Cover1) Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page Cover2) Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page 1) Printed Circuit Design & Fab - May 2008 - Contents (Page 2) Printed Circuit Design & Fab - May 2008 - Contents (Page 3) Printed Circuit Design & Fab - May 2008 - Our Line (Page 4) Printed Circuit Design & Fab - May 2008 - Our Line (Page 5) Printed Circuit Design & Fab - May 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - May 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - May 2008 - Around the World (Page 8) Printed Circuit Design & Fab - May 2008 - Around the World (Page 9) Printed Circuit Design & Fab - May 2008 - Around the World (Page 10) Printed Circuit Design & Fab - May 2008 - Around the World (Page 11) Printed Circuit Design & Fab - May 2008 - Happenings (Page 12) Printed Circuit Design & Fab - May 2008 - Happenings (Page 13) Printed Circuit Design & Fab - May 2008 - ROI (Page 14) Printed Circuit Design & Fab - May 2008 - ROI (Page 15) Printed Circuit Design & Fab - May 2008 - EMC For the Real World (Page 16) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-1) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-2) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-3) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-4) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-5) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-6) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-7) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-8) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-9) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-10) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-11) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-12) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-13) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-14) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-15) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-16) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page 17) Printed Circuit Design & Fab - May 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - May 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 20) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 21) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 22) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 23) Printed Circuit Design & Fab - May 2008 - Improve PCB Layout With Skill Utility Programs (Page 24) Printed Circuit Design & Fab - May 2008 - Improve PCB Layout With Skill Utility Programs (Page 25) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 26) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 27) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 28) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 29) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 30) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 31) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 32) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 33) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 34) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 35) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 36) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 37) Printed Circuit Design & Fab - May 2008 - A Tale of Two Trade Shows (Page 38) Printed Circuit Design & Fab - May 2008 - A Tale of Two Trade Shows (Page 39) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 40) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 41) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 42) Printed Circuit Design & Fab - May 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - May 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page Cover4)
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