Printed Circuit Design & Fab - May 2008 - (Page PCB-12)

TECHNICAL CONFERENCE presentations. You can be given a guided tour through the shop. But if you don’t know what to ask or what to look for, you may not learn what you need to. Take this course and you’ll feel confident that you can effectively evaluate a PCB manufacturers’ ability to satisfy your requirements and ensure a future positive relationship. Attendees will learn: 10 questions to ask that will clarify the critical issues you need to know for your future satisfaction; 10 things to look for and find to ensure your future satisfaction; and 10 insights on how to ensure a successful future relationship with your manufacturer. subtle traps for the unwary designer—i.e., what the “hidden schematic” doesn’t tell you. THURS MAY 15 | 1:30 PM – 5 PM NEW! cuss the benefits of HDI; examine HDI/microvia applications and technical processes; examine design challenges, board stackup, design rules, layout, microvia structures and simplifying multilayers; show how HDI design differs from through-hole design,and much more. NEW! S15 - Vias and Their Effects on High-Speed Signals Speaker: Robert Hanson, Americom Vias are much more than holes. They can have a profound effect on your digital signal. This course will cover the mechanical properties of vias – from drilling and plating, through lamination, electrolysis and electroplating. Attendees will learn more about the capacitance and inductance of vias; return current and its relation to vias; through-holes, blind and buried microvias; methods for drilling; aspect ratios; and cost tradeoffs. Discussion will focus on whether vias and autorouters are HDI compatible; via discontinuity and vias resonance concerns; capacitance and inductance of vias (through-hole, blind and buried); eliminating reflections of vias; and return current and intelligent placement. S19 - Make the Most of Your Design Time Speaker: Susy Webb, Fairfield Industries Layout time is often one of the last things considered in the project cycle, so designers need to manage their time wisely to get the job done. This half-day seminar will discuss ways to do that from many angles of the design. We will discuss: streamlining the input and output processes; fully utilizing the software including using macros and scripts; optimizing the design preparation and layout; and making the checking, saving and ECO processes more manageable. NEW! THURS MAY 15 | 9 AM – 12:30 PM S12 - RF/Microwave and Mixed-Signal PCB Design Speaker: Rick Hartley, L-3 Communications, Avionics Systems The keys to full functionality, when designing very high frequency analog applications or mixing RF and digital, are signal integrity and noise control. Two areas of paramount importance are the design and structure of the PCB. This half-day seminar is geared toward helping you understand the “what’s” and “why’s” of PCB layout in high frequency analog and mixed signal circuits. The half-day seminar will cover: impedance matching and balance, signal wave length, propagation delay, critical trace length, noise, reflections, wave guides and other RF transmission lines, Digital and RF equations and methods to resolve impedance, ¼ wavelength couplers and filters designed into the board copper, layout techniques and strategies, plane structures, component placement, critical routing and circuit isolation, mismatched loads and more. NEW! S20 - PCB Design with Flip-Chip Components Speaker: Andy Kowalewski, SyChip This half-day seminar will present a practical guide to the many issues facing the modern PCB designer, at a level suitable for the competent board designer facing design miniaturization challenges. The course will cover the critical tradeoffs relating to miniaturization of circuit boards using flip chips, the ultimate chip-scale package. Advantages and disadvantages of different types of packaging will be discussed and compared to flip-chip technology. Known good die and underfill issues will be covered, together with a detailed look at die rebumping for circuit board mounting. Detailed consideration of PCB design, assembly and fabrication issues will be presented. Other issues discussed include lead free and reliability issues. S16 - Routing and Terminating High-Speed Transmission Lines Speaker: Rick Hartley, L-3 Communications, Avionics Systems IC output rise time contributes more heavily to loss of signal quality than the clock frequency of the circuit. Since many ICs today have rise and fall times in the range of 1.5 nanoseconds and faster, engineers and printed circuit designers sometimes find themselves fighting signal integrity problems in circuits being clocked in the low to mid tens of megahertz. Traces on circuit boards with rapid rise and fall times are referred to as high-speed transmission lines. There are a number of items that contribute to signal integrity problems in high-speed transmission lines: crosstalk, loss tangent of the PCB material, power bus noise, etc. The single greatest contributor is the lack of proper control of impedance and the lack of proper termination of the transmission lines. Attendees of this half-day seminar will learn how understanding a few simple concepts can take a circuit from failure to success, and how understanding the concepts well can dramatically reduce cost and layer count of PCBs. S13 - The Fabrication Process: A Hands - On Experience for Designers Speaker: Gary Ferrari, FTG Circuits PCBs have evolved over the years into quite complex components utilizing blind and buried vias, embedded components, impedance, etc. A daunting set of design rules is associated with these advances. However, to fully understand, and utilize these new requirements, the modern PCB designer must grasp the basics, or foundation, of the processes used to fabricate a high-tech PCB. This highly interactive, half-day seminar will cover the basic manufacturing step’s while highlighting those areas and the rules associated with them of most concern to the PCB designer. Covered processes will include double sided, multilayer, HDI, and blind and buried vias, to name a few. Attendees will gain a clear understanding of the overall PCB fabrication process and how it affects the design process. The target audience is for all levels of interest in the PCB design process. NEW! S17 - Fundamentals of Geometric Dimensioning and Tolerancing (GD&T) for the PCB Designer Speaker: Gary Ferrari, FTG Circuits Millions of dollars worth of PCBs are scrapped each year due to tolerance errors in the final product. A majority of these errors are due to incorrect tolerancing of holes, edges and other board features. This half-day seminar will explain how GD&T can help you avoid high scrap rates due to improper dimensional tolerances. It will show how to apply GD&T to PCBs without all the confusion found in complex mechanical objects such as gear trains and castings. The principles discussed follow the ASME Y14.5 standard. NEW S14 - Using the Schematic for Component Placement Speaker: Andy Kowalewski, SyChip This half-day seminar will provide PCB designers with practical information on understanding a schematic, what to look for and how to relate schematic features with component placement strategies. The course will cover schematic features found in many common circuits. These will range from power supplies, panel LEDs and mechanical switches to memory arrays, microprocessors, clock circuits, telecoms line circuits, I/O ports and the signal integrity and crosstalk considerations that are so important to good placement. Typical and special components likely to be encountered will be reviewed, with discussion of their characteristics and the special care needed in their use. Attendees also will gain a better understanding of the 12 S18 - Advanced Interconnect (HDI) Design & Technologies Speaker: Happy Holden, Mentor Graphics Fine-pitch devices are now in common use for reasons such as higher density, increasingly higher speed logic, or because they’re the only packages available. Thus, the need for advanced PCBs is essential—both as the board and as the package. This half-day seminar will: provide an introduction to advanced PCBs and microvias (HDI); dis- PCB EAST 2008 | TINLEY PARK, IL | WWW.PCBEAST.COM http://WWW.PCBEAST.COM

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - May 2008

Printed Circuit Design & Fab - May 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC For the Real World PCB East Conference Brochure Positive Plating Don't Let your Signals Stub Their Toes Improve PCB Layout With Skill Utility Programs The Next Generation Design Tool Challenge Thermally Conductive Microwave Materials PCB Dielectric Degradation in Lead-Free Assembly Applications A Tale of Two Trade Shows Eliminating Board Defects Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - May 2008

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