Electronics Protection - January/February 2012 - (Page 28)

Industry News Global Electronic Thermal Management Market To Reach $8.6 Billion by 2015 GIA has released a comprehensive global report on Electronic Thermal Management markets. The global market for electronic thermal management is forecast to reach $8.6 billion by the year 2015. Factors driving growth include developments in technology and marked increase in the production of miniaturized microprocessors. Further, increased use of mobile devices is likely to impact market growth. Growth momentum in the electronic thermal management market derailed during the years 2008 and 2009 due to the global economic recession. Decline in various end-use sectors including automotive, computers, telecom, industrial/military, medical/office equipment and consumer electronics dampened the market prospects during the period. However, with the recovery of global economic scenario in 2010, the market is likely to stabilize and register growth in subsequent years. Developments in technology and marked increase in the production of miniaturized microprocessors along with increased use of mobile devices are likely to impact market growth. In the wake of growing sophistication and functionality of a variety of electronics systems, thermal management has assumed an important role in the management of costs associated with product development and time required for market release. With developments in technology and marked increase in the production of miniaturized microprocessors, demand for electronic thermal management devices is on a rise. The miniature size of the processor and the enhanced power levels generate high levels of heat. Devices are required to moderate this and to cool heat generation. Electronic thermal management devices are likely to command a premium market in the coming years for their effective use in PCs, telecommunication systems and servers. Also, demand is likely to increase with system integrators and original equipment manufacturers (OEMs) integrating more components on PCBs. Nevertheless, market growth is likely to be restricted with the system-on-chip design complexities. The US represents the largest regional market for electronic thermal management worldwide. The US electronic thermal management market is expected to cash in on the rising complexities associated with board level packaging as well as with miniaturization of components. Power densities continue to rise unabated at board level package, resulting in demand for powerful and efficient thermal management products. Hardware products such as heat sinks and thermoelectric coolers, and software for designing these products would be the key beneficiaries. Asia-Pacific represents the second largest market for electronic thermal management. Registering a CAGR of more than 5 percent over the analysis period, the region also represents the fastest growing market for electronic thermal management. Hardware category constitutes the largest product segment, while software is poised to demonstrate fastest growth with a CAGR of more than 7 percent through 2015. By end-use, Computers represents the largest end-use segment. On the other hand, the application of electronic thermal management solutions is projected to demonstrate fastest growth in medical/office equipment with a CAGR of more than 8 percent over the analysis period. Thermal management for cooling advanced products requires the device design to be aligned in parallel form with the design of the electronic product. The techniques used in the thermal modules effectively predict the thermal behavior of a product and helps in the electronic component designing at a great saving in cost for optimal thermal performance. The computational fluid dynamics (CFD) modeling simulations facilitate designing of the product allowing for convective heat transfer and airflow. The CFD simulations provide an indication of the heat distribution at various points in the device such as components, system and board level. ensure proper indoor air quality by introducing fresh outdoor air, controlling room dew point by dehumidifying or humidifying, and maintaining a slight positive pressure in the data center. Munters IASE heat rejection units include on-board refrigeration to supplement the heat exchanger (HX) cooling as required. Based on the data center operating conditions, the HX will provide 100 percent of the cooling for almost 70 percent of annual hours in the mild Sydney environment. The units are predicted to have an annual SEER of just over 40. The equipment includes industrial grade controls for reliable performance and integration with the building management system. Mersen to Acquire Eldre Mersen has entered into an agreement in principle with Eldre, a worldwide pure player in laminated busbars, for its acquisition. This acquisition allows the Mersen to expand its current product range supporting the improvement of efficiency, performance and safety of power electronics. Already a producer of fuses and cooling products for the protection of semiconductors, Mersen will now add laminated busbars to its bundled offer. The Group will therefore reinforce its position as a global reference partner for power electronics applications. “I’m delighted to welcome the team that has driven Eldre to its leading position, said Marc Vinet, group vice president, Electrical Protection, Mersen. “With our on-going portfolio expansion and our current global operations, we bring our application expertise and logistic support to our partner customers at the heart of their power electronics solutions.” IMI Sensors Receives GOST-R Certification For Accelerometers Munters Indirect Air-Side Economizer Units Installed on Australian Data Center A major data center in Sydney, Australia is now equipped with 44 rooftop units from Munters to achieve optimum infrastructure conditions. Forty Indirect Air-Side Economizer (IASE) cooling units that feature Munters polymer tube air-to-air heat exchangers provide efficient heat rejection in both dry (winter mode) and wet conditions (summer indirect evaporative cooling mode). Munters also provided four ventilation/humidity control units that 28 IMI Sensors has obtained GOST-R certification for its predictive maintenance line of ICP accelerometers, as well as 4-20 mA vibration transmitters and vibration switches. GOST-R certification is required of instrumentation that will be used in Russia in potentially hazardous or explosive areas. The certification covers IMI’s industrial ICP accelerometer series designed for permanent mount applications. Series 602, 603, 606, 607 and 608 accelerometers have gained approval. Precision accelerometer models in series 622, 623 and 628 are also certified. All vibration transmitters in IMI’s growing 4-20 mA product offering are also approved. This includes all 64X series models and the 649 series Reciprocating Machinery Protector. All three January/February 2012 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - January/February 2012

Pentair Technical Products Expands Hoffman Line of Floor-Mount Type 4 Enclosures
A Look Ahead to 2012: The New UL 50 12th Edition Standard for Electrical Enclosures
Extending the Life of Electronics
Energy Management Using Molded Polyurethane Foam Inserts
Tools for Custom Connector and Cable Solutions
PowerSkin Unveils Battery-Boosting Skin for HTC Amaze 4G
Emerson Network Power Introduces the DCF Optimized Rack System
Littelfuse Introduces the SP3012 Series TVS Diode Arrays for Protection of USB 3.0 Ports
Schneider Electric’s Cooling Solution Portfolio Brings Efficiency, Flexibility and Reliability to Data Center Cooling
Eaton’s 9E UPS Delivers Simple Power Management for Complex IT Environments
PEM C.A.P.S. Captive Panel Screws Offered in Three Mounting Styles26
Industry News
Calendar of Events

Electronics Protection - January/February 2012