EDNE September 2012 - (Page 23)

BERGQUIST HIGH-PERFORMANCE LIQUID GAP FILLERS Bergquist’s New Liquid Gap Filler Has All Your Assembly Angles Covered. Gap Filler1000SR (Two-Part) dispenses in-place without slumping, offering you optimal flexibility in component orientation during assembly. Gap Filler1000SR easily wets out under minimal pressure, giving fragile components superior thermal protection. Gap Filler 1000SR is a two-component, room temperature cure, liquid-dispensable thermal interface material that features superb slump resistance. This material offers ultra precise dispensing, maintaining its shape on the target surface, offering you greater flexibility in your component orientation during assembly. As cured, this soft elastomer provides a thermal conductivity of 1.0 W/mK that is ideal for filling unique and intricate air voids and gaps. The material flows easily under minimal pressure resulting in little to no stress on fragile components during assembly. Call +31 (0) 35 5380684 or visit www.bergquistcompany.com/slumpfree European Headquarters - The Netherlands Tel: EU +31 ( 0 ) 35 5380684 • D +49- 4101- 803- 0 • UK +44 -1908 -263663 A ISO 9001:2008 registered facility • www.bergquistcompany.com Thermal Materials • Thermal Substrates • Fans and Blowers http://www.bergquistcompany.com/slumpfree http://www.bergquistcompany.com

Table of Contents for the Digital Edition of EDNE September 2012

Cover
Contents
International Rectifier
Microchip
RS Components
Masthead
Microchip
EDN Comment
Pulse
Analog Devices
Altera
Baker's best
Messe München
Test & Measurement World
Agilent Techno
Digi-key
Bergquist
Advanced power switches boost microhybrid emissions gains
Digi-Key
Image sensors evolve to address Emerging embedded- vision needs
Renesas
Silicon Labs
Digi-Key
Vicor
Power becomes a software issue as smart phones become smarter
IAN
Power : a significant challenge in EDA design
Digi-Key
Mechatronics in Desin
Design Ideas
Product roundup
Tales from the Cube

EDNE September 2012