Electronics Protection - June/July 2012 - (Page 6)

Editor’s Choice OKW is now offers its designoriented standard plastic enclosures in a bioplastic material. This biomaterial is entirely manufactured from renewable raw materials and is formulated to replace the fossil plastics currently being used. Unlike conventional raw materials, bioplastics are largely CO2 neutral, irrespective of their subsequent utilization. After they have been used, materials made from plants release only the same amount of CO2 as they absorbed from the atmosphere during their growth phase. After comprehensive tests with many different types of biomaterials, OKW decided in favour of the Biograde C7500 plastic produced by FKuR Kunststoff GmbH. This is obtained from almost 100 percent renewable raw materials; the initial products are cotton or wood. At the start of the process, the purified cellulose is esterified to obtain cellulose acetate (CA), which is then only slightly modified. This material has similar properties to ABS and can be processed using the normal injection molding method. For indoor applications there are no restrictions to the life cycle of the enclosure. The heat distortion temperature is as high as 123°C. Customer-specific coloring is also possible through the use of 15 natural dyes. Parts made of Biograde are biodegradable. After the biomaterial has been crushed mechanically, it is broken down into its non-toxic initial products by micro-organisms. If it is to be utilized thermally at the end of its useful life, this also guarantees carbonneutral energy. Renewable Raw Materials - The Future of Plastic Enclosures While mechanical performance of plastics can be enhanced through reinforcements and filler loadings, higher amounts of these additives often impair processability in the molten state. A better resolution of this dilemma is still an ongoing issue. New Butterfly-Inspired Design Enables More Advanced, Low Cost Thermal Imaging Devices Taking heat detection to a new level of sensitivity and speed, a team of scientists at GE Global Research has announced new bio-inspired nanostructured systems that could outperform thermal imaging devices available today. This discovery adds to a growing list of new capabilities that GE researchers have developed through their studies of Morpho butterfly wings. “The iridescence of Morpho butterflies has inspired our team for another technological opportunity. This time we see the potential to develop the next generation of thermal imaging sensors that deliver higher sensitivity and faster response times in a more simplified, cost-effective design,” said Dr. Radislav Potyrailo, Principal Scientist at GE Global Research. Thermal imaging is utilized in a variety of industrial, medical and military applications. GE’s bio-inspired nanostructured system could enable an even broader application of thermal imaging by improving the manufacturability, image resolution, sensitivity and response time of new systems. These advances would enable the production of more advanced systems at much lower cost. Market for Plastics in Electronics Components to Reach 4.4 Billion Pounds in 2017 Snow Lizard Products Kicks-Off Aqua TEK S iPhone Case According to a new technical market research report, Plastics in Electronic Components: Technologies and Global Markets, from BCC Research, the global volume for plastics in electronic components is expected to reach 3.5 billion pounds in 2012 and increase to 4.4 billion pounds in 2017, a five-year compound annual growth rate (CAGR) of 4.7 percent. The global market for plastics in electronic components can be separated into two segments: thermoplastic and thermoset. In 2012, thermoplastics are expected to total nearly 2.5 billion pounds and, in 2017, the volume should reach 3.1 billion pounds, a CAGR of 4.9 percent. The thermoset segment is projected to total nearly 1.1 billion pounds in 2012 and, by 2017 the segment should reach 1.3 billion pounds, a CAGR of 4.3 percent. Resin consumption in electronic components is made up of a select group of engineering thermoplastics led by nylon and thermoplastic polyesters in volume. Based on value, however, higher performance resins such as polyphenylene sulfide, polyimides, polyketones and liquid crystal polymers have become more significant factors in the market. Engineering thermoplastics dominate the molded electronic component segment, of which connectors are the most important. The advantages of using plastics parts as opposed to other materials for electronic components must be weighed against their disadvantages. To decrease already small component sizes, melts used in molding components must possess excellent flow and precise molding, thermal endurance and dimensional stability due to tight space constraints and relatively high operational temperatures. 6 Snow Lizard Products has unveiled the Aqua TEK S, the first ever battery powered, solar charged, rugged under water iPhone 4/4S case on Kickstarter.The AQUA TEK S provides rugged protection in any environment. Waterproof up to 20 feet and designed to withstand drops, falls and accidental spills, the outer shell is made from tough Poly-carbonate materials with rubber grips for added protection. The AQUA TEK S’ built in battery and solar charger gives users peace of mind about running out of power. It’s easy to secure the phone in the AQUA TEK S with a top loading lid that fully protects the iPhone, yet provides access to the camera, volume buttons, speakers and Multi-touch display. “The iPhone is a great device but is too fragile to withstand the rigors of the outdoor enthusiast,” said Andreas Haase, Aqua TEK S development team. “With Aqua TEK S users can take thier iPhone to places where no iPhone has gone before, this is the perfect solution for rock climbers, river rafters and beach bums alike.” Aqua TEK is expected to retail for 129.99 and with a Kickstarter pledge of $100, there’s a chance to receive one of the first AQUA TEK S cases in signal orange, black night and urban camouflage. June/July 2012 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - June/July 2012

Electronics Protection - June/July 2012
FLIR T-series Cameras Introduce Thermal Image Enhancement Technology
Renewable Raw Materials - The Future of Plastic Enclosures
Global Electronic Enclosure Resins and Markets
Ferrite Testing Reveals Significant Performance Variations
Packaging Solutions for Critical Electronics Protection in Challenging Environments
Fluid Submersion Technology for Green Data Center Cooling
TRTL BOT Unveils KidSafe Case for iPhone 4 and 4S
Curtiss-Wright Controls Defense Solution Releases New D2D ATR 3U OpenVPX Chassis
Stulz Introduces CyberRow Data Center Cooling Solution
Abbott Technologies Offers New Sealed Power Supply
New Engineered Multi-Cavity Shielding Solution
Gore Enhances Product Performance with new of Screw-in Vents
Industry News
Calendar of Events

Electronics Protection - June/July 2012