IEEE Awards Booklet - 2021 - 24

2021 IEEE TECHNICAL FIELD AWARDS

IEEE Joseph F. Keithley Award in Instrumentation and Measurement
Sponsored by Keithley Instruments, a Tektronix Co. and the IEEE Instrumentation and Measurement Society

Eric W. Strid and K. Reed Gleason

For contributions to RF microprobing measurement techniques enabling accurate
on-wafer circuit testing

The microwave-frequency wafer-probing technologies developed by Eric. W. Strid and K. Reed Gleason during the 1980s
and 1990s transformed how high-frequency electronics are tested
and continue to fuel today's advances in semiconductor processes.
Strid and Gleason's wafer-level probe and subsequent probe card
allowed engineers to accurately test devices, develop models for
precise circuit simulations, and measure circuits before radio-frequency integrated circuits are packaged. This provides for minimal design iterations; drastically reduces product time-to-market;
and lowers the cost of developing new chips for Bluetooth, GPS,

WiFi, and cell phone applications. Their work is critical to test
and measurement aspects of emerging technologies including 5G
and energy-saving silicon-based optical transceivers for hyperscale datacenters.
An IEEE Life Senior Member, Strid retired from the Board of
Directors of Cascade Microtech in 2016 and currently resides in
White Salmon, WA. USA.
Gleason is technical director, development engineering with
Form Factor, Inc., Livermore, CA, USA.

IEEE Gustav Robert Kirchhoff Award

IEEE Leon K. Kirchmayer Graduate Teaching Award

Sponsored by the IEEE Circuits and Systems Society

Sponsored by the Leon K. Kirchmayer Memorial Fund

Thomas H. Lee

Andrea Goldsmith

For pioneering CMOS technology for
high-performance wireless circuits and
systems

For educating, developing, guiding, and
energizing generations of highly successful students and postdoctoral fellows

Spearheading a new research direction in CMOS analog circuit
design, Thomas H. Lee has been a driving force in realizing the
integration of an entire radio system on a chip critical to powering the wireless revolution. Lee began his work at a time when
there were no true RF CMOS circuits, and industry considered
the technology poorly suited for wireless applications. However,
with research addressing the understanding of noise in oscillators
and amplifiers to develop device noise models, low-noise amplifier design, oscillator phase noise modeling, and on-chip inductor
design, Lee demonstrated CMOS technology enabling mass-produced chips with very wide usage. Today, CMOS is the technology of choice for WiFi, Bluetooth, and GPS and will be key to
emerging technologies such as 5G cellular, automotive radar, and
the Internet of Things.
An IEEE Fellow, Lee is is a professor of electrical engineering
with Stanford University, Stanford, CA, USA.

A wireless communications expert, Andrea Goldsmith has excelled at inspiring graduate students and postdoctoral fellows
through her teachings, development of groundbreaking texts,
and life-long mentorship. She has impacted the wireless revolution with her own research contributions on the fundamentals of
wireless communication and the multitude of graduate students
she has directly taught, advised, and mentored who have gone on
to deeply influence the field. Her foundational textbook Wireless Communication (Cambridge University Press, 2005) has been
read by thousands of wireless engineers. Beyond students at her
own institutions, she has devoted significant effort to mentoring
women students and postdocs from universities around the world,
helping them obtain and be successful in academic and industry
careers and thus diversifying the field.
An IEEE Fellow, Goldsmith is the dean of Engineering and Applied Science at Princeton University, Princeton, NJ, USA.

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IEEE Awards Booklet - 2021

Table of Contents for the Digital Edition of IEEE Awards Booklet - 2021

Table of Contents
IEEE Awards Booklet - 2021 - Cover1
IEEE Awards Booklet - 2021 - Cover2
IEEE Awards Booklet - 2021 - 1
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IEEE Awards Booklet - 2021 - Table of Contents
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IEEE Awards Booklet - 2021 - Cover3
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