Electronics Protection - September/October 2011 - (Page 18)

Thermal New ATS Heat Sinks Feature Push Pin Mounting Advanced Thermal Solutions, Inc. (ATS) now provides maxiFLOW heat sinks with an integral push pin mounting system for fast, safe attachment of the heat sinks onto BGAs and other hot components. Each heat sink comes with a pair of durable plastic or brass push. The pins run through opposite corners of the heat sinks and mount securely into 3 mm holes in the PCB laid out in industry standard patterns. An integral spring on each pin provides approximately 2 lbs. of retention load, depending on the height of the component and the PCB thickness. The ATS maxiFLOW sinks feature a low profile, spread fin array that maximizes surface area for more effective convection cooling in the restricted airflow conditions typical in condensed electronic packages. The heat sinks are fabricated from light weight, extruded aluminum, which minimizes thermal resistance from the base to the fins. They have a protective green anodized surface. The push pin mount maxiFLOW heat sinks are available in sizes ranging from 37.4 by 37.5 by 10.0 mm up to 41.4 by 45.75 by 24.5 mm. Each maxiFLOW heat sink is provided preassembled with a Chomerics T766 phase change thermal interface material (TIM) for improved component-to-sink thermal transfer. The pad is centered on the base of the sink. CFD Data Center Software Breaks Costs Barriers CoolitDC tackles complete data centers and drills down to servers, boards and even components. Designed for designing new facilities or troubleshooting existing ones, the CFD software is being offered at a low introductory price. Developed by Daat Research Corp., CoolitDC is built on Daat’s advanced computational engine. CoolitDC handles complex facility shapes, raised floors, drop ceilings, room partitions, support columns, under floor pipes, cables and obstructions, furniture and other infrastructure components. It also accounts for room ventilation components such as fans, ducts and vents. The user interface takes full advantage of drag and drop operation. Thermal models are constructed using the software’s extensive library of cooling devices, racks and tiles from major manufacturers. In addition, CoolitDC includes basic building blocks that allow the user to modify existing library components or create custom devices. With what-if models, the user can quickly analyze the impact of configuration and equipment options. Hot spots are flagged by temperature-colored fog, and airflow can be animated to show flow direction, speed and temperature throughout the data center. Results are displayed visually and in tabular form so both technical and non-technical personnel can visualize and assess impacts. IMS Expands Line of Therma-Bridge Passive Thermal Management Devices Orion Fans Expands Custom Fan Tray Solutions With Three-Position AC Fan Tray International Manufacturing Services, Inc. (IMS) has expanded their line of ThermaBridge thermal transfer devices by adding several new sizes in response to customer demand. The Therma-Bridge is an electrically isolated, surface mountable chip device used to thermally conductive heat away from power component such as FETs, LEDs, pin and laser diodes. This device’s construction allows users to micro manage board hot spots in high-power modules such as RF amplifiers, transceivers, rugged conduction cooled computer terminals, switches and power converters. Sixteen different sizes are now available to fit numerous thermal transfer configurations. Orion Fans has developed a new AC three-position short fan tray. Designated the OA300ST series, the fan tray features three sealed ball-bearing fans and can be installed in any standard 19 inch rack. The fan tray is well suited for a variety of racks and enclosure applications including industrial control cabinets and network system enclosures. Available in 115 VAC and 230VAC versions, the OA300ST Series AC fan trays achieve airflows up to 320 CFM and low-noise versions are available. The three position fan trays feature a ball-bearing system, 2 M-length power cord, a lighted rocker switch and a resettable circuit breaker. Rated power for the standard highspeed model is 45 W. Operating temperatures range from -20°C to 80°C, and the fans feature a life expectancy of 60,000 hours at 40°C. The steel fan trays also feature a black electro deposit finish. FrigoDynamics Launches Series of Two-Phase Heat Exchanger Coolers FrigoDynamics has launched a series of coolers designed for thermal management in the LED market. The two phase heat exchanger designs allow high levels of power dissipation with zero power consumption. The coolers are offered in a wide range of sizes for space constrained applications. The products is lightweight, compact, silent, easy to install and have no operating costs. “Active cooling cannot sustain the demands of the developing LED market,” said Hans Kunstwadl, FrigoDynamic’s managing director. “We understand the constraints LED manufacturers have produced passive coolers for these demans.” 18 September/October 2011 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - September/October 2011

Electronics Protection - September/October 2011
Crenlo Adds Rolling Transit Case to Lineup of Emcor Enclosures
Emerson Network Power Introduces Knurr DCM Enclosures for Nexus 7000 Series Switches
Evaluating the Opportunity for DC Power in the Data Center
An Update on Arc Flash: Revised Regulations and Best Practices Help Keep Workers Safe
Re-Designed Panelboards Proivde Savings for Hazardous Applications
MetCase Launches Retex Flat-Packed 19 Inch Wall Rack System
New SlimShield Two-Piece Board Level Shielding Offers Shield Heights Down to 0.060 inches
FrigoDynamics Launches Series of Two-Phase Heat Exchanger Coolers
Rogers Corp. Launches New Solutions for Thermal Management
SurgeX Space Savers Offer Maximum Protection with Minimum Footprint
Amphenol’s Expanded Neptune Connector Line Provide Better Environmental Protection
Industry News
Calendar of Events

Electronics Protection - September/October 2011