Printed Circuit Design & Fab - May 2008 - (Page PCB-11)

TECHNICAL CONFERENCE rise and fall times, dielectrics, characteristic impedance control, matching impedances, critical lengths, reflections, mismatches, stubs, cross coupling, forward and reverse coupled waves, energy transport, the power time constant, energy management, capacitors as transmission lines, capacitor design problems, and energy storage on ICs. NEW! S6 - Hand Routing Speaker: Andy Kowalewski, SyChip Attendees of this half-day seminar will benefit from a practical guide to the many issues facing the modern PCB designer—difficult issues that autorouters cannot handle well, if at all. Some “conventional” rules prevent satisfactory design solutions, especially within tight size, technology and/or cost constraints. Practical examples, involving several cost-driven designs constrained within rigid mechanical requirements, will be discussed. In such cases, it is important to know “when to break the rules” without compromising performance. Attendees will learn basic concepts, typical design flow, placement principles and routing principles. During this half-day seminar, attendees will learn about the attributes of loosely/tightly coupled differential pairs; definitions and examples of differential and common mode voltage; and current and differential impedance—both Odd and Even modes. Advantages and disadvantages of edge (side-by-side), broadside (dual) asymmetric and microstrip differentials will be discussed. Pertinent topics regarding reflections and crosstalk in differentials will be included. Meta-stability, Clk skew, driver skew, bit pattern sensitivity, ISI, skin effect, dielectric constant, jitter, BER and the eye diagram are part of the session. Other topics that will be discussed include matching electrical lengths, differential unbalance, controlling Zo, differential/common mode radiation, transversing connectors, and other signal quality issues and design guides. easy- to- learn features, especially for RF engineers having little experience with PCB tools. NEW! S11 - An Introduction to Cadence Allegro PCB SI Flow Speaker: Matthew Harms, EMA Design Automation Through a combination of lecture, live demonstrations and hands-on material, this seminar will illustrate how Cadence Allegro PCB SI tools bring layout decisions, such as critical placement of components and nets, to the forefront of the design cycle. Allegro PCB SI XL allows electrical engineers to capture a design’s intent through the technique known as virtual prototyping. This lets the engineer design in the abstract, making performance and cost tradeoffs to derive constraints that can later drive the physical implementation. This seminar is designed to give you first-hand experience with Allegro PCB SI tools. We will illustrate how to use a common database, shared properties and constraints, shared libraries, and common pre- and post-route analysis tools. You will learn how to: prepare a PCB design for analysis; and the basics in device models, extractions, sweeps, waveforms, topology editing, and more. Maximum number of attendees: 18. S8 - Practical Guidelines for Signal Integrity, EMI and Board Layout Speaker: Susy Webb, Fairfield Industries An introduction to the concepts used to layout PCBs with good signal integrity and EMI control, this half-day seminar will include discussions on some basic electronic information (without math), why the issues are important to board layout designers and practical ways to implement them in our PCBs. The course also will discuss and illustrate good practices for general board layout, including placement, stackup, planes, routing and more to achieve successful designs. WED MAY 14 | 1:30 PM – 3:30 PM W9 - Cost of Embedding Passive Components – Find the Truth Reliably and Easily Speaker: Richard Snogren, Bristlecone Should PCBs cost more with embedded components? Can spending more on PCBs lower system costs? Can you figure this out without expensive modeling tools? The answer to all of these questions is yes. If you don’t need them and they cost more, don’t use them. How do you determine the cost? Sophisticated cost modeling tools are available, however, in a couple of hours you can learn how to establish a cost basis, quickly, reliably and inexpensively. A relatively simple spreadsheet method to determine the cost of embedding passive components in your products will be discussed. NEW! THURS MAY 15 | 9 AM – 11 AM W11 - BGA Fanout Patterns Speaker: Charles Pfeil, Mentor Graphics Choosing the appropriate fanout patterns for routing BGAs can enable fewer layers and better signal integrity. When using HDI, many options are available for fanout patterns. This session demonstrates different fanout patterns in the context of HDI stackups and how they can be successfully applied on large dense BGAs. S9 - Designing with Flex in Mind Speakers: Mark A. Verbrugge and Mark Finstad, Minco Products Flexible circuitry is more than just an electrical interconnect. Since a flexible circuit is required to bend and flex during and after installation, it becomes as much a mechanical device as an electrical device. A robust flexible circuit design goes much deeper than just connecting the nets. Small variations in materials selection, materials stackup, and routing features can dictate whether a flex circuit will function for years or fail within minutes. This half-day seminar will examine the electrical and mechanical features that must be incorporated into the design, and how those features will interact. The course also will cover how to select the proper materials and stack up, routing techniques, termination variety and options to make the product more rugged. Emphasis will be placed on common design errors and cost drivers. We will review the design process from first concept to the finished flex circuit and more. NEW! W12 - Designing Boards for Fabrication in Asia Speaker: Happy Holden, Mentor Graphics If ever the definition of “design for manufacturability” applied, then having your boards built in China requires that you understand DFM! One of the secrets to low-cost boards has been manufacturability. This two-hour workshop will highlight the issues, choices, alternatives and conditions that designers need to consider to make a PCB manufacturable in Asia, especially China. These conditions allow for the lowest costs and timely delivery. Attendees will learn how to: understand if a fabricator is capable of building your boards, including IPC-9151 Capability Benchmarking to select fabricators; how Asian fab differs from North America; the documentation and communication skills needed, including sample drawings; materials, multilayer stackup, specifications including controlled impedances; analysis of various dielectrics, thickness’, effect on impedance, registration, calculations vs. 2D Field Solvers, and fabrication variations; mechanical and image tolerances; typical tolerances for PCB fabrication; nominal capabilities of fabricators; plating, finishes and thickness distribution, including various final finishes, concerns for plating, and much more. W10 - The Importance of Accounting for Design Variants Throughout the Entire PCB Flow Speaker: John Peloso, Mentor Graphics As the delivery of end products are required to define more and more variants, the creation of design population documentation is no longer optional but a necessity. In a traditional PCB design process, electrical design teams rely on passing manually created external data back and forth with the physical design teams outside of the mainstream data path. This presentation will provide insight into how to re-incorporate this external data back into mainstream data path. In addition, by inserting this data into the process, views of each design variant are made available to all members of the PCB design team. This can take the form of, but not be limited to: schematics and BOMs for each variant; and comparisons between variants and the automated production of feeder files for the physical design team. The true power of including this data into the mainstream process and its use to create new design variant views enables the entire PCB design team become more efficient at a higher reliability level. S10 - Breaking New Ground in PCB RF Design Speakers: Per Viklund and Loy D’Souza, Mentor Graphics RF and wireless technology content has become mainstream in a variety of designs today. Managing mixedtechnology designs is becoming increasingly difficult and time consuming. Unlike the previous process of incompatible RF and PCB part libraries and ASCII translation of designs, this hands-on seminar will utilize computers and will focus on a new integrated flow that delivers a new design paradigm with radically new RF functionality. With these new RF design techniques, attendeess will be able to produce accurate RF layouts without respins by: designing both the schematic and physical RF circuitry (including database and library); and linking directly to leading RF simulation tools such as Agilent ADS, without duplicate databases and libraries or ASCII interfaces. Critical RF design topics that will be discussed, and various techniques and tools for seamlessly integrating RF designs will be presented in this hands-on class with WED MAY 14 | 1:30 PM – 5 PM NEW! W13 - Ten Questions, Observations and Insights to Measure Confidence in a PCB Manufacturing Facility: One Negative May Send You Walking Away Speaker: Richard Snogren, Bristlecone Even if you are a really good PCB designer, you may not know much about evaluating PCB manufacturers. You can sit in a conference room and listen to sales S7 - Differential Signaling: Tradeoffs for Optimization of Signal Quality and Routing Speaker: Robert Hanson, Americom Seminars EARLY-BIRD DISCOUNT DEADLINE | REGISTER BY APRIL 10 AND SAVE UP TO $100!

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - May 2008

Printed Circuit Design & Fab - May 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC For the Real World PCB East Conference Brochure Positive Plating Don't Let your Signals Stub Their Toes Improve PCB Layout With Skill Utility Programs The Next Generation Design Tool Challenge Thermally Conductive Microwave Materials PCB Dielectric Degradation in Lead-Free Assembly Applications A Tale of Two Trade Shows Eliminating Board Defects Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - May 2008

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