Electronics Protection - June/July 2012 - (Page 8)

Feature Global Electronic Enclosure Resins and Markets Melvin Schlechter, Market Research Analyst BCC Research The surge of new electronic products led by small computerbased devices has led to significant changes in resin choices for enclosures. Downsizing and “thin-walling” has fostered reappraisals of resin selection due to more demanding physical property requirements and molding challenges. This article analyzes developments, including the complex scenario of small enclosures for mobile electronic devices that have become even smaller and lighter. There have also been changes in the stationary electronic device market, especially with additional protection provided for power supplies within these units. Use of electronic enclosures, often called housings, is often segmented by stationary or mobile (many of which are called handheld) and in the latter case, often compete with each other. In fact, many of these mobile electronic devices have become increasingly multifunctional. Some of the significant changes within the industry include the shift of desktop computers to notebooks and netbooks, the rapid growth of cell phones, which include upgrades to devices that are basically mini-computers, such as iPhones and smart phones and Blackberries, which are also marketed as smart phones and most recently, the introduction of such tablets as the iPad, as well as electronic books, also called e-books. The computer/business equipment electronic enclosure resin market is unique and is undergoing a wide array of technological, marketing and logistical transformations. The market itself uses HIPS, ABS, polycarbonates and PC/ABS, followed by those of lesser importance such as PVC, other polymer alloys/blends, and other engineering thermoplastics and thermoset resins, many of which are reinforced to increase structural integrity and many plastic enclosures are often made conductive with metallic fibers. Technologies related to this market also include EMI shielding, and the changing face of flame retardants in enclosures resins, due to eco-compliance issues. Marketing is mainly driven by continuous introduction of new electronic products, mostly in the mobile rather than stationary sector, although the latter dominates the enclosure market because of the difference in size between the two. Logistical considerations are led by huge amounts of electronic equipment being produced in Asia and the shift of US resin production and molding operations offshore. The electronic enclosure market will continue to see solid growth over the next five years, mainly because of the continuing growth of electronic displays within the stationary sector, which is expected to become a more mature market segment later in this decade. This continuing rapid growth of the mobile sector, however, will have minimal impact on the overall electronic enclosure market, since it constitutes less than 5 percent of the total volume. Although this market is expected to grow substantially, several observers are concerned about the continuing cannibalization with new product introductions such as smart phones vs. standard cellular phones vs. iPhones, and the new portable tablets/I-Pads vs. notebooks along with other multifunctional devices. CAGR% 2012-2017 Resins PC/ABS ABS HIPS PPO/HIPS Polycarbonate Other (1) Total 2011 2,840 2,680 445 340 190 445 6,940 2012 3,075 2,800 465 360 200 460 7,360 2017 4,135 3,335 650 480 300 990 9,910 6.1 3.7 6.9 5.9 8.5 16.6 6.1 Table 1. Includes PVC, other polymer alloys/blend, thermosets such as unsaturated polyesters some of which are reinforced and may have conductive fillers, and some engineering thermoplastics. Source: BCC Research Definitions Electronic enclosures are cabinets for electronic equipment to position, mount and protect electronic circuitry, displays, switches, knobs, etc., and to prevent electrical shock to equipment users. In addition, these enclosures are made to be pleasing to the eye. Intended usage and location (indoors or outdoors) dictate material types, along with compliance to a wide array of standards promulgated by a series of groups such as the National Electrical Manufacturers Association (NEMA) and Underwriters Laboratories (UL). Shielding to prevent EMI interference often dictates the type of materials used to construct these plastic enclosures. Other issues need to be considered in choices of these enclosures, especially around local-area-networks (LANs), communication equipment, medical instruments, switchgear, machine tools, telephone and optical links. Most of these product areas are also regulated by local, national, or international standards that mandate special enclosure features. The EMI Issue Estimated Resin Market Size Operations of electronic devices are always accompanied by generation of electromagnetic radiation, which is termed electromagnetic interference and is known to interfere with operation devices, itself and of nearby electronic devices. These techniques can either reflect electronic interferences or utilize specific parts to absorb them to protect the electronic circuitry. In addition to the usage of gaskets, other techniques include usage of conductive plastic enclosures when the enclosures are non-metals, along with conductive paints. Protection of electronic circuitry from EMI is best treated by using metallic enclosures, which essentially ground unwanted electronic signals, whereas unwanted electronic disturbances pass through untreated plastic enclosures. Plastics, which are insulators, are, of course, lighter and are much more attractive enclosures for marketing, especially with handheld devices such as cell phones and similar gadgets. Plastics are also most often cheaper than metals and have several distinct design features. Table 1 clearly shows the PC/ABS and ABS dominate this market, comprising almost 80 percent of total volume. Readers should note that actual usage of polycarbonate, HIPS and ABS is larger than shown in this table, since these resins are used in two of the polymer alloys/blends – PC/ABS and PPO/HIPS. 8 Significance of Thin-Walling on Resin Selection Thin-walling is not confined to internal electronic parts, it is an important issue in electronic enclosures as well and significantly affects resin selection. This concept went into high gear about 20 June/July 2012 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - June/July 2012

Electronics Protection - June/July 2012
FLIR T-series Cameras Introduce Thermal Image Enhancement Technology
Renewable Raw Materials - The Future of Plastic Enclosures
Global Electronic Enclosure Resins and Markets
Ferrite Testing Reveals Significant Performance Variations
Packaging Solutions for Critical Electronics Protection in Challenging Environments
Fluid Submersion Technology for Green Data Center Cooling
TRTL BOT Unveils KidSafe Case for iPhone 4 and 4S
Curtiss-Wright Controls Defense Solution Releases New D2D ATR 3U OpenVPX Chassis
Stulz Introduces CyberRow Data Center Cooling Solution
Abbott Technologies Offers New Sealed Power Supply
New Engineered Multi-Cavity Shielding Solution
Gore Enhances Product Performance with new of Screw-in Vents
Industry News
Calendar of Events

Electronics Protection - June/July 2012