Electronics Protection - September/October 2012 - (Page 22)

Thermal TECA Introduces 3,600 BTU, High Efficiency Thermoelectric Air Conditioners TECA Corp. has introduced the AHP-4250 family of thermoelectric air conditioners. The AHP-4250 family boasts a cooling capacity of 3,600 BTU/HR and features a “Green Zone” style that has efficiencies approaching 100 percent. Both styles come with TECA’s Eco-Mode temperature control design, which helps save energy by limiting the need for active cooling when it’s not necessary . The AHP-4252 (240 VAC) uses 94 percent less energy in the EcoMode mode than it does in the active-cooling mode. The Green Zone style AHP-4250 (120 VAC) consumes 36 percent less energy in the active cooling mode than the closest competing thermoelectric air conditioner. The Eco-Mode switches on as the enclosure temperature rises through 25°C and the need for cooling begins. The AHP-4250 series boasts a design that where the cold side (internal to enclosure) has a low profile, which translates into less intrusion into the enclosure. The hot side, or ambient (external to enclosure) fans, are more easily accessible for maintenance. Finally, high air-flow fans and high fin-density heat sinks on the cold side maximize performance and minimize condensation. An integral condensate removal system absorbs condensation and transports it to the hot side, where it gets evaporated into the ambient. All configurations include either a cool-only TC-4F or a heat/ cool TC-7F integral temperature controller. The Eco-Mode heat exchanger function is included in all configurations. The heat exchanger function will switch on (passive cooling) when the enclosure reaches 25°C. Active cooling switches on when the enclosure reaches 35°C. On heat/cool configurations, the TC-7F will switch on the heating function when the enclosure temperature drops to 10°C. temperature rise above ambient temperature. Options range from a maximum 14.7° C rise for a 4.5 watt power rating to a maximum 29.2° C rise for a 42.8 watt power rating. All models do not exceed a maximum LED substrate temperature of 75°C, and are available in multiple sizes, weights and thermal resistances. Heat sink lengths range from 2 inches (50.8 millimeters) to 10 inches (190.5 millimeters), with diameters of 1.26 inches (32 millimeters) to 4.51 inches (115 millimeters), while the heat sink weights range from 0.2 pounds (92 grams) to 2.64 pounds (1199 grams). Available powers include 42.8, 26.3, 9, 4.5 and 24 watts, with corresponding thermal resistances of 0.68, 1.15, 2.38, 3.27 and 1.15 C/W. Fujipoly Releases Highly Conformable Thermal Interface Material Fujipoly has introduced its Sarcon 25GR-T2d, a soft, conformable thermal interface medium that is suited for low and high-volume production applications. The reinforced 0.25 mm thick TIM also offers engineers a durable solution for tight tolerance die-cut operations. When placed between a heat source such as a semiconductor and a nearby heat sink, this Sarcon gap filler pad provides a thermal conductivity of 1.5 W/m°K and a thermal resistance as low as 0.33 °Cin2/W. Sarcon 25GR-T2d is recommended for applications with operational temperatures between -40°C and 150°C. Pre-cut sheets are available up to a maximum size of 200 mm by 400 mm. Nextreme Achieves 55°C Cooling Performance In Production Thin Film Thermoelectric Coolers Ohmite Manufacturing Releases Wakefield Solutions Radial-Fin Heat Sink Extrusions Ohmite Manufacturing has introduced the Wakefield Solutions’ 19000 series radial-fin heat sink extrusions for LED light engines. Developed in conjunction with an engineering team from a leading LED manufacturer, the 19000 series is designed to help LED engineers meet both space constraints and operating parameters. With a lightweight aluminum profile, the 19000 series offers added thermal performance that makes matching a heat sink to the right LED much less time-consuming. The extrusions are black anodized for added thermal performance and constructed with a radial fin geometry that is has been optimize for natural convection. Though 19000 series heat sinks are most commonly used in both recessed and externally mounted down lighting applications, they are equipped with extrusion profiles that suit a variety of LED configurations. Mounting features are in fact incorporated as part of the extrusion. Each extrusion profile has screw bosses located to enable easy LED substrate attachment, and provisions for slip-nut attachment make it easy to assemble the 19000 series heat sinks into diverse lighting fixtures. Wakefield offers five different models of the 19000 series, each designed for a different maximum power rating and expected 22 Nextreme Thermal Solutions has released thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. The 55°C temperature milestone reflects the ability of the thermoelectric device to pump heat efficiently. This level of performance translates to improved cooling efficiency, lower input power requirements and greater opportunities for solving thermal issues in electronics, photonics and avionic applications. The electronic industry’s continued trend of smaller form factors, greater circuit density and highly integrated packaging has translated into significant thermal problems for optoelectronics manufacturers. Bulk TEC devices have been used to provide temperature control of laser diodes and other optoelectronic devices, but have not kept pace with these new requirements due to their larger size and power density limitations. With Nextreme’s thin-film modules, manufacturers of laser diodes, photodiodes, infrared (IR) sensors and other semiconductor chips can now integrate cooling and temperature control functionality directly into the package during assembly. The Nextreme eTEC HV14 has a footprint of 3 mm². The thinfilm module can pump up to a maximum power density (Qmax/ area) of 120 W/cm² in comparison to less than 10 W/cm² for the bulk TEC. The response time of the eTEC HV14 is on the order of milliseconds compared to seconds for bulk devices. These devices are 0.6 mm high, making them thin with a high level of heat pumping ability. September/October 2012 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - September/October 2012

Electronics Protection - September/October 2012
Table of Contents
HP Intelligent Series Racks Offer Monitoring Capabilities for Data Centers
The Unknown Problem with Airtight Enclosures
Key Drivers When Turning to Captive Panel Screws
Emerging Trends in Field Equipment Enclosures
JV Industrial Solves Power Outage Issues with Battery-Free Flywheel
The Green Data Center Opportunity
The Power-Grid and Protecting Electronic Devices
Maximizing Availability, Capacity and Efficiency with Rising Data Center Temperatures
Canyonwest Cases Releases new Enclosures for Flat-Screen TV Transportation
Ohmite Manufacturing Releases Radial-Fin Heat Sink Extrusions
Rogers Introduces Condux Plus Conductive Foams
FIP Gasketing Resin Offers Advantages over Gasketing Materials
Minmax Power Releases MSGWI06 Series of DC/DC Power Modules
New E-Line Locking Systems Reduce Security Costs and Enhance Locking Solutions
Industry News
Calendar of Events

Electronics Protection - September/October 2012

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