Antenna Systems & Technology - Fall 2012 - (Page 18)

NEW PRODUCTS & SERVICES Rogers Introduces Condux Plus Conductive Foams MATERIALS / MANUFACTURING / DESIGN Both include XStream GPU acceleration, 32 or 64-bit analysis module, geometric modeler and postprocessor, shared memory multiprocessor (MPM) at eight cores, and a variety of 3D CAD import modules. The Bio-Pro version also includes SAR capability and high fidelity human body meshes. - See Remcom at Mobile Antenna Systems 2012 Rogers Corp.’s High Performance Foams Division has introduced a new problem-solving material for handheld mobile devices, Condux Plus electrically conductive foam. Even in the most complex, compact handheld electronic designs, Condux Plus materials feature improved electrical conductivity, consistent mechanical properties and electromagnetic (EM) shielding capabilities, allowing them to serve as reliable grounding pads for handheld devices in need of enhanced conductivity and shielding performance. Condux Plus materials, available in several different thicknesses (0.33, 0.53 and 0.73 mm), are designed to provide consistent and reliable connectivity while also offering improved mechanical stability over time and temperature. The typical compression set for 0.021 inches thick (0.53 mm thick) Condux Plus foam, for example, is 2.5 percent. This material helps maintain the electrical integrity of the most complex mobile and handheld designs, forming electrical connections and delivering necessary conductivity whether uncompressed or fully compressed. Rogers Condux Plus foam also serves as an improved EM shielding material, with increased shielding effectiveness (SE) over an operating frequency range of 200 MHz to 10 GHz. Condux Plus materials have been tested per IEEE-299 methods to provide a minimum SE of 60 dB, effectively reducing the power of EM fields by more than 99 percent. Condux Plus electrically conductive foams are RoHS and REACH compliant, and will not deform with processing, yielding straight edges with die cutting. The foams can be stacked for filling gaps while maintaining high levels of conductivity and shielding. - See Rogers Corp. at Mobile Antenna Systems 2012 Remcom Updates XFdtd EM Simulation Software with New Modeling and Computational Features Remcom has updated its electromagnetic simulation software, XFdtd Release 7 (XF7), with an assortment of computational and complex geometric modeling features, such as leveraging XStream GPU Acceleration for simulations with dispersive materials and the ability to twist and stretch geometry. XF7 is available in both Pro and Bio-Pro versions. EM Software & Systems-S.A. (Pty) Ltd. and Optenni Ltd have integrated workflow between their software suites. Matching circuits for antennas and other RF components based on 3D models can now be optimized by designers who use FEKO together with Optenni Lab. An important challenge in the work of antenna design engineers is to ensure that technical specifications are met for antenna bandwidth and efficiency. These characteristics can be enhanced faster and simpler by using matching circuits than by modifying the antenna’s geometry, but traditionally the design of matching circuits required special expertise in the areas of impedance matching and circuit simulation tools. The workflow between FEKO and Optenni Lab simplifies matching circuit design by allowing the transmission of an antenna’s unmatched S-parameter characterization from FEKO to Optenni Lab, where a matching circuit is designed to the user’s specifications. Finally an S-parameter characterization of the matching circuit is returned to FEKO where it can be simulated together with the antenna. Optenni Lab provides fully automatic matching circuit generation and optimization routines. The user only needs to specify the desired frequency range and number of components in the matching circuit after which Optenni Lab provides a choice of optimized matching circuit topologies. Optenni Lab uses accurate inductor and capacitor models from major component manufacturers and a fast tolerance analysis to ensure that the manufactured matching circuits will meet the design criteria. In addition to matching circuit design, Optenni Lab can be used to predict the obtainable antenna bandwidth from simulated impedance data, using the concept of bandwidth potential. This helps the antenna designer to understand how the antenna is working and how the design should be modified for optimal bandwidth. “With the easy-to-use Optenni Lab software, matching circuits with optimal total performance can now be designed rapidly using the simulated impedance data from FEKO,” said Dr. Jussi Rahola, founder and managing director of Optenni Ltd. “Optenni’s customers have been very excited to learn about the integrated workflow with FEKO.” “FEKO has always been known as a powerful antenna and passive microwave component design and simulation software suite,” said Dr. Ulrich Jakobus, FEKO product manager. “The FEKO development team strives to make the total design process easier for our customers and this collaboration with Optenni will certainly advance this goal for us.” Matching Circuit Design with FEKO and Optenni Lab 18 ANTENNA SYSTEMS & TECHNOLOGY FALL 2012 WWW.ANTENNASONLINE.COM http://WWW.ANTENNASONLINE.COM

Table of Contents for the Digital Edition of Antenna Systems & Technology - Fall 2012

Antenna Systems & Technology - Fall 2012
Table of Contents
Editor’s Choice
Performance Evalutaion of Antenna Integration of Mobile Devices Through Full-Wave Analysis
Base Station Antenna Evolution and Revolution
Antennas
Mobile Antenna Systems 2012 - Conference Preview
Manufacturing/Design
Components
Test & Measurement
Wireless Communication
Industry News
Marketplace

Antenna Systems & Technology - Fall 2012