Printed Circuit Design & Fab - May 2008 - (Page PCB-13) SPEAKER BIOGRAPHIES RICK ALMEIDA is founder and chief marketing officer for DownStream Technologies. Previously, Almeida was VP of marketing for Innoveda (now Mentor Graphics) Product Realization Group. DAVID ACKERMAN is the president and cofounder of Ackerman-USA, an international value-added distributor of electronic components. He has been involved in international trade fraud prevention efforts and litigation, and coninues to establish contacts internationally to facilitate discussion and transparency to help isolate and control the counterfeiting epidemic. As of 2007, Ackerman-USA began an initiative to educate and combat the growing counterfeiting problem in worldwide manufacturing. JEFFREY BENES is president of Catalyst Manufacturing, Morrisville, NC. LOUIS DE ROSE is a pioneer in the development of supply chain management and value selling. He is the author of four books: “How to Negotiate Purchase Prices,” “Value Buying,” “Value Selling” and “The Value Network.” A former professor and chairman of the business management department at Fordham University, he is a contract and trade dispute arbitrator with the American Arbitration Association and has served on the Procurement Advisory Committee of the U.S. Senate. LOY D’SOUZA is product manager of IC packaging and RF at Mentor Graphics. He was over 10 years experience in RF design. GARY FERRARI is director of technology for FTG Circuits, a manufacturer of military and high-reliability PCBs. He is the past executive director and cofounder of the IPC Designers Council. He has over 38 years of experience in electronic packaging with an emphasis on PCB design and manufacturing. MARK FINSTAD is principal applications engineer for Minco Products. He has over 24 years of experience designing and manufacturing flexible printed circuits. He serves as the co-chair of IPC-2223 Design Standard for Flexible Printed Boards subcommittee. MICHAEL FITTS is a manager of customer development at Plexus. Fitts has been involved in the design and implementation of advanced technologies since the mid-1990s. His extensive experience comes from years of working for OEMs and EDA companies, and owning his own consulting company. RAY FUGITT is a technical marketing engineer for DownStream Technologies and is responsible for the CAM350 product line. ROBERT HANSON MSEE, is president of Americom Seminars. As a digital design engineer at Boeing, Rockwell, Honeywell, and Loral, Hanson designed and analyzed many high-speed designs, including PCBs, for the AWACs, B1-B, 747-400, missiles and ground support test equipment. Hanson now consults and trains on high-speed digital design, EMI/EMC, SMT manufacturing/test and other electronic issues in the USA and internationally. MATTHEW HARMS holds a bachelor’s degree in electrical engineering from the University of Saskatchewan. Harms has worked as a field application engineer for the past seven years, with the last five being at EMA Design Automation. His specialty is simulation, part management and signal integrity issues. RICK HARTLEY is a senior principal engineer and PCB specialist at L-3 Communication, Avionics Systems. His background is in the design of printed circuits for computers, aircraft avionics and telecommunications. Hartley has 42 years of experience in the electronics industry. He is a past member of the editorial review board of Printed Circuit Design magazine and is currently on the IPC Designers Council Executive Board. HAPPY HOLDEN is the senior PCB technologist for Mentor Graphic’s System Design Division in Longmont, CO. Prior to joining Mentor, he was the advanced technology manager at Westwood Associates and Merix Corp. He retired from Hewlett-Packard after over 28 years, where he managed HP’s application organizations in Taiwan and Hong Kong. He holds degrees in chemical engineering and computer science. He is a member of the IPC, SMTA, IMAPS and the IEEE. ANDY KOWALEWSKI has over 28 years of experience designing boards. He has a background in avionics, covering HF, VHF and UHF air-ground-air and radio link communications, radar and navigational aids. He currently does state-of-the-art miniature RF and base-band module design for SyChip. He has been certified as an Advanced Interconnect Designer (CID+). He has served on the editorial review board of Printed Circuit Design & Fab. RALPH MORRISON is an author, consultant and teacher. He graduated in with a degree in physics from Caltech in 1948, and he has an MSEE degree. Morrison has written over 10 books on subjects related to electrical interference. His latest book is the “5th Edition of Grounding and Shielding - Circuits and Interference” published by John Wiley in 2007. His latest efforts have been in the field of high-speed digital design. Morrison recently applied for a patent on a new, fast decoupling device. GREG PAPANDREW is president of Bare Board Group (BBG), a five-year-old sales firm specializing in procuring bare PCBs for customers worldwide. BBG’s phenomenal growth rate earned it a coveted spot on the Inc. 5,000 List, which is an extension of the widely known Inc. 500 List and recognizes the top 5,000 private companies in the United States. Papandrew has been in the PCB industry for over 15 years. JOHN PELOSO has over 15 years experience in EDA tools. He has been with Mentor for five years. His current responsibilities include technical sales for the Mentor Distribution Channel within North America. Prior to Mentor, Peloso held sales management positions with Innoveda and Viewlogic. He holds an BSEE from Northeastern University. CHARLES PFEIL is a product marketing director for Mentor Graphics’ Systems Design Division. He is an architect for Expedition PCB and an inventor of XtremePCB. Pfeil has been in the PCB industry over 40 years as a designer and owner of a service bureau, and has worked in marketing and/or engineering management at Racal-Redac, ASI, Cadence, PADS, VeriBest and Mentor Graphics. LEE RITCHEY is founder and president of Speeding Edge. Considered to be an authority on high-speed PCB and system design, he conducts on-site private training courses and teaches courses for UC Berkeley´s extension program. Ritchey is also a consultant to top manufacturers of Internet and server products. Prior to founding Speeding Edge, he worked for 3Com and Maxtor, and was cofounder and vice president of engineering and marketing of Shared Resources. Ritchey holds a BSEE degree from California State University, Sacramento. RONALD SCHAEFFER is chief executive officer of PhotoMachining. He has been involved in laser manufacture and materials processing for over 20 years. He has written for over 100 publications. He is on the board of directors of the Laser Institute of America. Schaeffer has a Ph.D. in physical chemistry from Lehigh University and did graduate work at the University of Paris. He worked for Spectra Physics, Lambda Physik/ Coherent and other laser companies. RICHARD SNOGREN has a BS in chemistry and biology from Western Michigan University. He has over 25 years experience in the aerospace sector of the PCB industry. He managed the electronic packaging and PCB design groups for Martin Marietta Astronautics, and was co-founder of SAS Circuits, now Coretec Denver. Snogren was a member of the recent AEPT (Advanced Embedded Passive Technology Research Consortia), and he is an active participant in the embedded passives test bed project of NSWC Crane’s Emerging Critical Interconnect Technology Program (ECIT). VERN SOLBERG is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has over 25 years experience in areas related to both commercial and aerospace electronic products and is active as an author and educator. Solberg holds several patents for IC packaging innovations and is the author of “Design Guidelines for Surface Mount and Fine-Pitch Technology,” published by McGraw-Hill. He is a member of IPC, SMTA and IMAPS. MARK VERBRUGGE is an applications engineer for Minco Products. He has over 20 years experience designing and manufacturing flexible printed circuits. PER VIKLUND is director of IC packaging and RF at Mentor Graphics. He has over 25 years experience in system, RF and package, mixed technology design. SUSY WEBB is a senior PCB designer with 28 years of design experience. She has worked in a variety of fields, including point-to-point microwave network systems, oceanographic oil exploration equipment, and CPCI and ATX computer motherboards. Webb is CID certified and is an active member of the IPC Designers Council, currently working as a member of its national executive board, high-speed and education committees. EARLY-BIRD DISCOUNT DEADLINE | REGISTER BY APRIL 10 AND SAVE UP TO $100!
Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - May 2008 Printed Circuit Design & Fab - May 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC For the Real World PCB East Conference Brochure Positive Plating Don't Let your Signals Stub Their Toes Improve PCB Layout With Skill Utility Programs The Next Generation Design Tool Challenge Thermally Conductive Microwave Materials PCB Dielectric Degradation in Lead-Free Assembly Applications A Tale of Two Trade Shows Eliminating Board Defects Off the Shelf Marketplace Ad Index BGA Bulletin Printed Circuit Design & Fab - May 2008 Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page Cover1) Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page Cover2) Printed Circuit Design & Fab - May 2008 - Printed Circuit Design & Fab - May 2008 (Page 1) Printed Circuit Design & Fab - May 2008 - Contents (Page 2) Printed Circuit Design & Fab - May 2008 - Contents (Page 3) Printed Circuit Design & Fab - May 2008 - Our Line (Page 4) Printed Circuit Design & Fab - May 2008 - Our Line (Page 5) Printed Circuit Design & Fab - May 2008 - Market Watch (Page 6) Printed Circuit Design & Fab - May 2008 - Market Watch (Page 7) Printed Circuit Design & Fab - May 2008 - Around the World (Page 8) Printed Circuit Design & Fab - May 2008 - Around the World (Page 9) Printed Circuit Design & Fab - May 2008 - Around the World (Page 10) Printed Circuit Design & Fab - May 2008 - Around the World (Page 11) Printed Circuit Design & Fab - May 2008 - Happenings (Page 12) Printed Circuit Design & Fab - May 2008 - Happenings (Page 13) Printed Circuit Design & Fab - May 2008 - ROI (Page 14) Printed Circuit Design & Fab - May 2008 - ROI (Page 15) Printed Circuit Design & Fab - May 2008 - EMC For the Real World (Page 16) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-1) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-2) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-3) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-4) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-5) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-6) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-7) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-8) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-9) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-10) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-11) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-12) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-13) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-14) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-15) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page PCB-16) Printed Circuit Design & Fab - May 2008 - PCB East Conference Brochure (Page 17) Printed Circuit Design & Fab - May 2008 - Positive Plating (Page 18) Printed Circuit Design & Fab - May 2008 - Positive Plating (Page 19) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 20) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 21) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 22) Printed Circuit Design & Fab - May 2008 - Don't Let your Signals Stub Their Toes (Page 23) Printed Circuit Design & Fab - May 2008 - Improve PCB Layout With Skill Utility Programs (Page 24) Printed Circuit Design & Fab - May 2008 - Improve PCB Layout With Skill Utility Programs (Page 25) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 26) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 27) Printed Circuit Design & Fab - May 2008 - The Next Generation Design Tool Challenge (Page 28) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 29) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 30) Printed Circuit Design & Fab - May 2008 - Thermally Conductive Microwave Materials (Page 31) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 32) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 33) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 34) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 35) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 36) Printed Circuit Design & Fab - May 2008 - PCB Dielectric Degradation in Lead-Free Assembly Applications (Page 37) Printed Circuit Design & Fab - May 2008 - A Tale of Two Trade Shows (Page 38) Printed Circuit Design & Fab - May 2008 - A Tale of Two Trade Shows (Page 39) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 40) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 41) Printed Circuit Design & Fab - May 2008 - Eliminating Board Defects (Page 42) Printed Circuit Design & Fab - May 2008 - Off the Shelf (Page 43) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 44) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 45) Printed Circuit Design & Fab - May 2008 - Marketplace (Page 46) Printed Circuit Design & Fab - May 2008 - Ad Index (Page 47) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page 48) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page Cover3) Printed Circuit Design & Fab - May 2008 - BGA Bulletin (Page Cover4)
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