Antenna Systems & Technology - Fall 2013 - (Page 4)
Bluetooth Module for Apple
Laird has released its BTM46x series Bluetooth modules. Mass production quantities
of modules and the associated development
kits are now available directly from Laird.
Based on the Cambridge Silicon Radio
(CSR) BC04 chipset, the innovative firmware on the BTM46x series allows OEMs
to seamlessly support Bluetooth data connectivity for all PCs, smartphones and tablets including Apple iOS devices. The BTM46x firmware
enables Apple licensees to leverage Bluetooth data connectivity, via the
iAP protocol, into their MFI accessories, enabling rapid time to market
for their products.
Key application areas for the BTM46x series include medical devices,
ePOS terminals, barcode scanners, industrial cable replacement and
smartphone/tablet ‘Appcessories’. Every BTM46x series module is designed to add short-range Bluetooth data connectivity to any device.
With a compact footprint of 12.5 by 22 mm, the modules deliver maximum range with minimum size. The modules are designed to support
a separate power supply for I/O, in addition to including a complete
Bluetooth v2.1 protocol stack for increased ease of integration. The BTM46x series provides support for multi-point connections and includes
the following Bluetooth profiles: Serial Port Profile (SPP), HID (Human
Interface Device) and Apple’s iAP protocol. BTM46x modules are fully
qualified as a Bluetooth End Product, whilst also holding FCC Modular,
IC, CE and MIC (Japan) regulatory approvals, enabling designers to
quickly integrate the modules into devices without the need for additional qualification resources.
Improved PIM RO4700JXR Series Antenna
Rogers Corp. Advanced Circuit Materials Division has introduced improved high frequency materials to address several market needs. The
improved RO4700JXR series antenna grade laminates were designed
for use in base station, RFID and other antenna designs and combine
low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss. The specially formulated
RO4700JXR thermoset resin system incorporates a hollow microsphere
filler resulting in a light weight, low density laminate, which is approximately 30 percent lighter weight than woven-glass PTFE materials. In
addition, RO4725JXR (2.55 Dk) and RO4730JXR (3.0 DK) laminates
provide a lower cost solution for high frequency circuit boards used in
base station and other antennas.
RO4700JXR laminates feature a low Z-axis coefficient of thermal expansion (CTE of RO4700JXR series RoHS-compliant laminates are compatible with standard PCB fabrication techniques and plated-through-hole
(PTH) processing. Designed for base station and other RFID antennas,
the proprietary, halogen-free laminates support longer drill tool lifetimes than other filled materials, reducing fabrication costs.
Antenna Systems & Technology Fall 2013
Volume 16 / Issue 3
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Table of Contents for the Digital Edition of Antenna Systems & Technology - Fall 2013
Exponential M2M Market Growth Calls for Innovative RF and Antenna Solutions
Managing Distributed Antenna Systems Effectively and Efficiently
Millimeter Wave Antenna Radome Systems for Satellite on the Move Applications
Test & Measurement
Antenna Systems 2013: Conference Preview
Addressing Customer Requirements in Public Safety Antennas
Antenna Systems & Technology - Fall 2013