IEEE Consumer Electronics Magazine - January/February 2023 - 3

COLUMNS & DEPARTMENTS
IEEE CONSUMER ELECTRONICS MAGAZINE EDITORIAL BOARD
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EDITOR-IN-CHIEF
Norbert Herencsar
Department of Telecommunications
Faculty of Electrical Engineering
and Communication
Brno University of Technology,
Czech Republic
herencsn@ieee.org
PAST EDITORS-IN-CHIEF
Peter Corcoran
National University of Ireland, Galway
dr.peter.corcoran@ieee.org
Saraju P. Mohanty
University of North Texas, USA
Shingo Yamaguchi
Yamaguchi Univeristy, Japan
SENIOR ASSOCIATE EDITORS
Wen-Huang Cheng
National Yang Ming Chiao Tung
University, Taiwan
whcheng@nycu.edu.tw
Kim-Kwang Raymond Choo
University of Texas at San
Antonio, USA
raymond.choo@fulbrightmail.org
ASSOCIATE EDITORS
Vinay Chamola
Birla Institute of Technology
and Science - Pilani, India
vinay.chamola@pilani.bits-pilani.
ac.in
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Yen-Lin Chen
National Taipei University
of Technology, Taiwan
ylchen@mail.ntut.edu.tw
Kapal Dev
Munster Technological University,
Ireland
kapal.dev@ieee.org
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Wahab Almuhtdi
Algonquin College, Canada
almuhtw@algonquincollege.com
Haiwei Dong
Huawei Technologies, Canada
haiwei.dong@ieee.org
Ahmed Farouk
Wilfrid Laurier University; South
Valley University, Canada; Egypt
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Jianlong Fu
Microsoft Research, China
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Keke Gai
Beijing Institute of Technology,
China
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Comcast Corporation, Israel
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National Chung Cheng
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Bob Frankston
Frankston.com, United States
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Fabrizio Lamberti
Politecnico di Torino, Italy
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Federal University of Amazonas,
Brazil
vicente@ufam.edu.br
Zhihan Lv
Uppsala University, Sweden
lvzhihan@gmail.com
Lia Morra
Politecnico di Torino, Italy
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Hassnaa Moustafa
Intel Corporation, United States
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Wai Yin, Steve Mung
The Education University
of Hong Kong
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Vijayakumar Pandi
Anna University, India
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Lucia Pepa
Politecnica delle Marche
University, Italy
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Fernando Pescador
Universidad Politécnica de
Madrid, Spain
fernando.pescador@upm.es
Mohammad Shojafar
University of Surrey,
United Kingdom
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Qingxue Zhang
Indiana University-Purdue
University Indianapolis, USA
qxzhang@purdue.edu
Rafael Sotelo
Quantum-South & Universidad
de Montevideo, Uruguay
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Gordana Velikic
Vincula Biotech, Serbia
gvelster@gmail.com
Zheng Yan
Xidian University, China
zheng.yan@aalto.fi
Chia-Mu Yu
National Yang Ming Chiao Tung
University, Taiwan
chiamuyu@gmail.com
Lei Shu
University of Lincoln; Nanjing
Agricultural University
United Kingdom, China
lei.shu@ieee.org
Ned Smith
Intel Corporation, United States
ned.smith@intel.com
Mehdi Sookhak
Texas AM University-Corpus
Christi, United States
m.sookhak@ieee.org
Abdulmotaleb El Saddik
University of Ottawa, Canada
elsaddik@uottawa.ca
Dario Sabella
Intel Corporation, Italy
dario.sabella@intel.com
Michael Mattioli
Goldman Sachs & Co., United States
michael.mattioli@gs.com
IEEE CONSUMER ELECTRONICS MAGAZINE
^
JANUARY/FEBRUARY 2023
Digital Object Identifier 10.1109/MCE.2022.3216192
3
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IEEE Consumer Electronics Magazine - January/February 2023

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