IEEE Power Electronics Magazine - September 2014 - 41

Society News

2015 IWIPP Workshop
Comes to Chicago

results, promote a vigorous exchange
ith the advent of wideof information, and facilitate rapid
bandgap and silicon power
advancement of the technical field.
semiconductor devices and
The IWIPP is sponsored by the IEEE
compact power converter technoloPower Electronics Society.
gies, power semiconductor packaging
Topics include material technologies
and system integration are playing a
to power converters that address imporvital role in the development of newtant challenges and present solutions to
generation semiconductor devices and
reduce the cost and size of power conintegrated power modules. Conseverters with the highest energy-converquently, an IEEE committee, chaired
sion efficiency. Of particular interest are
by Dr. Krishna Shenai of Argonne
the packaging and thermal management
National Laboratory, has organized the
of advanced semiconInternational IEEE
ductor devices and
Workshop on Intepower switch modgrated Power PackThe deadline for the
ules, integrated gate/
aging (IWIPP). This
two-page extendedbase drivers, highworkshop will bring
summary submission
frequency magnetics
together researchers
is 15 December 2014.
and high-temperature
in the field of power
capacitors, electroelectronics compoNotification of accepmagnetic interfernents and packaging
tance/rejection will
ence, data sheets,
technologies to rapbe announced by
standards, and modidly promote the
31 January 2015.
ule reliability in end
development and
applications.
commercialization of
According to
high-density and
the organizers, technical papers are
high-efficiency power converters. To
solicited on the following topics:
be held at the Congress Plaza Hotel in
Chicago, Illinois, on 3-6 May 2015, the
■ system integration and optimization
IWIPP will provide a forum for the dis■ compact converter design techniques
semination of the latest technical
■ modeling and simulation
■ materials and packaging technology
■ power semiconductor devices
Digital Object Identifier 10.1109/MPEL.2014.2331263
Date of publication: 5 September 2014
■ power modules

September 2014

gate/base drivers
thermal management and threedimensional packaging
■ electromagnetic interference
■ sensors and protection
■ high-frequency magnetics
■ high-temperature capacitors
■ reliability assessment and lifetime
prediction
■ functional safety and product/data
sheet standards.
The deadline for the two-page
extended-summary submission is
15 December 2014. Notification of acceptance/rejection will be announced
by 31 January 2015. The deadline for
the four-page full-paper submission is
28 February 2015.
For more information, please
visit the IWIPP Web site at http://
www.iwipp.org. Questions pertaining to IWIPP 2015 may be addressed
to General Chair Dr. Krishna Shenai at kshenai@anl.gov or Technical Program Chair Dr. Ty McNutt at
tmcnutt@apei.net.
■
■

 IEEE POWER ELECTRONICS MAGAZINE

http://http:// http://www.iwipp.org

Table of Contents for the Digital Edition of IEEE Power Electronics Magazine - September 2014