Electronics Protection - Winter 2015 - (Page 28)

Industry News Microelectronics Technologies of 2015: The Rise of Wearable and Flexible Electronics The increased use of smart devices and the anticipated adoption of wearable electronics are bolstering the development of microelectronics technologies. The pace of innovation will remain steady as demand for cheaper yet robust devices that enable low power consumption, high-speed data connectivity and increased efficiency continue to be in demand. Development in the electronics sector will drive the adoption of smart haptics, organic LED displays, encapsulation, wireless charging and near-field communication technologies as well. Recent analysis from Frost & Sullivan, 2015 Top Technologies in Microelectronics finds that the following will be leading microelectronics technologies: wearable electronics, flexible electronics, smart lighting, wireless charging, near-field communication, transparent display, brain-computer interface, encapsulation technologies, smart haptics and touch, and solid-state lighting. Wearable electronics will have a high impact on consumer and healthcare applications while LED lighting along with technologies such as sensors and wireless communication will help develop greener solutions. Wireless charging of multiple devices in a short distance radius will also be widely adopted. "With significant work underway by various stakeholders across technology segments, the commercialization of new microelectronic products is expected in several industries," said Frost & Sullivan TechVision Research Analyst Jabez Mendelson. "However, during the manufacturing of new products in the microelectronics sector, the difficulty to create a sustainable supply chain for commercialization will remain a challenge." Besides supply-chain complexity, imposing factors such as the plummeting lifetime of electronic products and dynamic market needs could dampen the penetration of microelectronics across industries. With the emergence of more companies in the microelectronics industry, compliance with global standards has also become a concern. Nevertheless, demand for cost-effective devices and higher customer buy-in in a highly competitive electronics market will continue to prompt innovations. Thus, along with industries that need multi-functional capabilities, other segments will benefit from microelectronics technologies in the future. This will open up avenues for new business models and markets. Sapa Granted Modular Heat Sink Methodology Patent Sapa has been granted a key patent related to its modular heat sink manufacturing method. Sapa's North American Technical Center (NATC), an internal research, design and development center, created the new method of manufacturing high ratio heat sinks that are approximately eight percent more thermally efficient than the industry standard. United States Patent 13/465431, entitled "Heat Sink and Method of Manufacturing", utilizes a modular concept that enables maximum flexibility with fin geometry, fin ratio and heat sink footprint, yielding heat sink ratios in excess of 40:1. "This patent recognizes Sapa's breakthrough work in aluminum extrusion manufacturing and Friction Stir Welding (FSW) technology," said Mike Tozier, application engineering manager, Sapa Extrusions North America. "Not only does this method allow for the production of large-scale heat sinks with very high fin ratios, it is also well-suited for serial production, making these types of heat sinks a competitive product in the marketplace." In order to develop the manufacturing method, Sapa conducted a study comparing Sapa's NATC designed FSW heat sink to a traditional heat sink with bonded fins. The study involved experimental testing to validate thermal performance of this new heat sink method during forced convection cooling. Liquid Encapsulation Materials Market - Global Forecast to 2020 The encapsulation technique is a process in which primarily materials such as polymers, ceramics, and metals are applied in the form of a solid or liquid on the devices. One of the major reasons for choosing the encapsulation technique for devices is the growing trend of miniaturization, where smaller and complex structures of devices need to be managed without harming the performance of the device. The major drivers for the growth of this market include the growing demand for advanced packaging techniques, increasing demand for consumer electronics products, and growing trend of miniaturization of electronics products. One of the major opportunities for this market is the new growth avenues offered by automotive electronics application in the market. However, the sluggish demand for liquid encapsulants in developed regions such as North America & Europe is restraining the growth of the global liquid encapsulation materials market. The global liquid encapsulation materials market is projected to grow at a CAGR of 6.7 percent between 2015 and 2020, from an estimated value of $1,011.97 million in 2015 to reach $1,397.46 million by 2020. With regard to the products considered for the market, integrated circuits are estimated to account for more than 75 percent of the total market till 2020. Similarly, electronics applications are considered to hold the major market share among all the applications till 2020. The major players in the global liquid encapsulation materials market are adopting various strategies to expand and consolidate their position in the market. In the global marketplace, the number of established players is growing, which makes it imperative for market players to gain a competitive edge over others. The various strategies adopted by the key players to compete in the global liquid encapsulation materials market include new product developments and mergers & acquisitions among others. 28 Winter 2016 * www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - Winter 2015

Electronics Protection - Winter 2015
Contents
Editor's Choice
Thick Print Copper Technology Increases Thermal Reliability
Slashing Printed Circuit Board Design Cycle Time Using Real-Time PCB Thermal Analysis Tools
Thermal Management of Electronic Devices Utilizing LHS Materials
Enclosures
Thermal
Power
Hardware
EMC/EMC/RFI
Industry News
Calendar of Events

Electronics Protection - Winter 2015