Electronics Protection - November/December 2012 - (Page 20)
TECA Introduces 5,200 BTU/HR, High Efficiency Thermoelectric Air Conditioners
TECA Corp. has introduced the AHP-6200 family of thermoelectric air conditioners. The AHP-6200 provides cooling performance up to 5,200 BTU/hr in the 240 VAC configurations. This achievement in performance will allow broader use of thermoelectric air conditioners. The AHP-6200 air conditioners operate at high C.O.P. values, meeting TECA’s Green Zone standard of high energy-efficiency. The AHP-6200 air conditioners include TECA’s temperature control design with Eco-Mode, which helps save energy by limiting the need for active cooling when it’s not needed. The Eco-Mode design lowers total power consumption of the AHP-6200 by up to 75 percent. The Eco-Mode switches on passive cooling when the enclosure reaches 25°C. Active cooling begins when the enclosure reaches 35°C and on heat/cool configurations, active heating begins when the enclosure temperature drops to 10°C. The AHP-6200 air conditioners are designed with a low profile, which translates into more available enclosure space. The robust mounting flange, gasket and hardware and centrally located power input contribute to user-friendly installation. High air-flow fans and high fin-density heat sinks on the cold side maximize performance and minimize condensation. An integral condensate removal system absorbs condensation and transports it to the hot side, where it gets evaporated into the ambient. The AHP-6200 air conditioners are available with industrial grade or military grade sealed fans, depending on what is required by the end user’s environment. can be improved with the use of a primer, achieving average lap shear values of120 psi (0.8 MPa). EPM1-2493 does not have the typical paste-like consistency of other thermally conductive silicones. Rather, it is a pourable, conformal liquid that is well suited for potting/ filling recessed areas and applying to intricate geometries in electronic applications. It can also be used for adhering integrated circuit substrates, base plates or heat sinks or where grooves or other configurations require a limited flow material. For further ease of use, EPM1-2493 is supplied in a 1:1 mix ratio and can be loaded into syringes and dispensed as a one-part material for automated dispensing. This elastomer cures at lower temperature but can be heat-accelerated for faster cure time.
Silicone Compound Developed for Potting and Encapsulating Applications
Epoxies, Etc. has developed a high performance two part silicone system. The 50-1225 is designed for electronic packages that require good flow around components, high thermal conductivity, ability to sustain environmental extremes and cushioning for sensitive components. 50-1225 is free of any flammable or toxic solvents and will cure in deep sections. It has a service temperature of -65°C to 210°C, and will not support or promote a flame. The material is highly flexible with low shrinkage during curing so it’s less likely to stress components.
Closed Loop Wind Tunnel for High Temp Studies
New Versatile Low Hardness Sarcon Thin Film
Sarcon 30QR from Fujipoly is a low hardness thermal interface material that exhibits a thermal conductivity of 1.10 W/m°K and a thermal resistance of 0.57 °Cin2/W. This material is available in roll or sheet form and can easily be diecut, molded or extruded to accommodate your unique application specifications. The versatility of Sarcon 30QR is evident in its use as conductive insulator for semiconductors, compression joining material for thermistors and temperature sensors, as well as a gap filler material for all types of heaters. This is V-0 flame-retardant thin film is recommended for applications with operational temperatures that range from -60°C to 180°C.
Nusil Presents New Thermally Conductive Electronic Packaging Material
NuSil Technology LLC has release the EPM1-2493, a low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk. Offering bond lines as thin as 5 microns, EPM12493 can be used to adhere materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling. A low volatility elastomer, EPM1-2493 can reduce or even prevent contamination of electronic device components used in applications exposed to high heat, such as solder reflow at 260°C. EPM1-2493 adheres well to aluminum, and its adhesive strength
The CLWT-closed loop wind tunnel from Advanced Thermal Solutions provides an accurate system for thermally characterizing PCBs, heat sinks and components at controlled temperatures from ambient to 85°C. The CLWT-115 wind tunnel produces air flows up to 5 m/s (1,000 ft/min). Using optional orifice plates it can generate flows up to 50 m/s (10,000 ft/min). The instrument’s clear Lexan test section provides a continuous view of the test specimens, as well as flow visualization studies, e.g. using smoke or vapor. Unlike open loop wind tunnels, the CLWT-115 re-circulates internal air. This allows the system heater to quickly warm the air to a specific temperature. The testing of boards and components in hot air is a requirement in some NEBS and other standards. The precise controls and temperature range of the CLWT-115 wind tunnel allows its use for testing heat sink performance and for calibrating air and temperature sensors. The wind tunnel provides a test section measuring 77.6 by 26 by 11.6 cm. This chamber can be accessed from the top or sides for mounting and repositioning boards, components and sensors. Internal rail guides provide an easy system to install test specimens of different sizes (e.g., PCBs, heat sinks). Six instrument ports in the side walls of the test section are for temperature and velocity sensors such as thermocouples, Pitot tubes and hotwire anemometers.
November/December 2012 www.ElectronicsProtectionMagazine.com
Table of Contents for the Digital Edition of Electronics Protection - November/December 2012
Electronics Protection - November/December 2012
Buckeye Shapeform Provides Nuclear Lab New Case Options
Collaborative Design of Custom Enclosures - An Overview of the Process
Lowering Data Center Energy Bills: DCIM to the Rescue
What the New NFPA Workplace Electrical Safety Provisions Mean for Data Center Managers
Mitigating Risks Through Power Distribution Design
Don’t Call it a Box! Instrument Cases Can Combine Strength and Eye Appeal
L-com Adds New Sizes to Its Non-Powered Weatherproof Industrial Enclosures Line
Nusil Presents Thermally Conductive Electronic Packaging Material
Lapp’s Cable Glands Deliver EMI Protection and Simple Installation
New Surge Suppression Solution to Shield Electronics from Surge Energy Let-Through
Chatsworth Products Increases Surface Area on Cable Pathways by 400 Percent
Calendar of Events
Electronics Protection - November/December 2012