Evaluation Engineering - 14
RF/MICROWAVE
To best keep the laws of thermodynamics on your side, benchtop thermal test
systems can now combine the effects of
conduction plus convection under unified
control to maximize control over setpoint
temperatures and minimize transition
and stabilization times for faster testing.
"People often ref lexively think of a
chamber first when it comes to benchtop
Sponsored by
thermal testing," Booher said. "Especially
for flat microwave and RF packages, quite
often a thermal platform with its tremendous heat transfer capabilities and
accessibility while under test can greatly
outperform the slower heat transfer of a
standard convection chamber."
Total Temp Technologies recently introduced its dual-mode Hybrid Benchtop
Total Temp Technologies' traditional Benchtop
Temperature Chamber.
Temperature Test Chamber, which allows
faster and more effective thermal testing
of devices, regardless of different heat
capacity and active loads. Meanwhile,
Total Temp's product offering also features traditional benchtop temperature
chambers, and thermal platforms with
temperature ranges from -148 to 392 degrees Fahrenheit.
What's trending?
What are vendors seeing as trends in the
RF/microwave or 5G test area?
Mike Thorpe and Bryan Helmick, wireless device test product managers at
Rohde & Schwarz USA: "In 2019, we have
already seen a massive increase in 5G FR1
(400 MHz to 6 GHz) test requirements
as all versions of 5G NR FR1 are being
primed for deployment. Starting now
and continuing beyond the year 2020,
non-standalone (NSA) TDD and FDD,
standalone (SA) TDD, and FDD will be
the key technologies enabling the wide
acceptance of 5G NR."
Dr. Frank Kearney, director of engineering, Wireless Systems Group,
14
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Editor's Note: How safe are 5G signals?
By the Numbers
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IMS, Sensors Expo Preview
Data Acquisition Systems: Turnkey use, portability, and real-time analysis among customers' DAQ must-haves
Oscilloscopes: The recent history of today's high-end oscilloscope technology
RE/Microwave Test: 5G Brings new onslaught of challenges
ATE: Protecting AI Chips from thermal challenges during ATE test
Sensors: Sensors open new vistas in electronics
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