Electronics Protection - September/October 2011 - (Page 21)

Thermal The Tpcm 580SP series is available in a 0.5 kg or 1.0 kg can for easy manual screen printing and large volume automatic operations. It is well suited for a variety of applications including high frequency microprocessors, notebook PCs, desktop PCs, computer servers, DC/DC converters, memory modules, cache chips, IGBTs and automotive and optical electronics. Jaro Thermal Releases Honeycomb Heat Sink New Injection Moldable Metal Alloys Cool Polymers, Inc. has successfully highlighted the molding of Xyloy injection moldable metal alloys on Milacron Roboshot allelectric plastic injection molding machines. The new Xyloy injection moldable metal alloys allow the design freedom and parts consolidation of plastics with the strength, stiffness and conductivity of metals. Xyloy materials enable metal parts to be molded on injection molding machines that are outfitted with a standard Xyloy package that includes a dedicated screw and barrel. “Milacron was pleased to have Cool Polymers demonstrate their Xyloy injection moldable metal alloy on our 165-ton all-electric Roboshot molding machine, said Steve Allen, director of Product Development for North American Injection Molding, Milacron. “We see this alloy as an opportunity for molders to expand into areas that plastics currently do not support. Together, we demonstrated that this metal alloy offers an additional class of materials that can be processed on conventional molding machines. For this reason, we too are excited to partner with Cool Polymers to provide an all-electric turnkey package.” JaroThermal’s newest Honeycomb heat sink directs heat towards the outside, while producing a steady flow of cool air on the inside. Thanks to a multi-holed design and increased surface area, the Honeycomb optimizes cross ventilation, while simultaneously cooling the surrounding ambient air. Applications include a wide range of cooling solutions for video cards, motherboards and networking applications. Jaro’s adhesive mounted version eliminates the need for mounting holes in the PC board. Honeycomb heat sinks can be used with either plastic or metal/ ceramic BGA packages, depending on thermal interface material that is used. In addition, the thin size of the Honeycomb makes it well suited for compact real estate applications. Rogers Corp. Launches New Solutions for Thermal Management Rogers Corp.’s has released the HeatWave AlSiC Metal Matrix Composite (MMC) materials. HeatWave MMC materials feature an aluminum matrix with silicon-carbide or silicon-carbide-diamond reinforcement for high thermal conductivity and extremely stable coefficient of thermal expansion (CTE). Available in a range of CTE values, HeatWave MMC materials are well suited for thermal base plates and heat spreaders. They enable the design and manufacture of pin-fin heat sinks for direct liquid cooling of IGBT power modules. In spite of their light weight, HeatWave materials feature high stiffness and high strength. September/October 2011 www.ElectronicsProtectionMagazine.com 21 http://www.batterypoweronline.com http://www.batterypoweronline.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - September/October 2011

Electronics Protection - September/October 2011
Contents
Crenlo Adds Rolling Transit Case to Lineup of Emcor Enclosures
Emerson Network Power Introduces Knurr DCM Enclosures for Nexus 7000 Series Switches
Evaluating the Opportunity for DC Power in the Data Center
An Update on Arc Flash: Revised Regulations and Best Practices Help Keep Workers Safe
Re-Designed Panelboards Proivde Savings for Hazardous Applications
MetCase Launches Retex Flat-Packed 19 Inch Wall Rack System
New SlimShield Two-Piece Board Level Shielding Offers Shield Heights Down to 0.060 inches
FrigoDynamics Launches Series of Two-Phase Heat Exchanger Coolers
Rogers Corp. Launches New Solutions for Thermal Management
SurgeX Space Savers Offer Maximum Protection with Minimum Footprint
Amphenol’s Expanded Neptune Connector Line Provide Better Environmental Protection
Industry News
Calendar of Events

Electronics Protection - September/October 2011