Evaluation Engineering - 4

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Big test topics produce
big results
As any regular reader of Evaluation
Engineering's monthly print or digital
issue knows, we feature two "Special
Reports" in every issue on a specific topic
relevant to electronic test & measurement.
One report discusses an instrumentation
topic, while the other discusses an applications topic. Both reports take deep dives
into the technology trends, challenges, customer demands, and new solutions in that
topic. We've received great feedback on
these reports throughout 2019, and it's always great to hear that readers find them
very informative.
As the biggest features in nearly each issue of the year, those Special Reports each
typically encompass three-to-five pages
of an EE issue. But in this October issue,
each report is supersized-crossing seven
pages each. Again, this is irregular, but the
anomaly is due to the topic of each report.
October's instrumentation report focuses
on portable instruments, while the applications report covers automotive test. Each of
these topics are broad, and resulted in EE
receiving the most vendor commentary submissions that we've received in my time here
as Editor-in-Chief. The portable instruments
report includes insights from 10 different
vendors, while the automotive test report
includes more than a dozen.
Even with allotting extra page space to
include as much vendor commentary as
we could, it was still a major challenge to
make things fit. Naturally, all commentary
couldn't be included in print, and to make
up for that, the website versions of each report on www.evaluationengineering.com
are expanded.
It's great to see so much interest and
vendor involvement in our Special Reports.
We'd always rather have too much commentary than too little. Certainly, the report
topics help dictate how much interest there
will be, and broad topics such as October's

4

EVALUATION ENGINEERING OCTOBER 2019

usually lead to a big turnout. Even so, the
volume of commentary we received for them
was stunning.
Furthermore on the topic of automotive
test, EE readers have a great opportunity
to see everything our Special Report covers and more at Automotive Testing Expo,
held Oct. 22-24 at the Suburban Collection
Showplace in Novi, MI, a short drive from
Detroit. The show features more than 400
exhibitors from the automotive test and
design space, as well as a slew of educational sessions each day, covering essentially
anything you could think of in automotive
component testing, validation technology,
autonomous driving, and much more. Learn
more about Automotive Testing Expo on
page 34 of this issue. EE's October print issue will be distributed at the show, so be
sure to pick up a copy.
Coinciding with that show, this October
issue goes heavy on automotive test coverage with two contributed articles-one
covering the evolution of vibration fixturing (pg. 23), and the other covering thermal
management (pg. 26).
On a somber note, this was actually my
last issue as Editor-in-Chief of EE. As of late
September, I have moved on to a different
trade publication outside of the electronics space, as an unexpected opportunity
suddenly arose. It's an odd time to depart
after only a year here at the helm of EE's
editorial content, but I'm leaving EE in capable hands at Endeavor Business Media,
and I know this publication will continue to
provide great content-in print, and much
more digitally-in its 58th year and beyond.
Thanks to our advertisers, vendors who have
provided valuable commentary, and to all
our readers. It's been a pleasure.

EDITOR-IN-CHIEF

$33.4 BILLION
July global
semiconductor sales

15.5%
Decrease in global semiconductor
sales year-over-year
Source: SIA

8.3%
Year-to-date sales growth
in PCB sales as of July

5.3%
Decrease in North American PCB
shipments in July year-over-year
Source: IPC

$2.03 BILLION
North American
semiconductor billings in July

14.5%
Decrease in North
American semiconductor
billings year-over-year
Source: SEMI
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Evaluation Engineering

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