Evaluation Engineering - 15
Cohu: Cohu's new HSI2x instrument for the
well-established Diamondx ATE platform
is optimized for testing clock-embedded
and clock-forwarded serial interfaces commonly found in mobile, consumer, industrial, and automotive electronics. These ports
connect modems, cameras, displays, storage, and applications processors to enable
high bandwidth, low power consumption,
and low EMI. The HSI2x instrument features 32 transmit lanes and 24 receive
lanes with up to 12.8 Gbps data rate. The
instrument can be used for test of highspeed serial ports, such as HDMI, MIPI,
JESD204, PCI Express, SATA, EDP, Vby1,
and USB3."
Tektronix'
S535 Multi-Site
Test System.
Griffiths, Tektronix: "1: A new product
for this year is the S535 Multi-Site Test
System. Targeted at functional or acceptance testing, it is a high-power, highspeed, fully automated solution for testing
analog, wide bandgap, mixed-signal, and
discrete devices in applications across the
semiconductor fab workflow. By testing
multiple devices on multiple sites at the
same time, the S535 can more-thandouble a semiconductor fab's wafer test
capacity and significantly lower their cost
of ownership profile. 2: This year, we are
augmenting our Graphical Touchscreen
Source Measurement (SMU) line with a
new high voltage/lower current source
measure unit, the 2470, to extend the
characterization of high voltage, low
leakage semiconductors."
Eide, Mentor: "Mentor recently introduced automotive-grade automatic test
pattern generation (ATPG) technology
for the Tessent TestKompress product.
This ensures efficient testing and test
metrics for the hardest-to-detect defects
for manufacturing test. Mentor has also
introduced ATE-Connect to the Tessent
SiliconInsight product in collaboration with ATE vendors Teradyne and
Advantest. ATE-Connect dramatically
simplifies the silicon bring-up process, by
allowing DFT and test engineers to interactively communicate directly with test
instruments embedded on-chip."
JULY 2019 EVALUATIONENGINEERING.COM
15
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Evaluation Engineering
Table of Contents for the Digital Edition of Evaluation Engineering
Editorial: Following up on "brain drain" in test engineering
By the Numbers
Industry Report
Special Report: EMI/EMC Recievers and Amplifiers
Special Report: Semiconductor Test
Compliance: Recent developments in EMC legislation
Components: MEMS technology is transforming high-density switch matrices
Design for Test: DFT that gets AI chips to market faster
Wireless Test: Q&A: simulation's vital role in wireless testing
Tech Focus
Featured Tech
Industry Events Preview
Wearable Electronics: Putting on the future
Evaluation Engineering - Cover1
Evaluation Engineering - Cover2
Evaluation Engineering - 1
Evaluation Engineering - 2
Evaluation Engineering - 3
Evaluation Engineering - By the Numbers
Evaluation Engineering - 5
Evaluation Engineering - Industry Report
Evaluation Engineering - 7
Evaluation Engineering - Special Report: EMI/EMC Recievers and Amplifiers
Evaluation Engineering - 9
Evaluation Engineering - 10
Evaluation Engineering - Special Report: Semiconductor Test
Evaluation Engineering - 12
Evaluation Engineering - 13
Evaluation Engineering - 14
Evaluation Engineering - 15
Evaluation Engineering - Compliance: Recent developments in EMC legislation
Evaluation Engineering - 17
Evaluation Engineering - 18
Evaluation Engineering - Components: MEMS technology is transforming high-density switch matrices
Evaluation Engineering - 20
Evaluation Engineering - 21
Evaluation Engineering - Design for Test: DFT that gets AI chips to market faster
Evaluation Engineering - 23
Evaluation Engineering - 24
Evaluation Engineering - Wireless Test: Q&A: simulation's vital role in wireless testing
Evaluation Engineering - 26
Evaluation Engineering - Tech Focus
Evaluation Engineering - Featured Tech
Evaluation Engineering - 29
Evaluation Engineering - Industry Events Preview
Evaluation Engineering - 31
Evaluation Engineering - Wearable Electronics: Putting on the future
Evaluation Engineering - Cover3
Evaluation Engineering - Cover4
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