Evaluation_Engineering_October_2020 - 7

Press-fit contacts for elbow and
straight PCB sockets

TEST SOCKETS

Test Sockets Get a Plug
Playing a crucial interconnect role in integrated circuits and
semiconductor testing, test sockets, aka package probes,
serve the role of connecting a device and its tester. IC sockets
are categorized into two 1) test sockets for measuring electrical
characteristics, or 2) burn-in sockets for testing reliability.
IC sockets' applications include failure analysis engineering
test, production test, burn-in, and others. Most IC sockets are
compression-mounted, and can be designed to fit an existing
PC-board footprint.

LEMO connector
is known for
its Push-Pull
connector, and
their new harpoon
earthing pins
enable preinstalling easily
variable receptacles and sockets. The advantage
of these press-fit contacts is faster pre-assembly,
with no need to place washers and screw multiple
times. Simply align the connector and push firmly.
This pre-assembly will enable the assembly house
or final customer to turn the PCB board upside down
and run the parts through the reflow soldering oven.
This solution is planned for elbow and straight PCB
sockets of 0B & 1B series. The current design works
specifically with 1.6mm thickness boards.

LEMO

75 GHz Bandwidth RF Socket for 1280
I/O 0.25 pitch device
TE Connectivity's extra-large array (XLA) socket technology is presented as
providing more reliable performance, with 78% better warpage control than
traditional molded-socket technologies. The XLA socket technology allows TE to
design enhanced sockets to support high data speeds in next-generation data
centers. The utilization of PCB substrates versus other plastic materials results
in minimal warpage and enables TE to design the industry's largest one-piece
socket, with sizes up to 110mm x 110mm and a 10,000+ position count capability.
Because of its large capacity, these sockets are capable of fast data rates up to
56G bps. According to TE Connectivity, XLA socket technology also offers 33%
improved true position on the solder ball and contact, low coefficient of thermal
expansion mismatch to motherboard, mitigating SMT risks during customer
application. Two versions are available: the hybrid land grid array/ball grid array
(LGA/BGA), and the dual compression LGA/BGA.

Ironwood Electronics has a new 0.25 pitch socket
using a high-performance elastomer capable of 75
GHz, very low inductance and wide temperature
applications. The 1280 WLCSP socket is designed for
10 x 8 mm package size and operates at bandwidths
up to 75 GHz with less than 1dB of insertion loss
and a contact resistance of ~20 milliohms per pin.
The socket is mounted on the target PCB with no
soldering, and has a small footprint. This socket
uses a bolt-on lid with an integrated compression
mechanism. A compression screw adjusts
torque. This socket can be used for hand test and
temperature cycling as well as debugging application
in development and device characterization. The
temperature range is -55 C to +160 C.

TE Connectivity

Ironwood Electronics

Extra large array socket series

OCTOBER 2020 EVALUATIONENGINEERING.COM

7
http://www.EVALUATIONENGINEERING.COM
Evaluation_Engineering_October_2020

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