Electronics Protection - Spring 2015 - (Page 20)

Thermal Jaro Releases Powerful "Fan to Sink" Coolers The design of Jaro Thermal's new IC coolers combines natural and forced-air convection by embedding a bracket fan into a heat sink design, ranging in sizes from 35 by 35 mm to 52 by 52 mm, with heights from 8 mm up to 12 mm. Their size makes them well suited for limited-space applications, including but not limited to, PCMIA, PCI Express cards, blade servers and all HOT CHIP sets. To further enhance cooling capacity, these IC coolers use universal mounts and a thermal adhesive pad, ensuring complete surface contact with the heat source. These coolers also minimize installation time because they use push-pins for mounting on the board. The push-pins are also designed to fit universal LGA socket types. The thermal adhesive pad adds mechanical strength to the bond between the heat sink and the heat source. But more importantly, it also eliminates air (caused by incomplete surface contact) from the interface area. This is important because the air acts as an insulator, impeding the heat transfer from the heat source to the heat sink. The IC coolers are more commonly available with an aluminum heat sink frame, but they can be customized with a copper heat sink frame, depending upon the cooling capacity needed for an application. New Affordable, Cooled Science-Grade Thermal Cameras from FLIR FLIR Systems, Inc. has released three A-series sciencegrade thermal cameras, the A6200sc NIR, A8300sc HD MWIR and A6700sc LWIR. Designed for demanding science and research applications like electronics development, university research and non-destructive testing, these new cameras make cooled imaging more affordable than ever. Cooled cameras provide better image detail, temperature measurement, and speed than uncooled cameras (especially for demanding scientific applications) but have often proven too expensive for some. These cameras give scientists and researchers access to the high performance of cooled cameras at more affordable prices. Easy to integrate and simple to use, these A-series cameras use a standard GigEVision interface to transmit full dynamic range digital video, and GenICam for camera control, making them truly "plug and play" thermal imagers. Users can stream temperaturecalibrated data over Gigabit Ethernet to a PC for live image viewing and recording. Simultaneously active, yet independently-controlled, video interfaces gives users tremendous flexibility when recording and display their thermal data. FLIR's ResearchIR software gives researchers and scientists a tool to monitor, acquire, analyze and share the thermal data captured with these cameras. But the release of ResearchIR Max version 4.20 will give users direct access to their MATLAB scripts within ResearchIR for the first time. Each camera model boasts its own unique features to create a high-performance camera for variety of applications. The A6200sc features a 640 by 512 resolution Indium Gallium Arsenide (InGaAs) detector that produces high quality NIR images. The A8300sc is a compact, high sensitivity, low noise MWIR camera with a cooled 20 Spring 2015 * www.ElectronicsProtectionMagazine.com 1,280 by 720 resolution Indium Antimonide (InSb) detector for HD thermal images with the finest details. This model is geared for thermal electronics inspection, thermal microscopy, materials nondestructive testing, failure analysis, aerial thermal mapping and industrial R&D applications. The A6700sc LWIR cooled Strained Layer Superlattice (SLS) detector produces 640 by 512 resolution LWIR thermal imagery. It features ultra-short integration times to stop motion on fast-moving or thermally-dynamic targets. It also offers wide temperature ranges, allowing you to measure temperature on devices with wide thermal gradients. Attend FLIR's Advancements in Thermal Management Conference Presentation in Denver Topic: The Truth about the Accuracy of Measuring Temperature with Infrared Cameras Learn more at www.thermalnews.com/conferences AI Technology, Inc. Develops Ultra-Thin Die-Attach Film Adhesive AI Technology, Inc. (AIT) pioneered the first self-supporting Die-Attach Film (DAF) adhesive for advanced stacked-chip memory packages more than 20 years ago. AIT is again revolutionizing wafer level semiconductor packaging by offering ultra-thin versions (3-5 microns) of its ESP7660-HKDAF. Using DAF at the wafer-level has become increasingly prevalent in die-attach for memory modules. However, continued success in wafer thinning technologies demands correspondingly thinner DAF, stacking as many as 20 to 50 chips for advanced performance in mobile devices. AIT's ultra-thin DAF, (available in thicknesses of 3 to 5 microns) meets and solves this challenging technical demand for thinner DAF in wafer level semiconductor packaging. The Ultra-Thin DAF is built on the same self-supporting DieAttach Film (DAF) adhesive technology AIT pioneered in the '90's. AIT now produces ESP7660-HK-DAF in ultra-thin 3, 5 and also 10 micron thicknesses for various processing and product requirements in large scale manufacturing. AIT produces this novel 3-5 micron thick insulating DAF in wafer-shape die-cut format as well as in pre-laminated on dicing tape (DDAF) format, both available in rolls up to 450 mm in width and 100 meters in length. All production is performed in AIT's clean room manufacturing environment. In addition to being the industry's first available 3to 5 micron thick Die-Attach Film (DAF), ESP7660-HKDAF maintains a high glass transition temperature of 175°C , allowing faster wire bonding at temperatures as high as 250°C. In fact, ESP7660-HK-DAF achieves one of the highest glass transition temperatures in DAF for ease of wire-bonding and molding. However, flexibility is incorporated in the material's molecularly-engineered structure for stress absorption in larger memory devices and proven reliability in thermal cycling and shock testing that is uncommon even for traditional paste die-attach adhesives. AIT's ESP7660-HK-DAF also absorbs minimal water and maintains its bond strength after extended exposure to 85 percent RH/85°C. http://www.thermalnews.com/conferences http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - Spring 2015

Editor's Choice
Predictive Modeling: The Next Frontier in Data Center Condition Maintenance
Don't Forget the Batteries
Military Aircraft Power
Pumped Two Phase Cooling Solutions for Challenging Thermal Management Applications
Identifying the Ideal Mechanical PCB Hardware for Electronic Systems
Bridging the Technology Gap: The Importance of Cyber and Physical Security within the Data Center
Waterproof Mobile Device Protection without Compromising Acoustic Quality
Enclosures
Thermal
EMI/EMC/RFI
Power
Hardware
Contamination
Industry News

Electronics Protection - Spring 2015

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