Electronics Protection - May/June 2013 - (Page 22)

Thermal CTS Heat Sinks with Low Thermal Resistance For AC power installations (either 90 to 132 V or 180 to 264 V) EIC offers an auto-range feature. The auto-range feature automatically tracks and optimizes available voltage to provide unimpeded cooling at rated BTUs, even when the units are installed in areas where voltage flow may vary such as older buildings and production facilities. When connected to an AC power source, EIC units immediately convert the input to DC enabling the internal circuitry to optimize power consumption and utilization for maximum cooling efficiency. Some EIC units designed for maximizing versatility will operate on AC or DC voltage and will switch between 120/240 AC and 24/28 DC automatically based on available power connections. EIC offers the ThermoTEC Series thermoelectric air conditioners, a complete line of compact, lightweight, solid-state thermoelectric coolers for cabinets and enclosures. The units feature a simple Peltier design for reliable performance without the use of CFCs. Peltier assemblies use thermoelectric modules sandwiched between high performance aluminum heat sinks and one or more high CFM axial fans. These assemblies are coupled with a patented EIC electronic design to pump the heat from the inside of an enclosure to the outside, without exposing delicate electronics to outside air or contaminates. A wide range of sizes is offered from 200 to 2,500 BTU. New Form-in-Place Thermal Compound Offers Many Advantages Emerson Network Power Expands Offering of AutoDesk Models with Addition of Liebert DS Precision Cooling System CTS Electronic Components, Inc. has released a full line of heat sink products that are easy to use, while maintaining a thermal performance. These heat sinks are applicable for BGA, PGA, PLCC, QFP and other IC packages. The Forged Heat Sink series is a set of low profile, thin fin heat sinks. Its height ranges from 6.3 mm to 32.6 mm with thermal resistance as low as 1.9°C/Watt at 200 LFPM convection flow conditions. These heat sinks attach to the integrated circuit via an adhesive tape or clip, whichever is appropriate for the application. As a result, they are easy to handle and require no special tools to assemble on the IC packages or additional holes on the PCB. The Extruded Heat Sink series has a pre-applied adhesive tape that peels off and sticks onto the component. This attachment method reduces assembly cost and there are no messy adhesives or greases required. The adhesive shear strength at 100°C is 36 psi, a one inch square heat sink would require a 36 lbs. force to remove heat sink. Thermal resistance for this product as low as 2.6°C/watt at 400 LFPM forced convection flow conditions. Fujipoly has introduced its Sarcon SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the low compression, form-in-place material fills all unwanted gaps up to 3.0 mm in height. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces and maintains all initial properties across a wide temperature range (-40°C to 150°C). In addition, Sarcon SPG-20A provides a thermal conductivity of 2.0 W/ m°K with a thermal resistance of 2.1°C cm2/W. The physical properties of this silicone compound also allow for vibration absorption and have proven to be an effective thermal solution for both current and emerging higher-frequency electronics applications. Thermoelectric Air Conditioner Delivers Maximum Cooling Regardless of Power Supply EIC Solutions, Inc. has advanced the circuitry engineering in their cooling units to provide maximum cooling output regardless of available power supplies or the integrity of the voltage flow. EIC air conditioners run off either an AC or DC power source with consistently high power utilization efficiency. The EIC chip design also optimizes virtually any type of input power assuring high performance cooling even if voltage fluctuates. In situations where only DC power is available, EIC air conditioners can be designed to operate on a wide range of DC voltages. This feature is useful in mobile applications and in some military operations where only DC power is available. EIC units will run off a 24 V or 28 V DC truck battery if that is the only power source available. 22 Emerson Network Power has expanded its AutoDesk building information modeling (BIM) software offering with the release of BIM-enabled Revit models of standard Liebert DS precision cooling systems. AutoDesk’s BIM software allows mechanical, electrical and plumbing engineers to better coordinate design data and enhances collaboration between engineering and architecture teams. With this announcement, consulting-specifying engineers now can access more than 3,000 files related to the Liebert CW, as well as the newly-added Liebert DS, to assist with development of data center designs. Floorstand and plenum files also are available. BIM-enabled AutoDesk Revit models are becoming a standard within the data center design community. The Liebert DS, a refrigerant based direct expansion (DX) computer room air conditioning unit, uses the Copeland Scroll Digital variable capacity compressor technology as its primary method for cooling. It is available in upflow and downflow configurations and in cooling capacities up to 105 kW. The Liebert CW, a chilled water-based computer room air handling unit, uses the building chilled water supply as the cooling source. It also is available in upflow and downflow configurations and in cooling capacities up to 400°kW. The Liebert CW and Liebert DS both are available with optional electrically commutated (EC) plug fans and utilize the Liebert iCOM control system that enables multiple control algorithms depending upon the type of sensors connected. The intelligent control capabilities enable data center managers to tune their cooling systems to dynamically adjust airflow patterns by controlling the speed of the EC plug fans to allow cooling unit capacities to adapt quickly to changing room conditions. May/June 2013 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - May/June 2013

Electronics Protection - May/June 2013
Newer Technology Releases Next-Generation Power2U AC/USB In Wall Charging Solution
Raritan Boosts its DCIM Leadership Position with dcTrack 3.0
Specifiers of Enclosures for Components in Outdoor Applications: Be Aware of Material Selection Issues
Realizing the Many Benefits of Power System Relay Upgrades
How to Protect Electronic Circuits from Power Surges
A Little Diamond Goes a Long Way: Overcoming Thermal Limitations to Enable Next Generation Technology
Hardware Technology Eliminates Problems Caused by Using Traditional Captive Screws
Managing Lithium-Chemistry Batteries: It’s Mostly About Their Temperature
Protecting and Improving Electronic Components Performance
Advancements in Thermal Management Conference Preview
One Stop Systems Introduces nanoCUBE Desktop Expansion
Select-A-Shield RF Shielded Tent Closure System Is Non-Radiating
Thermoelectric Air Conditioner Delivers Maximum Cooling Regardless of Power Supply
On-line, Double-Conversion UPS from Emerson Network Power Earns Energy Star Qualification
Dirak Introduces a New Swinghandle
Dual-Cure Conformal Coating Eliminates Need for Additional Processing
Industry News
Calendar of Events

Electronics Protection - May/June 2013