Instrumentation & Measurement Magazine 23-5 - 26

[9] L. Y. Ungar, "Causes and costs of no fault found events," in Proc.
IPC APEX, 2015.
[10] M. Ilarslan and L. Y. Ungar, "Mitigating the impact of false alarms
and no fault found events in military systems," IEEE Instrum.
Meas. Mag., pp. 15-21, Aug. 2016.
[11] IBM patent for 8b/10b encoding described in this posting of June

engineering community with dozens of articles, conference
presentations, courses around the world and establishment
of standards and guidelines in the profession. Through
the company he has led US Government Research & Development projects, including the subject of this article on
high-speed I/O testing.

8, 2014 http://www.knowledgetransfer.net/dictionary/Storage/
en/8b10b_encoding.htm.
[12] "PHY Interface for the PCI Express and USB 3.0 Architectures,"
Intel Corporation, Version 3, 2009. [Online]. Available: https://
www.intel.in/content/dam/doc/white-paper/usb3-phyinterface-pci-express-paper.pdf.
[13] D. Behera, S. Varshney, S. Srivastava, and Swapnil Tiwari, "Eye
Diagram Basics: Reading and Applying Eye Diagrams," EDN,
Dec. 2011. [Online]. Available: https://www.edn.com/eye-

Neil G. Jacobson (NeilJ@BestTest.com) is a Principal Engineering Consultant and he provides custom software development
services for clients in a wide variety of sectors. Previously, he
was responsible for configuration and test software development at Xilinx. Neil serves on the IEEE Test Technology
Technical Committee and has been involved in several test
standardization efforts, primarily IEEE Std 1532 and the IEEE
1149 family of standards.

diagram-basics-reading-and-applying-eye-diagrams/.
[14] L. Y. Ungar, N. G. Jacobson and T. M. Mak, "High-Speed I/O
Capabilities Added to Military Automatic Test Equipment (ATE)
Using Synthetic Instruments," 2019 IEEE AUTOTESTCON, pp.
1-6, 2019.

Louis Y. Ungar (LouisUngar@ieee.org) is President of A.T.E.
Solutions, Inc., a test, ATE and testability consulting and
educational firm. He holds a BSEE degree from the University of California at Los Angeles. He founded the company
in 1984 and has established a leadership role in the test

T. M. Mak (TMMak@BestTest.com) has been a Principal Engineering Consultant for A.T. E. Solutions for the past two
years. Prior to that, he was a Test Strategist for Global Foundries for 2.5 years and held various engineering positions with
Intel Corporation for 28 years. He is a graduate of Hong Kong
Polytechnics. His research interest spans defect-based testing,
High Speed I/O testing, fault tolerance, analog/mixed signal
testing and 3D die stacking test. He is also co-author of several book chapters on Test, DFT, Silicon Debug/Diagnosis and
3D Test.

IEEE Instrumentation & Measurement Magazine

August 2020

http://www.knowledgetransfer.net/dictionary/Storage/en/8b10b_encoding.htm http://www.knowledgetransfer.net/dictionary/Storage/en/8b10b_encoding.htm https://www.intel.in/content/dam/doc/white-paper/usb3-phy-interface-pci-express-paper.pdf https://www.intel.in/content/dam/doc/white-paper/usb3-phy-interface-pci-express-paper.pdf https://www.intel.in/content/dam/doc/white-paper/usb3-phy-interface-pci-express-paper.pdf https://www.edn.com/eye-diagram-basics-reading-and-applying-eye-diagrams/ https://www.edn.com/eye-diagram-basics-reading-and-applying-eye-diagrams/

Instrumentation & Measurement Magazine 23-5

Table of Contents for the Digital Edition of Instrumentation & Measurement Magazine 23-5