IEEE Solid-States Circuits Magazine - Fall 2021 - 78

If we go down the path of monolithically
integrating input-output (wireless, optical,
electrical) with digital compute and memory,
it will lead to suboptimality in the radio
frequency and I/O devices.
market. This article presents an overview
of 2.5D and 3D heterogeneous
technologies and how they can be
leveraged to create new intelligentcompute-communicate
platforms to
enable emerging applications.
Moore's Law and Path
to Heterogeneity
In [3], there are multiple references
to the need for heterogeneous integration.
The article points out that
cramming more and more functions
into a single die may become
untenable due to cost. This has
become a reality today: to support
the 2× per two-year increase in CPU
and GPU performance gains and
increased functionality, die sizes
have to increase consistently, while
cost per yielded mm2 for a 250-mm2
die has increased at a higher rate
starting with 16-nm and 14-nm
process technologies. The push
toward larger die sizes has also
pushed the reticle size to its limit
as of 2020, making this an unsustainable
endeavor. This is primarily
due to the slowdown in technology
scaling. For example, if technology
scaling can only give 1.5× (rather
than 2×) more devices every two
User Experience Data Rate
(Gb/s)
Mobility Support
(km/h)
1,000
100
5G
10
10
2×
Energy Efficiency
1
10
100
Spectral Efficiency
(b/s/Hz)
10
106
107
0.1
1
Air Latency
(ms)
FIGURE 1: The definition of 6G versus 5G.
78
FALL 2021
IEEE SOLID-STATE CIRCUITS MAGAZINE
Connection Density
(Devices/km2)
105
Intelligence
1×
0.1×
10-5
10-6
10-7
Reliability
1
0.1
0.01
Peak Data Rate
(Gb/s)
6G
100
1,000
Security
years, then semiconductor chips
are made 1.33× larger to obtain 2×
more transistors on the die to support
increased functionality. However,
this approach has a negative
impact on yield. Larger dies will increase
the percentage of yield loss. In
a hypothetical example, using smaller
dies may yield 362 good dies out
of 395 total dies on a single wafer
resulting in 8% yield loss [4]. When
die size is increased, a wafer can fit
only 192 dies, of which there may
be only 162 good dies, resulting in
16% yield loss.
An alternate path to supporting a
system with increased functionality
and accommodating higher number
of transistors is to break up the system
into smaller chips and integrate
them on a package or an interposer,
which will mitigate the yield loss issue
[4], [5]. However, this approach
comes with overheads. Additional
area is required for interfaces and

IEEE Solid-States Circuits Magazine - Fall 2021

Table of Contents for the Digital Edition of IEEE Solid-States Circuits Magazine - Fall 2021

Contents
IEEE Solid-States Circuits Magazine - Fall 2021 - Cover1
IEEE Solid-States Circuits Magazine - Fall 2021 - Cover2
IEEE Solid-States Circuits Magazine - Fall 2021 - Contents
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