Printed Circuit Design & Fab - May 2008 - (Page PCB-6)

CONFERENCE-AT-A-GLANCE Sunday, May 11 8 am - 1 pm Registration 9 am - 5 pm 9 am – 12:30 pm Technical Conference courses S1 - Resources and Standards for Your Company 11 am - 1:30 pm Speaker: Jeffrey Benes, Catalyst Manufacturing Speaker: Susy Webb, Fairfield Industries 2 pm - 3 pm F4 - NEW! If You Can Make It, They Professional Development Certificate Program courses DEC 1 – High-Speed Design Speaker: Lee Ritchey, Speeding Edge Lunch break for Technical Conference attendees 12 pm - 1 pm Speaker: David Ackerman, AckermanUSA Can Fake It: Counterfeit Parts and China DEC 2 – NEW! Electrical Principles: Digital Circuits and Electrical Systems Speaker: Ralph Morrison, consultant Professional Development Attendee Lunch 1:30 pm – 5 pm 3 pm - 5 pm F5 - NEW! Thoughts on Founding DEC 3 - Design Challenges with Speaker: Ron Schaefer, PhotoMachining and Operating a Small, HighTech Company HDI/Microvias Including HandsOn Design Speakers: Happy Holden, Mentor Graphics, and Mike Fitts, Plexus Technical Conference courses S2 - NEW! Library Creation and Management 5 pm - 7 pm Wine and Cheese Mixer 7 pm - 11 pm Speaker: Susy Webb, Fairfield Industries T1 - Control of EMI and Crosstalk Speaker: Rick Hartley, L-3 Communication, Avionics Systems - NEW! The Basics of PCB Layout Speaker: Susy Webb, Fairfield Industries - NEW! Everything You Need S3 - NEW! Design for Flip-Chip, in PCBs Chip-Size and 3-D Array Package Technology ”Casino Night at the Speakeasy” Networking Party T2 Speaker: Vern Solberg, consultant S4 - Embedded Passive Component Wednesday, May 14 8 am - 4 pm T3 Technology Available Now Speaker: Robert Hanson, Americom Seminars to Know About Bypassing, Including BGAs Speaker: Richard Snogren, Bristlecone Registration 9 am - 11 am Tuesday, May 13 8 am - 7 pm 12 noon- 1 pm Registration 8:30 am - 11 pm Technical Conference courses W4 - NEW! Power System Design in High-Speed PCBs Professional Development Attendee Lunch FREE Tuesday sessions and events 8:30 am - 10 am NEW! Next- Generation EDA Tools Moderator: PCD&F Editor Kathy NargiToth W5 Speaker: Rick Hartley, L-3 Communications, Avionics Systems – NEW! PCB Cost Modeling— Speaker: Richard Snogren, Bristlecone Monday, May 12 8 am - 4 pm How Designers Affect PCB Costs Registration 9 am - 5 pm Panel Session W6 - Implementing Advanced Technologies: How to Achieve Success Within Your Organization Speaker: Mike Fitts, Plexus Professional Development Certificate Program courses continued 9 am - 11 am 10 am - 10:30 am FREE Sessions F1 - NEW! PCB Design Using the Speaker: Andy Kowalewski, SyChip 10 am - 11 am W7 - NEW! Intro to Speaker: Ron Schaefer, PhotoMachining Technical Conference courses W1 - NEW! Catch & Release: Verifying, Optimizing, Post Processing and Documenting PCB Designs for Manufacturing Metric System Micromachining Using Lasers 9 am - 12:30 pm FREE Sessions F2 - NEW! Death of a PCB Salesman Speaker: Greg Papandrew, Bare Board Group Technical Conference courses S5 - NEW! Traces as Transmission Lines Speaker: Ralph Morrison, consultant Speaker: Andy Kowalewski, SyChip W2 Speakers: Rick Almeida and Ray Fugitt, DownStream Technologies - NEW! Design Principles for S6 - NEW! Hand Routing 12:30 pm - 1:30 pm Speaker: Vern Solberg, consultant BGA, CSP and 3-D Package Technologies 11 am - 12 noon Keynote Address 12 noon - 7 pm Lunch break for TC attendees 10 am - 3 pm W3 - Base Materials for High-Speed, Exhibits Open 1 pm - 2 pm F3 - NEW! Transition to (RoHS) High-Frequency and Lead-Free PCBS Speaker: Rick Hartley, L-3 Communications, Avionics Systems Exhibits Open 1:30 pm - 3:30 pm Restriction of Hazardous Substances Technical Conference courses PCB EAST 2008 | TINLEY PARK, IL | WWW.PCBEAST.COM http://WWW.PCBEAST.COM

Table of Contents Feed for the Digital Edition of Printed Circuit Design & Fab - May 2008

Printed Circuit Design & Fab - May 2008 Contents Our Line Market Watch Around the World Happenings ROI EMC For the Real World PCB East Conference Brochure Positive Plating Don't Let your Signals Stub Their Toes Improve PCB Layout With Skill Utility Programs The Next Generation Design Tool Challenge Thermally Conductive Microwave Materials PCB Dielectric Degradation in Lead-Free Assembly Applications A Tale of Two Trade Shows Eliminating Board Defects Off the Shelf Marketplace Ad Index BGA Bulletin

Printed Circuit Design & Fab - May 2008

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