IEEE Spectrum April, 2011 - 51

CALL FOR PARTICIPATION
IEEE TTM is a unique event for industry leaders, academics and decision making government
officials who direct R&D activities, plan research programs or manage portfolios of research
activities.This is the first ever organized Symposium of future technologies and will cover in a
tutorial way a selected set of potentially high impact emerging technologies, their current state
of maturity and scenarios for the future.
The Symposium brings world renowned experts to discuss the evolutionary and
revolutionary advances in technology landscapes as we look forward to 2020. All the
presentations in this Symposium are given by invited World leading experts. The Symposium
is structured to facilitate informal discussions among the participants and speakers. As the
number of participants will be kept relatively small, this Symposium provides an excellent
opportunity for informal interaction between the attendees and senior business leaders and
world-renowned innovators. At the conclusion of the formal Symposium there will be an in
depth session on the state of Cloud Computing. The Symposium will also provide the
opportunity to visit some leading Hong Kong and Chinese research institutes and industries.
Sponsored by:

The IEEE TTM Symposium will be held in Asia's world city, Hong Kong. Hong Kong is a
very unique city with a true mixture of eastern and western values and combining the exotic
with the convenience of a modern thriving city. Attending the IEEE TTM2011 is therefore a
perfect way to experience the regions' unique technology and business activities along with the
fast growing vibrant economies and the excitement of China and Asia.
Please visit the TTM Symposium web site for more information:

Organizing Committee:
Executive Chair:
Roberto de Marca, PUC/Rio, Brazil
General Co-Chair:
Khaled B. Letaief, HKUST, HK
Nim Cheung, ASTRI, HK
Program Committee Chair:
Yrjö Neuvo, Aalto University, Former
Nokia CTO, Finland
Publicity Chair:
Amine Bermak, HKUST, HK
IEEE Staff Liaison:
Bichlien Hoang, IEEE, USA
William R. Tonti, IEEE USA
Treasurer:
Joanne Tse, BMT Asia Pac. Ltd., HK
Webmaster:
Ethan Fangyong Li, HKUST, HK

Program Committee:
Yrjö Neuvo, Aalto University, Finland
Rico Malvar, Microsoft, USA
Paul Farrar, IBM, USA
Botaro Hirosaki, NEC, Japan
Maurizio Dècina, Politecnico di
Milano, Italy
Christophe Diot, Technicolor Ltd.
France
Philipp Zhang, Huawei Tech. co., Ltd.,
China
Sami Ylönen, Aalto University,
Finland
Ada Poon, Stanford University, USA
Adam Drobot, 2M Company Inc. USA
Gudrun Zahlmann, F. Hoffmann-La
Roche Ltd., Switzerland

Co-organized by:

http://www.techbeyond2020.ust.hk/about.html

Plenary topics:
 Impact of Technology on Environment
 China's Path to Technology Leadership
 Smart Grid
Sessions:
 Future Directions in Wireless
 Future of Silicon-based Microelectronics
 Carbon Nanostructures and Conducting Polymers in Electronics
 Cloud Computing
 E-Health
 Internet of Things
 Digital Content at Home (Displays, Connectivity, Usability, etc.)
 Advances in Biomedical Engineering
 Future Mobile Services
 Energy Harvesting and Storage (batteries, super capacitors)
Keynote and Invited Speakers:
 Nobuhiro Endo, CEO, NEC Corporation, Japan
 George Arnold, National Coordinator for Smart Grid Interoperability, NIST, USA
 Philipp Zhang, Chief Scientist, Huawei Technologies co., Ltd., China
 Ghavam Shahidi, IBM Fellow, Director of Silicon Tech., IBM Watson Research Ctr., USA
 Joe Weinman, Worldwide Lead, Comm., Media, and Entertainment Ind. Sol., HP, USA
 Peter Hartwell, Senior Scientist, Hewlett-Packard Laboratories, USA
 Hugh Bradlow, Chief Technology Officer, Telstra, Australia
 Micheal Austin, Vice President, BYD America, USA
 Raj Jammy, Director of Silicon Front End processing, Sematech, USA
 Jia Ma, Chief Scientist, Wuxi SensiNet Institute, China
 Roberto Saracco, Director, Telecom Italia Future Center, Italy
 Tero Ojanperä, Executive VP, Head of Services and Dev. Experience, Nokia, Finland
 Minoru Etoh, Managing Director of Multimedia Laboratories at NTT DoCoMo
 Pierre Mars,Vice President, Applications Engineering, CAP-XX, Australia
Further information:
Amine Bermak, Electronic and Computer Engineering Department, HKUST
Clear Water Bay, Kowloon, Hong Kong, Tel. +852-2358 8992, Fax. +852-2358 1485,
Email: eebermak@ece.ust.hk
http://www.techbeyond2020.ust.hk/about.html
Table of Contents for the Digital Edition of IEEE Spectrum April, 2011
